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1. 发明授权

US5052126A Vapor drier for semiconductor wafers and the like 失效
标题翻译：用于半导体晶片的蒸气干燥器等
公开(公告)号：US5052126A
公开(公告)日：1991-10-01
申请号：US541525
申请日：1990-06-21
申请人： Rolf Moe , Nathaniel F. Spieler , David J. Correia , James J. McMullen
发明人： Rolf Moe , Nathaniel F. Spieler , David J. Correia , James J. McMullen
IPC分类号： F26B21/14 , H01L21/00
CPC分类号： H01L21/67034 , F26B21/145
摘要： A drier for wafers or the like has a drier chamber shaped to receive the wafer, which is lowered into the open top of the drier chamber and withdrawn therefrom by a lifter, which may be motor actuated. Below the drier chamber is a heater chamber to vaporize alcohol or other liquid, which rises and condenses on the relatively cool wafer. A water jacket around the top of the drier chamber condenses vapor and thus reduces escape of vapor.
摘要翻译：用于晶片或类似物的干燥器具有成型为接收晶片的干燥室，其被降下到干燥器室的开口顶部并且由提升器从其中取出，该升降器可以是电动机致动的。在干燥室下方是用于蒸发酒精或其它液体的加热室，其在相对较冷的晶片上升高并冷凝。干燥器顶部周围的水套冷凝蒸汽，从而减少蒸气逸出。

2. 发明授权

US4898639A Wafer retention device 失效
标题翻译：晶圆保持装置
公开(公告)号：US4898639A
公开(公告)日：1990-02-06
申请号：US338056
申请日：1989-04-14
申请人： Rolf Moe , David J. Correia , Michael Downs
发明人： Rolf Moe , David J. Correia , Michael Downs
IPC分类号： H01L21/00 , H01L21/67
CPC分类号： H01L21/67028 , H01L21/67
摘要： A wafer retention arrangement is disclosed for use with wafer stripping machines and the like which include a housing and a turret rotatably coupled to the housing for rotation about a selected axis, the turret being formed with a plurality of pockets that are adapted to retain a wafer. The wafer retention arrangement for each pocket includes a plurality of clips disposed about the periphery of the pocket to support a retained wafer. A latching mechanism cooperates with the support means to hold the wafer within the pocket. The latching mechanism is pivotally mounted to the turret for rotation about an axis that is substantially parallel to the surface of a wafer held within its associated pocket. The pivot point about which the latch mechanism rotates is substantially adjacent the edge of the wafer but spaced apart from the wafer plane. The latch mechanism includes a cam follower portion for engaging the actuator, a wafer engaging portion for pressing against the side of a wafer carried by the associated pocket, and biasing means for urging the cam follower towards the engagement position. The clips and the latching mechanism cooperate to hold wafers of various sizes. An actuator mechanisms carried by the housing is arranged to independently pivot the latching arrangement from an engagement position suitable for contacting a wafer carried by its associated pocket to a disengaged position free from contacting the wafer.
摘要翻译：公开了一种与晶片剥离机等一起使用的晶片保持装置，其包括可旋转地联接到壳体的壳体和转台，用于围绕选定的轴线旋转，转塔形成有多个凹坑，其适于保持晶片。每个凹槽的晶片保持装置包括围绕凹槽的周边设置的多个夹子以支撑保留的晶片。闩锁机构与支撑装置配合以将晶片保持在口袋内。闩锁机构枢转地安装到转台，用于围绕基本上平行于保持在其相关联的口袋内的晶片的表面的轴线旋转。闩锁机构旋转的枢转点基本上与晶片的边缘相邻但与晶片平面间隔开。闩锁机构包括用于接合致动器的凸轮从动部分，用于压靠由相关联的凹部承载的晶片侧的晶片接合部分和用于将凸轮从动件朝向接合位置推压的偏压装置。夹子和闩锁机构协作以保持各种尺寸的晶片。由壳体承载的致动器机构被布置成独立地将闩锁装置从接合位置枢转，该接合位置适于将由其相关联的袋携带的晶片接触到脱离位置，而不与晶片接触。

3. 发明授权

US4850381A Machine for stripping wafers 失效
标题翻译：剥离晶片的机器
公开(公告)号：US4850381A
公开(公告)日：1989-07-25
申请号：US150669
申请日：1988-02-01
申请人： Rolf Moe , David J. Corriea , John E. Premeau
发明人： Rolf Moe , David J. Corriea , John E. Premeau
IPC分类号： G03F7/30 , H01L21/00 , H01L21/027 , H01L21/30 , H01L21/304 , H01L21/677
CPC分类号： H01L21/67057 , H01L21/67051 , H01L21/67778 , Y10S134/902
摘要： Apparatus for stripping photoresist and other coatings from integrated circuit wafers comprises a series of vertically positioned casings with rotary turrets within each casing each accommodating approximately 10 wafers. Wafers are received in conventional "boats", lifted one at a time and inserted in a pocket in the first turret. The turret indexes intermittently, immersing the wafer in solvent until it travels almost a full 360.degree.; the wafer is then lifted from the first turret and inserted in a second turret which immerses the wafer during another almost 360.degree. travel in additional solvent. Toward the end of travel in the second turret a spray nozzle strips all remaining photoresist from the wafer. The wafer is then lifted from the second turret and inserted in a first pocket, optionally containing alcohol. The wafer is then lifted from the first pocket and inserted in a third turret which immerses the wafer in de-ionized water, such water being sprayed on the wafer to rinse away all stripper and/or alcohol. Next the wafer is inserted in a second pocket where an air or nitrogen spray dries the wafer. The wafer is then deposited in a second boat.
摘要翻译：用于从集成电路晶片剥离光致抗蚀剂和其它涂层的装置包括一系列垂直定位的壳体，每个壳体内的旋转炮塔每个容纳约10个晶片。在传统的“船”中接收晶片，一次提起一个，并插入第一个转塔中的一个口袋。转盘间歇地指示，将晶片浸入溶剂中，直到其行进几乎全部360度; 然后将晶片从第一转台提升并插入第二转台中，将第二转台在另外的溶剂中在另外几乎360度的行程中浸没。在第二个转塔的行程结束时，一个喷嘴将晶片上残留的所有光致抗蚀剂剥去。然后将晶片从第二转台提升并插入第一袋中，任选地含有酒精。然后将晶片从第一凹部提起并插入第三转台，将晶片浸入去离子水中，将这种水喷洒在晶片上以冲洗所有汽提器和/或酒精。接下来，将晶片插入第二个袋中，其中空气或氮气喷雾干燥晶片。然后将晶片沉积在第二个舟皿中。

4. 发明授权

US4722355A Machine and method for stripping photoresist from wafers 失效
标题翻译：从晶片剥离光刻胶的机器和方法
公开(公告)号：US4722355A
公开(公告)日：1988-02-02
申请号：US766708
申请日：1985-08-19
申请人： Rolf Moe , David Correia
发明人： Rolf Moe , David Correia
IPC分类号： H01L21/306 , G03F7/30 , G03F7/42 , H01L21/00 , H01L21/027 , H01L21/30 , B08B3/08
CPC分类号： H01L21/67028 , G03F7/422 , Y10S134/902 , Y10S414/137
摘要： Photoresist baked upon integrated circuit wafers is mechanically stripped therefrom. Wafers are unloaded from boats at the top of an elevator within a vertical housing filled with stripper solution, then deposited on a conveyor and carried through a horizontal housing also filled with stripper. The wafers are sprayed by high pressure stripper pumped through a nozzle at the end of their horizontal travel. The wafers are then transferred to another housing where they are rinsed, dried and, optionally, reloaded.
摘要翻译：在集成电路晶片上进行光刻胶烘烤的机械剥离。晶片从电梯顶部的船上卸下，并装在带有汽提溶液的垂直外壳中，然后将其沉积在输送机上，并通过一个还装有汽提塔的水平壳体。在水平行进结束时，通过喷嘴泵送的高压剥离器喷射晶片。然后将晶片转移到另一个壳体，在那里将它们漂洗，干燥并任选地重新加载。

5. 发明授权

US4875824A Wafer transfer apparatus 失效
标题翻译：晶圆传送装置
公开(公告)号：US4875824A
公开(公告)日：1989-10-24
申请号：US150784
申请日：1988-02-01
申请人： Rolf Moe , David J. Corriea , John E. Premeau
发明人： Rolf Moe , David J. Corriea , John E. Premeau
IPC分类号： H01L21/687
CPC分类号： H01L21/68707 , Y10S414/141
摘要： Transfer mechanism to pick up an object such as a wafer used in the manufacture of semiconductor chips from one location, lift the object, transfer the same laterally, lower it and later deposit the same in another location. A horizontal feedscrew mounted in a stationary base controls horizontal reciprocation of a transverse housing. A vertical feedscrew mounted in the transverse housing controls vertical reciprocation of a second housing. Supported by the second housing are one or more lifts. Each lift has guide rods fixed relative to the second housing and a stop on its lower end. Parallel and adjacent the guide rods is a reciprocating rod carrying a gripper on its lower end. At the end of the vertical movement of the second housing the reciprocating rod moves the gripper away from the stop so that a wafer may rest on the guide rods. As the second housing moves up, the gripper clamps the wafer against the stop. Motors drive the feedscrews to lift the wafer, move it transversely and lower it. As it reaches the end of its lowering movement, the wafer is unclamped.
摘要翻译：用于从一个位置拾取诸如用于制造半导体芯片的晶片的物体的传送机构，提起物体，横向传送相同物体，然后将其降低并且稍后将其沉积在另一位置。安装在固定基座上的水平进给螺丝控制横向外壳的水平往复运动。安装在横向壳体中的垂直进给螺钉控制第二壳体的垂直往复运动。由第二壳体支撑的是一个或多个电梯。每个升降机具有相对于第二壳体固定的导杆和在其下端上的止动件。导向杆平行且相邻的是在其下端承载夹具的往复杆。在第二壳体的垂直运动结束时，往复杆将夹具远离止动件移动，使得晶片可以搁置在导杆上。当第二壳体向上移动时，夹持器将晶片夹紧在挡块上。电机驱动进给螺丝来提升晶片，横向移动并降低它。随着其下降运动的结束，晶片被松开。

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