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    • 8. 发明授权
    • Low-temperature silicon nitride deposition
    • 低温氮化硅沉积
    • US07125582B2
    • 2006-10-24
    • US10631627
    • 2003-07-30
    • Michael L. McSwineyMichael D. Goodner
    • Michael L. McSwineyMichael D. Goodner
    • C23C16/00
    • C23C16/345
    • A method including combining a silicon source precursor and a nitrogen source precursor at a temperature up to 550° C.; and forming a silicon nitride film. A system including a chamber; a silicon precursor source coupled to the chamber; a controller configured to control the introduction into the chamber of a silicon precursor from the silicon precursor source; and a memory coupled to the controller comprising a machine-readable medium having a machine-readable program embodied therein for directing operation of the system, the machine-readable program including instructions for controlling the second precursor source to introduce an effective amount of silicon precursor into the chamber at a temperature up to 550° C.
    • 一种方法,包括在高达550℃的温度下组合硅源前体和氮源前体; 并形成氮化硅膜。 包括室的系统 耦合到所述室的硅前体源; 控制器,被配置为控制从所述硅前体源引入所述室中的硅前体; 以及耦合到控制器的存储器,包括机器可读介质,其具有体现在其中的机器可读程序,用于引导系统的操作,该机器可读程序包括用于控制第二前驱源的指令,以将有效量的硅前体引入 该室温度高达550°C
    • 10. 发明授权
    • Methods of forming nickel silicide layers with low carbon content
    • 形成低碳含量的硅化镍层的方法
    • US07704858B2
    • 2010-04-27
    • US11731275
    • 2007-03-29
    • Michael L. McSwineyMatthew V. Metz
    • Michael L. McSwineyMatthew V. Metz
    • H01L21/322H01L21/44
    • C23C16/45534C23C16/18C23C16/45542H01L29/665H01L29/78
    • A method for forming a nickel silicide layer on a MOS device with a low carbon content comprises providing a substrate within an ALD reactor and performing an ALD process cycle to form a nickel layer on the substrate, wherein the ALD process cycle comprises pulsing a nickel precursor into the reactor, purging the reactor after the nickel precursor, pulsing a mixture of hydrogen and silane into the reactor, and purging the reactor after the hydrogen and silane pulse. The ALD process cycle can be repeated until the nickel layer reaches a desired thickness. The silane used in the ALD process functions as a getterer for the advantageous carbon, resulting in a nickel layer that has a low carbon content. The nickel layer may then be annealed to form a nickel silicide layer with a low carbon content.
    • 在具有低碳含量的MOS器件上形成硅化镍层的方法包括在ALD反应器内提供衬底并执行ALD工艺循环以在衬底上形成镍层,其中ALD工艺循环包括将镍前体 进入反应器,在镍前体之后吹扫反应器,将氢和硅烷的混合物脉冲进入反应器,并在氢和硅烷脉冲之后清洗反应器。 可以重复ALD工艺循环,直到镍层达到所需的厚度。 用于ALD工艺中的硅烷作为有利碳的吸收剂起作用,产生具有低碳含量的镍层。 然后镍层可以退火以形成具有低碳含量的硅化镍层。