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    • 8. 发明授权
    • Method for active wafer centering using a single sensor
    • 使用单个传感器的活动晶圆定心方法
    • US06760976B1
    • 2004-07-13
    • US10342550
    • 2003-01-15
    • Robert MartinsonDhairya ShrivastavaMatthew Weis
    • Robert MartinsonDhairya ShrivastavaMatthew Weis
    • G01D2100
    • H01L21/67265Y10S414/136
    • A method for a robotic semiconductor wafer processing system to correct for wafers that have become offset or off-center during wafer processing. This is accomplished by determining the amount of offset and re-centering the wafer during wafer transport to the next process station using a single station sensor to locate the wafer center point. Each single sensor located at each station activates when the wafer's edge traverses through the sensor's path. Directional coordinates for the measured designated points on the wafer's edge are calculated, and the intersection points of two circles, analytically derived from using the measured designated points as their centers, are determined. The intersection point closest to the true wafer center position represents the measured wafer's center point. This point is compared to the true wafer center position, and the wafer is then adjusted for this difference.
    • 一种用于在晶片处理期间校正已经变得偏移或偏心的晶片的机器人半导体晶片处理系统的方法。 这是通过使用单个站传感器来确定晶片传送到下一个处理站的晶片的偏移量并使其重新对中来实现的,以定位晶片中心点。 当晶片的边缘穿过传感器的路径时,位于每个站处的每个单个传感器激活。 计算晶圆边缘上测量的指定点的定向坐标,并且确定从使用测量的指定点作为其中心分析导出的两个圆的交点。 最接近真晶片中心位置的交点表示测得的晶片的中心点。 将该点与真实的晶片中心位置进行比较,然后调整晶片以实现该差异。