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1. 发明申请

US20100258173A1 POLISHING A THIN METALLIC SUBSTRATE FOR A SOLAR CELL 审中-公开
标题翻译：抛光太阳能电池的薄金属基板
公开(公告)号：US20100258173A1
公开(公告)日：2010-10-14
申请号：US12422620
申请日：2009-04-13
申请人： Joseph LAIA , Paul Shufflebotham , Daniel R. Juliano , Robert Martinson , Timothy Kueper
发明人： Joseph LAIA , Paul Shufflebotham , Daniel R. Juliano , Robert Martinson , Timothy Kueper
IPC分类号： H01L31/00 , B24B1/00 , H01L21/304
CPC分类号： H01L31/0392 , B24B7/13 , B24B37/042 , B24B37/105 , H01L31/0296 , H01L31/0322 , H01L31/03925 , H01L31/03928 , H01L31/206 , Y02E10/541 , Y02P70/521
摘要： A method for fabricating a solar cell. The method includes providing a thin metallic substrate in roll form. The method also includes applying an abrasive grit to a surface of the thin metallic substrate. The method includes mechanical-polishing the surface with the abrasive grit such that the surface is polished to remove at least one defect from the surface. Mechanical-polishing the surface of the thin metallic substrate is by a roll-to-roll polishing process of the surface of the thin metallic substrate. Moreover, the method includes depositing an absorber layer of the solar cell on the thin metallic substrate.
摘要翻译：一种制造太阳能电池的方法。该方法包括以卷形式提供薄金属基底。该方法还包括将磨料砂粒施加到薄金属基底的表面上。该方法包括用磨料砂砾机械抛光表面，使得表面被抛光以从表面去除至少一个缺陷。对薄金属基板的表面进行机械抛光是通过薄金属基板的表面的辊对辊抛光工艺。此外，该方法包括在薄金属基板上沉积太阳能电池的吸收层。

2. 发明申请

US20080242123A1 Socket for land grid array package 有权
标题翻译： Socket for Land Grid阵列封装
公开(公告)号：US20080242123A1
公开(公告)日：2008-10-02
申请号：US11729581
申请日：2007-03-29
申请人： Robert Martinson , Tieyu Zheng
发明人： Robert Martinson , Tieyu Zheng
IPC分类号： H01R12/00
CPC分类号： H01R13/2442 , H01R43/0249 , H01R43/0256
摘要： A land grid array socket and a microelectronic assembly including the socket. The socket comprises: a housing; an array of through-contacts on the housing; a solder ball standoff element on a PCB side of the housing; and a seating plane standoff element on a package side of the housing, the seating plane standoff element being aligned with the solder ball standoff element to form a loading force support element therewith.
摘要翻译：一种地面栅格阵列插座和一个包括插座的微电子组件。插座包括：壳体; 壳体上的一组通孔; 在壳体的PCB侧上的焊球支架元件; 以及在所述壳体的封装侧上的就座平面间隔元件，所述就座平面支座元件与所述焊球支座元件对齐以与其形成加载力支撑元件。

3. 发明授权

US06497734B1 Apparatus and method for enhanced degassing of semiconductor wafers for increased throughput 有权
标题翻译：用于增强半导体晶片脱气的装置和方法，以增加生产量
公开(公告)号：US06497734B1
公开(公告)日：2002-12-24
申请号：US10037026
申请日：2002-01-02
申请人： Kenneth K. Barber , Mark Fissel , Soo Yun Joh , Mukul Khosla , Karl B. Levy , Robert Martinson , Michael Meyers , Dhairya Shrivastava
发明人： Kenneth K. Barber , Mark Fissel , Soo Yun Joh , Mukul Khosla , Karl B. Levy , Robert Martinson , Michael Meyers , Dhairya Shrivastava
IPC分类号： H01L21324
CPC分类号： H01L21/67757 , H01L21/67017 , Y10S438/908 , Y10S438/909 , Y10T29/41
摘要： A multi-level shelf degas station relying on at least two heaters integrated within wafer holding shelves or slots, where the semiconductor wafers do not have direct contact with the heater shelves. The heaters provide conduction heating. In order to degas a wafer, the heater and wafer holder assembly is positioned in a sequential manner through each wafer slot to the next available slot. If a degassed wafer exists in the slot, a transfer chamber arm removes it. A loader arm then places a wafer in the available, empty slot and the stage is moved upwards to receive the wafer from the loader arm. The transfer chamber arm removes an individual wafer from the heater and wafer holder assembly allowing the removed wafer to be individually processed while the other wafers remain in the heater and wafer holder assembly. In some instances, a loader arm may also remove wafers. The remaining wafers in the heater and wafer holder assembly are subjected to further degas treatment while the wafer(s) removed by the transfer chamber arm are exposed to other process steps. Air-cooling chambers are employed to facilitate cooling the wafer slots for ease of removal and maintenance.
摘要翻译：依赖于集成在晶片保持架或狭槽内的至少两个加热器的多级货架脱气站，其中半导体晶片不与加热器搁架直接接触。加热器提供传导加热。为了使晶片脱气，加热器和晶片保持器组件以顺序的方式定位成通过每个晶片槽到下一个可用的槽。如果在槽中存在脱气的晶片，则传送室臂将其移除。然后，装载臂将晶片放置在可用的空槽中，并且台架向上移动以从装载臂接收晶片。传送室臂从加热器和晶片保持器组件移除单个晶片，允许将移除的晶片单独处理，而其它晶片保留在加热器和晶片保持器组件中。在一些情况下，装载臂也可以移除晶片。在加热器和晶片保持器组件中的剩余晶片经受进一步的脱气处理，同时通过转移室臂移除的晶片暴露于其它工艺步骤。采用空气冷却室以便于冷却晶片槽以便于去除和维护。

4. 发明申请

US20180219509A1 EASY TO INSTALL FLEXIBLE PHOTOVOLTAIC MODULES 审中-公开
公开(公告)号：US20180219509A1
公开(公告)日：2018-08-02
申请号：US15422355
申请日：2017-02-01
申请人： Robert Martinson , Cormac Wicklow , Jason Cheng , Arthur Cheung , Heinrich von Bunau , Darin S. Birtwhistle , Hyung Paek , Robert McClymond
发明人： Robert Martinson , Cormac Wicklow , Jason Cheng , Arthur Cheung , Heinrich von Bunau , Darin S. Birtwhistle , Hyung Paek , Robert McClymond
IPC分类号： H02S30/20 , H02S40/32 , H02S40/36 , H02S40/34 , H02S20/23
CPC分类号： H02S30/20 , H02S20/23 , H02S30/10 , H02S40/32 , H02S40/34 , H02S40/36 , Y02B10/12 , Y02B10/14
摘要： Disclosed are apparatuses and methods for an apparatus that has a flexible mounting substrate, one or more flexible photovoltaic modules attached to the flexible mounting substrate, one or more inverters attached to the flexible mounting substrate and electrically connected to the one or more flexible photovoltaic modules, a flexible electrical conduit electrically connected to the one or more inverters and to the one or more flexible photovoltaic modules, a plurality of mounting features, and a plurality of flexible connectors that extend between the flexible mounting substrate and one corresponding mounting feature, that is configured to be positioned above a structure and secured to the structure without penetrating roofing of the structure.

5. 发明授权

US09512516B1 Cooling water jet pack for high power rotary cathodes 有权
标题翻译：用于大功率旋转阴极的冷却水喷射包
公开(公告)号：US09512516B1
公开(公告)日：2016-12-06
申请号：US12888963
申请日：2010-09-23
申请人： Robert Martinson , Paul Shufflebotham , Kevin Lynch , Heinrich von Bunau , Deborah Sloan , Daniel R. Juliano
发明人： Robert Martinson , Paul Shufflebotham , Kevin Lynch , Heinrich von Bunau , Deborah Sloan , Daniel R. Juliano
IPC分类号： C23C14/34 , H01J37/34
CPC分类号： H01J37/3417 , C23C14/0057 , C23C14/3407 , C23C14/35 , H01J37/3405 , H01J37/3429 , H01J37/3435 , H01J37/345 , H01J37/3497 , H01J2237/002 , H01J2237/332
摘要： A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.
摘要翻译：包括圆柱形背衬管，设置在背衬管内的磁体组件和设置在背衬管内并适于运输冷却剂的导管的溅射靶组件。导管包括至少一个第一开口，其定位成将冷却剂沿着从管道朝向背衬管的内表面的大致圆周方向提供到磁体组件的前侧和背衬管的内表面之间的间隙体积中。

6. 发明授权

US09303316B1 Continuous web apparatus and method using an air to vacuum seal and accumulator 有权
标题翻译：使用空气至真空密封和蓄能器的连续纸幅设备和方法
公开(公告)号：US09303316B1
公开(公告)日：2016-04-05
申请号：US13006098
申请日：2011-01-13
申请人： Paul Shufflebotham , Robert Martinson , Heinrich von Bunau , Kevin Lynch , Mathew Sheffield
发明人： Paul Shufflebotham , Robert Martinson , Heinrich von Bunau , Kevin Lynch , Mathew Sheffield
IPC分类号： B05C11/00 , F26B25/00 , C23C14/56 , B05C15/00
CPC分类号： H01L31/1876 , B05C15/00 , C23C14/562 , C23C14/566 , C23C14/568 , F26B5/04 , F26B25/008 , H01L21/67742 , H01L21/67754 , H01L31/0322 , H01L31/0445 , H01L31/1884 , Y10S438/907
摘要： A deposition apparatus includes an input spool located in non-vacuum input module, at least one vacuum process module, an accumulator, and an air to vacuum sealing mechanism. The accumulator and the sealing mechanism are configured to continuously provide a web substrate from the input spool at atmosphere into the at least one process module at vacuum without stopping the web substrate.
摘要翻译：沉积设备包括位于非真空输入模块中的输入卷轴，至少一个真空处理模块，蓄能器和空气至真空密封机构。蓄能器和密封机构被构造成在大气压下连续地将输送卷筒从真空输送到至少一个处理模块中而不停止卷材基材。

7. 发明授权

US09255323B2 Sputtering target including a feature to reduce chalcogen build up and arcing on a backing tube 有权
标题翻译：溅射目标包括减少硫属元素在背衬管上积聚和起弧的特征
公开(公告)号：US09255323B2
公开(公告)日：2016-02-09
申请号：US13525593
申请日：2012-06-18
申请人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
发明人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
IPC分类号： C23C14/34 , H01J37/34 , H01L31/18 , H01L31/032 , C23C14/06
CPC分类号： C23C14/3407 , C23C14/0623 , H01J37/3414 , H01J37/3423 , H01L31/0322 , H01L31/18 , Y02E10/541 , Y02P70/521
摘要： A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.
摘要翻译：溅射靶具有具有两个边缘的圆柱形背衬管和包括位于两个端部之间的中间部分的侧壁。溅射材料在背衬管上。溅射材料不覆盖背衬管的至少一个端部。溅射靶还具有防止或减少未被溅射材料覆盖的背衬管的至少一个端部处的硫属元素累积和电弧中的至少一种的特征。

8. 发明申请

US20130337602A1 Sputtering Target Including a Feature to Reduce Chalcogen Build Up and Arcing on a Backing Tube 有权
标题翻译：包含特征的溅射目标，以减少硫属元素在支撑管上的积聚和电弧
公开(公告)号：US20130337602A1
公开(公告)日：2013-12-19
申请号：US13525593
申请日：2012-06-18
申请人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
发明人： Robert Martinson , Heinrich Von Bunau , Mark Campello , Ron Rulkens , Tom Heckel , Johannes Vlcek
IPC分类号： C23C14/14 , H01L31/18 , B05D1/32 , C23C14/02 , C23C14/34
CPC分类号： C23C14/3407 , C23C14/0623 , H01J37/3414 , H01J37/3423 , H01L31/0322 , H01L31/18 , Y02E10/541 , Y02P70/521
摘要： A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.
摘要翻译：溅射靶具有具有两个边缘的圆柱形背衬管和包括位于两个端部之间的中间部分的侧壁。溅射材料在背衬管上。溅射材料不覆盖背衬管的至少一个端部。溅射靶还具有防止或减少未被溅射材料覆盖的背衬管的至少一个端部处的硫属元素累积和电弧中的至少一种的特征。

9. 发明申请

US20050218035A1 Infrared transmissive integrated circuit socket cap 审中-公开
标题翻译：红外透射集成电路插座盖
公开(公告)号：US20050218035A1
公开(公告)日：2005-10-06
申请号：US10814528
申请日：2004-03-31
申请人： Tom Pearson , Robert Martinson , Terry Dishongh
发明人： Tom Pearson , Robert Martinson , Terry Dishongh
IPC分类号： H02H7/06 , H02P11/00 , H05K3/30 , H05K3/34
CPC分类号： H05K3/3494 , H05K3/303 , H05K2201/09127 , H05K2201/10325 , H05K2203/081 , H05K2203/082
摘要： A cap may be provided over the hinged cover of an integrated circuit socket to be surface mounted to a printed circuit board. The cap may protect the socket prior to the insertion of the integrated circuit. It may also facilitate the surface mounting of the socket to a printed circuit board. It may do so in at least two ways. The cap may facilitate convective heating by the provision of a series of openings in the cap. The cap may also be infrared transmissive so that infrared radiation from a surface mount oven passes through the cap to heat the socket. As a result, in some embodiments, better reflow is achieved and higher solder ball reliability may result.
摘要翻译：盖可以设置在集成电路插座的铰接盖上，以被表面安装到印刷电路板。在插入集成电路之前，盖可以保护插座。也可以方便将插座表面安装到印刷电路板上。它可能至少有两种方式。盖可以通过在盖中提供一系列开口来促进对流加热。盖也可以是红外透射的，使得来自表面安装的烘箱的红外辐射通过盖以加热插座。结果，在一些实施例中，实现更好的回流并且可能导致更高的焊球可靠性。

10. 发明申请

US20080264340A1 MOVING INTERLEAVED SPUTTER CHAMBER SHIELDS 审中-公开
标题翻译：移动交互式飞溅室
公开(公告)号：US20080264340A1
公开(公告)日：2008-10-30
申请号：US12169238
申请日：2008-07-08
申请人： Robert Martinson , Norman Bourdon , Kwok Fai Lai , Dhairya Shrivastava , Paul Shufflebothan
发明人： Robert Martinson , Norman Bourdon , Kwok Fai Lai , Dhairya Shrivastava , Paul Shufflebothan
IPC分类号： C23C16/00
CPC分类号： C23C14/564 , H01J37/32504 , H01J37/34 , H01J2237/026
摘要： A shielding system for a physical vapor deposition chamber having a sputter target above the pedestal. The shielding system comprises a pedestal shield attachable to the pedestal and movable therewith. The pedestal shield surrounds and extends outward from the pedestal toward the chamber side or lower walls. The system also comprises a sidewall shield adapted to extend substantially around and within the chamber sidewalls, and downward from an upper portion thereof. The sidewall shield has a lower end extending inward and disposed adjacent the pedestal shield upper portion when the pedestal is in the raised position. The pedestal shield and sidewall shield cooperate, when the pedestal is in the raised position, to prevent line-of-sight deposition transmission from the sputter target to the side and lower walls of the deposition chamber.
摘要翻译：一种用于物理气相沉积室的屏蔽系统，其具有在基座上方的溅射靶。屏蔽系统包括可附接到基座并与其移动的基座屏蔽。基座护罩围绕并从基座朝向室侧或下壁向外延伸。该系统还包括侧壁屏蔽件，其适于在腔室侧壁内部和内部延伸，并且从其上部向下延伸。侧壁屏蔽件具有向内延伸的下端，并且当基座处于升高位置时邻近基座屏蔽件上部设置。当基座处于升高位置时，基座屏蔽和侧壁屏蔽配合以防止从溅射靶到沉积室的侧壁和下壁的视线沉积传输。

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