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    • 5. 发明授权
    • Process for providing clean lift-off of sputtered thin film layers
    • 提供溅射薄膜层清洁剥离的工艺
    • US5705432A
    • 1998-01-06
    • US566197
    • 1995-12-01
    • Kusol LeeTom QuachDanny LiLiping D. HouSam ChungTom Y. Chi
    • Kusol LeeTom QuachDanny LiLiping D. HouSam ChungTom Y. Chi
    • H01L21/027H01L21/465
    • H01L21/0272Y10S438/951
    • A unique photoresist process is provided which achieves clean and complete lift-off of a thin film layer such as a sputtered thin film formed on a photoresist which is formed above a semiconductor substrate. The process of the present invention relies on a reentrant photoresist profile which breaks the continuity of the thin film layer. Accordingly, the process of the present invention ensures a clean lift-off. The desired photoresist profile which breaks the continuity of the thin film layer can be obtained by a typical photoresist process preceded by an oxidation process that takes place on the surface of the semiconductor substrate. The oxidation process provides a thin native oxide layer with thickness ranging from about 30 to 50 .ANG.. No extra processing steps involving dielectric film deposition and etch are required to achieve clean lift-off. Nevertheless, the process of the present invention ensures the clean lift-off of the thin film layer. Accordingly, the process of the present invention provides good visual and electrical yields.
    • 提供了一种独特的光刻胶工艺,其实现了清洁和完全剥离薄膜层,例如形成在半导体衬底上的光致抗蚀剂上形成的溅射薄膜。 本发明的方法依赖于破坏薄膜层的连续性的可重入光致抗蚀剂轮廓。 因此,本发明的方法确保了清洁的剥离。 可以通过在半导体衬底的表面上发生的氧化工艺之前的典型的光致抗蚀剂工艺来获得破坏薄膜层的连续性的期望的光致抗蚀剂轮廓。 氧化过程提供厚度范围为约30至50安培的薄的天然氧化物层。 不需要涉及介电膜沉积和蚀刻的额外处理步骤来实现干净的剥离。 然而,本发明的方法确保了薄膜层的清洁剥离。 因此,本发明的方法提供良好的视觉和电产量。