专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4826288A Method for fabricating optical fibers having cores with high rare earth content 失效
标题翻译：制造具有高稀土含量的核的光纤的方法
公开(公告)号：US4826288A
公开(公告)日：1989-05-02
申请号：US036505
申请日：1987-04-09
申请人： Robert J. Mansfield , Bill C. McCollum , Richard P. Tumminelli
发明人： Robert J. Mansfield , Bill C. McCollum , Richard P. Tumminelli
IPC分类号： G02B6/00 , C03B37/018 , C03C1/00 , C03C13/04 , G02B6/16
CPC分类号： C03C1/00 , C03B37/01807 , C03C13/045 , C03B2201/34 , C03B2201/36 , C03B2207/81 , C03B2207/90 , Y10S359/90
摘要： A chemical vapor deposition method which utilizes a rare earth chelate vapor as a source of rare earth ions for producing an optical fiber having a core with a high rare earth content.

2. 发明授权

US06770503B1 Integrated packaging of micromechanical sensors and associated control circuits 失效
标题翻译：微机械传感器和相关控制电路的集成封装
公开(公告)号：US06770503B1
公开(公告)日：2004-08-03
申请号：US09422682
申请日：1999-10-21
申请人： Thomas F. Marinis , Jerome B. Sohn , Richard P. Tumminelli
发明人： Thomas F. Marinis , Jerome B. Sohn , Richard P. Tumminelli
IPC分类号： H01L2100
CPC分类号： B81B7/0077 , G01P1/02 , G01P15/0802
摘要： A micromechanical sensor is fabricated on a semiconductor wafer, and a control circuit is fabricated on another semiconductor wafer. A cavity is etched on the back side of the control circuit wafer, the cavity being formed such that the sensor on the other wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes are etched through the back side of the control circuit wafer to allow access to electrical contact points, and a patterned layer of metal is deposited to form electrical interconnections between the electrical contact points and termination points on the back side of the wafer via the through-holes. The termination points are arranged such that electrical contacts of the sensor contact the termination points when the wafers are placed in the adjoining relationship. The wafers are then cleaned and bonded together in the adjoining relationship. In a typical process the wafers contain multiple sensors and control circuits, respectively, and thus the bonded wafers are diced to yield individual bonded sensor-circuit pairs. The bonded pairs are then packaged in an integrated-circuit package such as a leadless chip carrier in a known manner.
摘要翻译：在半导体晶片上制造微机械传感器，并且在另一个半导体晶片上制造控制电路。在控制电路晶片的背面上蚀刻空腔，形成空腔，使得当晶片以相邻的关系将晶片合在一起时，另一晶片上的传感器安装在空腔内。通过控制电路晶片的背侧蚀刻通孔以允许接触电接触点，并且沉积图案化的金属层以在电接触点和晶片背面上的端接点之间形成电互连通孔。终端点被布置成使得当晶片以相邻关系放置时，传感器的电触点与端接点接触。然后将晶片清洁并以相邻的关系粘合在一起。在典型的工艺中，晶片分别包含多个传感器和控制电路，因此将结合的晶片切割成单独的结合的传感器电路对。然后以已知的方式将键合对封装在诸如无引线芯片载体的集成电路封装中。

3. 发明授权

US5194079A Method of forming an optical channel waveguide by thermal diffusion 失效
标题翻译：通过热扩散形成光通道波导的方法
公开(公告)号：US5194079A
公开(公告)日：1993-03-16
申请号：US830932
申请日：1992-02-04
申请人： Richard P. Tumminelli , Farhad Hakimi , John R. Haavisto
发明人： Richard P. Tumminelli , Farhad Hakimi , John R. Haavisto
IPC分类号： C03C17/23 , C03C17/36 , C03C23/00 , G02B6/12 , G02B6/13
CPC分类号： C03C17/3607 , C03C17/23 , C03C17/36 , C03C17/3642 , C03C17/3657 , C03C23/0025 , C03C23/007 , G02B6/13 , C03C2217/213 , C03C2217/24 , C03C2217/734 , C03C2218/32 , G02B2006/12171
摘要： A method of forming an optical channel waveguide includes forming on a substrate a waveguide layer of silica doped with an index of refraction raising dopant whose concentration profile in a first dimension includes a higher concentration region and an adjacent lower concentration region; and heating the waveguide layer along two spaced areas defined in the second and third dimension which define a path between them for diffusing the dopant along the first dimension from the higher concentration region to the lower concentration region to reduce the index of refraction of the higher concentration region in portions of the higher concentration region proximate the spaced areas and create a waveguide along the path.
摘要翻译：一种形成光通道波导的方法包括在衬底上形成掺杂有折射率增加掺杂剂的掺杂剂的掺杂剂的掺杂剂的掺杂剂的掺杂剂，其中第一维度的浓度分布包括较高的浓度区域和相邻的较低浓度区域; 并且沿着限定在第二和第三维度上的两个间隔的区域加热波导层，其限定它们之间的路径，用于沿着第一维度将掺杂剂从较高浓度区域扩散到较低浓度区域，以降低较高浓度的折射率区域在较高浓度区域的靠近间隔区域的部分中，并沿着路径产生波导。

4. 发明授权

US5166940A Fiber laser and method of making same 失效
标题翻译：光纤激光器及其制作方法
公开(公告)号：US5166940A
公开(公告)日：1992-11-24
申请号：US710766
申请日：1991-06-04
申请人： Richard P. Tumminelli , Farhad Hakimi , Robert P. Dahlgren
发明人： Richard P. Tumminelli , Farhad Hakimi , Robert P. Dahlgren
IPC分类号： H01S3/067
CPC分类号： H01S3/0675
摘要： A fiber optic laser includes a fiber optic element, and a Bragg grating means in the fiber optic element and defined by a periodic variation in the index of refraction of the element to enhance the narrow band response of the laser and/or increase the loss of unwanted frequencies. A method of making the fiber laser is also disclosed.
摘要翻译：光纤激光器包括光纤元件和光纤元件中的布拉格光栅装置，并且由元件的折射率的周期性变化定义，以增强激光器的窄带响应和/或增加损耗不想要的频率。还公开了制造光纤激光器的方法。

5. 发明授权

US5121460A High-power mode-selective optical fiber laser 失效
标题翻译：大功率模式选择光纤激光器
公开(公告)号：US5121460A
公开(公告)日：1992-06-09
申请号：US648726
申请日：1991-01-31
申请人： Richard P. Tumminelli , Farhad Hakimi
发明人： Richard P. Tumminelli , Farhad Hakimi
IPC分类号： H01S3/067 , H01S3/08 , H01S3/094
CPC分类号： H01S3/06708 , H01S3/06729 , H01S3/0804 , H01S3/094003 , H01S3/094007
摘要： An optical fiber includes a multimode primary core having an index or refraction N.sub.1 and doped with a material providing optical gain; the cladding surrounding the core having an index of refraction N.sub.2 ; and a secondary core doped with an absorbent material for providing optical loss in unwanted modes.
摘要翻译：光纤包括具有折射率或折射率N1并掺杂有提供光学增益的材料的多模初级芯片; 围绕芯的包层具有折射率N 2; 以及掺杂有用于在不想要的模式中提供光学损耗的吸收材料的次级芯。

6. 发明申请

US20130121640A1 METHODS AND APPARATUS RELATED TO A SIDE-FIRE MEMBER HAVING A DOPED SILICA COMPONENT 有权
标题翻译：与具有二氧化硅组分的侧面成员相关的方法和装置
公开(公告)号：US20130121640A1
公开(公告)日：2013-05-16
申请号：US13718630
申请日：2012-12-18
申请人： Jeffrey W. Zerfas , Richard P. Tumminelli
发明人： Jeffrey W. Zerfas , Richard P. Tumminelli
IPC分类号： G02B6/26
CPC分类号： G02B6/262 , A61B1/0011 , A61B1/00137 , A61B1/0017 , A61B18/22 , A61B2018/2222 , A61B2018/2255 , A61B2018/2272 , A61B2018/2288 , C03B37/10 , G02B6/325 , G02B6/327 , G02B23/26
摘要： In one embodiment, an apparatus may include an optical fiber that may have a surface non-normal to a longitudinal axis of a distal end portion of the optical fiber. The surface may define a portion of an interface configured to redirect electromagnetic radiation propagated from within the optical fiber and incident on the interface to a direction offset from the longitudinal axis. The apparatus may also include a doped silica cap that may be fused to the optical fiber such that the surface of the optical fiber may be disposed within a cavity defined by the doped silica cap.
摘要翻译：在一个实施例中，装置可以包括可以具有与光纤的远端部分的纵向轴线不平行的表面的光纤。该表面可以限定接口的一部分，其被配置为重定向从光纤内传播的电磁辐射，并且入射到界面上至与纵向轴线偏移的方向。该装置还可以包括可以与光纤熔合的掺杂二氧化硅帽，使得光纤的表面可以设置在由掺杂的二氧化硅帽限定的空腔内。

7. 发明申请

US20110176770A1 METHOD AND APPARATUS RELATED TO A SIDE-FIRE MEMBER HAVING A DOPED SILICA COMPONENT 有权
标题翻译：与具有二氧化硅组分的侧面成员有关的方法和装置
公开(公告)号：US20110176770A1
公开(公告)日：2011-07-21
申请号：US12948138
申请日：2010-11-17
申请人： Jeffrey W. Zerfas , Richard P. Tumminelli
发明人： Jeffrey W. Zerfas , Richard P. Tumminelli
IPC分类号： G02B6/26
CPC分类号： G02B6/262 , A61B1/0011 , A61B1/00137 , A61B1/0017 , A61B18/22 , A61B2018/2222 , A61B2018/2255 , A61B2018/2272 , A61B2018/2288 , C03B37/10 , G02B6/325 , G02B6/327 , G02B23/26
摘要： In one embodiment, an apparatus may include an optical fiber that may have a surface non-normal to a longitudinal axis of a distal end portion of the optical fiber. The surface may define a portion of an interface configured to redirect electromagnetic radiation propagated from within the optical fiber and incident on the interface to a direction offset from the longitudinal axis. The apparatus may also include a doped silica cap that may be fused to the optical fiber such that the surface of the optical fiber may be disposed within a cavity defined by the doped silica cap.
摘要翻译：在一个实施例中，装置可以包括可以具有与光纤的远端部分的纵向轴线不平行的表面的光纤。该表面可以限定接口的一部分，其被配置为重定向从光纤内传播的电磁辐射，并且入射到界面上至与纵向轴线偏移的方向。该装置还可以包括可以与光纤熔合的掺杂二氧化硅帽，使得光纤的表面可以设置在由掺杂的二氧化硅帽限定的空腔内。

8. 发明授权

US4848998A Selective volitization method for preparing fiber optics 失效
标题翻译：选择性挥发法制备光纤
公开(公告)号：US4848998A
公开(公告)日：1989-07-18
申请号：US146378
申请日：1988-01-21
申请人： Elias Snitzer , Richard P. Tumminelli
发明人： Elias Snitzer , Richard P. Tumminelli
IPC分类号： G02B6/00 , C03B8/00 , C03B20/00 , C03B37/012 , C03B37/014 , C03B37/027 , C03C13/04
CPC分类号： C03C13/045 , C03B37/01211 , C03B37/027 , C03C13/046 , C03B2201/34 , C03B2201/36 , C03B2201/40 , C03B2201/50 , C03B2201/54
摘要： A method for fabricating optical fibers having a rare-earth doped core and a fused silica cladding includes inserting a rare-earth doped soft glass rod into a fused silica tube, the ratio of the outer diameter (OD) to the inner diameter (ID) of the fused silica tube being at least 2 and as large as 50; heating the rod and tube combination in a furnace to selectively volatilize volatile constituents of the soft glass rod which are responsible for the low softening point so that the final composition of the core consists predominantly of SiO.sub.2 and the desired dopants such as rare earths, alkaline earths or other low vapor pressure materials; and drawing the perform into an optical fiber.

9. 发明授权

US08419293B2 Methods and apparatus related to a launch connector portion of a ureteroscope laser-energy-delivery device 有权
标题翻译：与输尿管镜激光能量输送装置的发射连接器部分相关的方法和装置
公开(公告)号：US08419293B2
公开(公告)日：2013-04-16
申请号：US12340350
申请日：2008-12-19
申请人： Jeffrey W. Zerfas , Paul Jortberg , Richard P. Tumminelli
发明人： Jeffrey W. Zerfas , Paul Jortberg , Richard P. Tumminelli
IPC分类号： G02B6/36 , G02B6/02
CPC分类号： G02B6/262 , A61B18/24 , A61B2017/00477 , A61B2018/00494 , A61B2018/00505 , A61B2018/00982 , A61B2018/2222 , G02B6/036 , G02B6/3813 , G02B6/4203 , G02B6/4296 , G02B23/2423 , G02B23/26 , G02B2006/4297
摘要： In one embodiment, an apparatus includes an optical fiber made of a silica-based material. A proximal end portion of the optical fiber has an outer-layer portion. The proximal end portion can be included in at least a portion of a launch connector configured to receive electromagnetic radiation. The apparatus also includes a component that has a bore therethrough and can be made of a doped silica material. The bore can have an inner-layer portion heat-fused to the outer-layer portion of the optical fiber. The component can also have an index of refraction lower than an index of refraction associated with the outer-layer portion of the optical fiber.
摘要翻译：在一个实施例中，一种装置包括由二氧化硅基材料制成的光纤。光纤的近端部分具有外层部分。近端部分可以包括在被配置为接收电磁辐射的发射连接器的至少一部分中。该装置还包括具有穿过其中的孔并可由掺杂的二氧化硅材料制成的部件。孔可以具有热熔合到光纤的外层部分的内层部分。该组件还可以具有低于与光纤的外层部分相关联的折射率的折射率。

10. 发明授权

US06368886B1 Method of recovering encapsulated die 有权
标题翻译：回收封装模具的方法
公开(公告)号：US06368886B1
公开(公告)日：2002-04-09
申请号：US09663248
申请日：2000-09-15
申请人： Paul Van Broekhoven , Richard P. Tumminelli
发明人： Paul Van Broekhoven , Richard P. Tumminelli
IPC分类号： H01L2166
CPC分类号： H01L21/56 , H01L24/98 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A method of decapsulating a packaged die includes removing packaging material from the bottom section of a die-containing package to expose a die pan, removing the die pan, removing material between the die pan and the bottom surface of the die, using the bottom surface of the die to determine a grind plane substantially parallel to the top surface of the die, and removing packaging material from the top section of the die-containing package to form a top surface substantially planar to the grind plane, preferably intersecting the wire bonds on the face of the die.
摘要翻译：封装包装的模具的方法包括从包含模具的包装的底部部分去除包装材料，以露出模具盘，去除模具盘，使用底部表面去除模具盘和模具的底表面之间的材料以确定基本上平行于模具的顶表面的研磨平面，以及从包含模具的包装的顶部部分去除包装材料，以形成与研磨平面基本上平面的顶表面，优选地与所述研磨平面相交，死亡的脸。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式