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    • 5. 发明授权
    • Joining of thermoplastic substrates by microwaves
    • 通过微波连接热塑性基材
    • US5603795A
    • 1997-02-18
    • US299559
    • 1994-09-01
    • Felix L. PaulauskasThomas T. Meek
    • Felix L. PaulauskasThomas T. Meek
    • B29C65/14B29C65/36H05K3/28B32B31/28
    • H05K3/281B29C65/1425B29C65/1435B29C65/148B29C65/3644B29C66/1122B29C66/43B29C66/45B29C66/73921B29C66/81267B29C66/8322B29C65/3676B29C66/71B29C66/73941B29K2995/0027H05K2201/0129H05K2203/065H05K2203/102
    • A method for joining two or more items having surfaces of thermoplastic material includes the steps of depositing an electrically-conductive material upon the thermoplastic surface of at least one of the items, and then placing the other of the two items adjacent the one item so that the deposited material is in intimate contact with the surfaces of both the one and the other items. The deposited material and the thermoplastic surfaces contacted thereby are then exposed to microwave radiation so that the thermoplastic surfaces in contact with the deposited material melt, and then pressure is applied to the two items so that the melted thermoplastic surfaces fuse to one another. Upon discontinuance of the exposure to the microwave energy, and after permitting the thermoplastic surfaces to cool from the melted condition, the two items are joined together by the fused thermoplastic surfaces. The deposited material has a thickness which is preferably no greater than a skin depth, .delta..sub.s, which is related to the frequency of the microwave radiation and characteristics of the deposited material in accordance with an equation.
    • 用于连接具有热塑性材料表面的两个或多个物品的方法包括以下步骤:将导电材料沉积在至少一个物品的热塑性表面上,然后将两个物品中的另一个物品放置在一个物品之间,使得 沉积的材料与一个和另一个物品的表面紧密接触。 然后将沉积的材料和与其接触的热塑性表面暴露于微波辐射,使得与沉积材料接触的热塑性表面熔融,然后将压力施加到两个物品上,使得熔融的热塑性表面彼此熔合。 在中断暴露于微波能量之后,并且在允许热塑性表面从熔融状态冷却之后,两个物体通过熔融的热塑性表面连接在一起。 沉积材料的厚度优选不大于根据等式与微波辐射的频率和沉积材料的特性相关的趋肤深度δs。