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1. 发明授权

US08014113B2 Protection for proximity electronics against electrostatic discharge 有权
标题翻译：防止静电放电接近电子元件的保护
公开(公告)号：US08014113B2
公开(公告)日：2011-09-06
申请号：US12144142
申请日：2008-06-23
申请人： Robert J. Drost , Scott M. Fairbanks , Alex Chow
发明人： Robert J. Drost , Scott M. Fairbanks , Alex Chow
IPC分类号： H02H9/00 , H02H1/00 , H02H1/04 , H02H3/22 , H02H9/06
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/60 , H01L2225/06527 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad.
摘要翻译：保护接近通信系统免受静电放电（ESD）的系统。接近通信系统包括两个芯片，每个芯片在其表面上具有电焊盘的阵列并被薄的电介质层覆盖，使得当它们连接在一起时，在芯片之间形成电容耦合电路。在至少一个芯片中，附加的保护焊盘远离阵列形成，重保护电路与其连接。其表面通过其上的电介质表面暴露，使得当ESD侵蚀器接近时，放电发生到保护焊盘。

2. 发明申请

US20090315157A1 PROTECTION FOR PROXIMITY ELECTRONICS AGAINST ELECTROSTATIC DISCHARGE 有权
标题翻译：针对静电放电的接近电子保护
公开(公告)号：US20090315157A1
公开(公告)日：2009-12-24
申请号：US12144142
申请日：2008-06-23
申请人： Robert J. Drost , Scott M. Fairbanks , Alex Chow
发明人： Robert J. Drost , Scott M. Fairbanks , Alex Chow
IPC分类号： H01L23/62
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/60 , H01L2225/06527 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad.
摘要翻译：保护接近通信系统免受静电放电（ESD）的系统。接近通信系统包括两个芯片，每个芯片在其表面上具有电焊盘的阵列并被薄的电介质层覆盖，使得当它们连接在一起时，在芯片之间形成电容耦合电路。在至少一个芯片中，附加的保护焊盘远离阵列形成，重保护电路与其连接。其表面通过其上的电介质表面暴露，使得当ESD侵蚀器接近时，放电发生到保护焊盘。

3. 发明授权

US08918752B2 Determining alignment using a spatially varying charge distribution 有权
标题翻译：使用空间变化的电荷分布确定对准
公开(公告)号：US08918752B2
公开(公告)日：2014-12-23
申请号：US13326301
申请日：2011-12-14
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
IPC分类号： G06F17/50
CPC分类号： H01L23/585 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/72 , H01L25/0657 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16147 , H01L2224/292 , H01L2224/293 , H01L2224/32145 , H01L2224/83851 , H01L2225/06531 , H01L2225/06593 , H01L2924/014 , H01L2924/00014
摘要： A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要翻译：描述半导体管芯。该半导体管芯包括驱动器和电耦合到驱动器并且靠近半导体管芯的表面的空间对准换能器。驱动器在空间对准转换器中在至少一个方向上建立空间变化的电荷分布，从而有助于确定半导体管芯和另一个半导体管芯之间的多于一个方向上的空间对准。特别地，靠近另一个半导体管芯的表面的空间对准传感器可以检测与空间变化的电荷分布相关联的电场（或相关的静电电位）。该检测的电场可以允许确定半导体管芯的表面之间的垂直间隔和/或半导体管芯的角度对准。

4. 发明申请

US20130154608A1 DETERMINING ALIGNMENT USING A SPATIALLY VARYING CHARGE DISTRIBUTION 有权
标题翻译：使用空间变化的充电分配来确定对齐
公开(公告)号：US20130154608A1
公开(公告)日：2013-06-20
申请号：US13326301
申请日：2011-12-14
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Robert D. Hopkins , Ivan E. Sutherland
IPC分类号： G01N27/00 , H01L23/58
CPC分类号： H01L23/585 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/72 , H01L25/0657 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16147 , H01L2224/292 , H01L2224/293 , H01L2224/32145 , H01L2224/83851 , H01L2225/06531 , H01L2225/06593 , H01L2924/014 , H01L2924/00014
摘要： A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要翻译：描述半导体管芯。该半导体管芯包括驱动器和电耦合到驱动器并且靠近半导体管芯的表面的空间对准换能器。驱动器在空间对准转换器中在至少一个方向上建立空间变化的电荷分布，从而有助于确定半导体管芯和另一个半导体管芯之间的多于一个方向上的空间对准。特别地，靠近另一个半导体管芯的表面的空间对准传感器可以检测与空间变化的电荷分布相关联的电场（或相关的静电电位）。该检测的电场可以允许确定半导体管芯的表面之间的垂直间隔和/或半导体管芯的角度对准。

5. 发明授权

US08098079B2 Receive circuit for connectors with variable complex impedance 有权
标题翻译：具有可变复阻抗的连接器的接收电路
公开(公告)号：US08098079B2
公开(公告)日：2012-01-17
申请号：US12425871
申请日：2009-04-17
申请人： Robert J. Drost , Robert D. Hopkins , Alex Chow
发明人： Robert J. Drost , Robert D. Hopkins , Alex Chow
IPC分类号： H03K17/16
CPC分类号： H01L23/66 , H01L23/3171 , H01L23/48 , H01L23/5223 , H01L23/5225 , H01L23/552 , H01L23/585 , H01L23/60 , H01L23/642 , H01L23/645 , H01L23/647 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/72 , H01L24/90 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L27/0251 , H01L2223/6622 , H01L2223/6627 , H01L2223/6655 , H01L2224/02166 , H01L2224/0401 , H01L2224/05556 , H01L2224/05624 , H01L2224/13099 , H01L2224/95145 , H01L2225/06527 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/12032 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/19033 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19051 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/351 , H03H7/38 , H01L2924/00
摘要： Embodiments of a circuit for use with an inter-chip connection that has a variable complex impedance (which can be conductive, capacitive or both), a system that includes the circuit, and a communication technique are described. This inter-chip connection may be formed between a microspring or an anisotropic film and a metal connector on or proximate to a surface of a chip. Moreover, the circuit may mitigate signal distortion associated with the variable complex impedance. For example, the circuit may include an internal impedance that is electrically coupled in series with the metal connector, and that has an impedance which dominates the variable complex impedance over a range of operating frequencies. Separately or additionally, the circuit may be adapted to correct for the signal distortion.
摘要翻译：描述了具有可变复阻抗（其可以是导电，电容或两者）的具有片间连接的电路的实施例，包括该电路的系统以及通信技术。该芯片间连接可以形成在芯片表面上或其附近的微小弹簧或各向异性膜和金属连接器之间。此外，电路可以减轻与可变复阻抗相关联的信号失真。例如，电路可以包括与金属连接器串联电耦合的内部阻抗，并且具有在工作频率范围内支配可变复阻抗的阻抗。单独地或另外地，电路可以适于校正信号失真。

6. 发明授权

US08975752B2 Multiple access over proximity communication 有权
标题翻译：通过近距离通信多次访问
公开(公告)号：US08975752B2
公开(公告)日：2015-03-10
申请号：US11971492
申请日：2008-01-09
申请人： Alex Chow , R. David Hopkins , Robert J. Drost
发明人： Alex Chow , R. David Hopkins , Robert J. Drost
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L25/065 , H01L23/64 , H01L23/00 , H01L25/00 , H04B5/00
CPC分类号： H01L23/5227 , H01L23/48 , H01L23/642 , H01L23/645 , H01L24/06 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2223/6677 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/16 , H01L2225/06513 , H01L2225/06531 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01043 , H01L2924/01051 , H01L2924/01065 , H01L2924/01066 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/19015 , H01L2924/19041 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H04B5/0012 , H04B5/0031 , H04B5/0075 , H04B5/0081
摘要： A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
摘要翻译：一种多址接近通信系统，其中集成电路芯片上的电气元件将多个信号复用到另一芯片上的单个电接收元件。形成在一个芯片上并接收单独信号的多个焊盘可以电容耦合到另一个芯片上的一个大焊盘。一个芯片上的多个感应线圈可以磁耦合到另一个芯片上的一个大线圈，或者三个或更多个芯片上的感应线圈可用于发送或接收。复用可以基于时间，频率或代码。

7. 发明授权

US07994604B2 Using floating fill metal to reduce power use for proximity communication 有权
标题翻译：使用浮动填充金属来减少接近通信的电力
公开(公告)号：US07994604B2
公开(公告)日：2011-08-09
申请号：US12317606
申请日：2008-12-24
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Robert Proebsting , Arlene Proebsting, legal representative
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Robert Proebsting
IPC分类号： H01L23/52 , H01L23/538
CPC分类号： H01L23/48 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal.
摘要翻译：本发明的一个实施例提供一种有助于减少邻近通信所需的功率的系统。该系统包括具有使用接近通信传输信号的传输焊盘阵列的集成电路。填充金属层位于该传输焊盘阵列附近，其中填充金属层“浮动”（例如，未连接到任何信号）。离开这层填充金属浮动可以减少传输焊盘阵列的寄生电容，这可以减少传输信号所需的功率。

8. 发明申请

US20090279571A1 DIVERSITY PROXIMITY COMMUNICATION 有权
标题翻译：多样性接近通信
公开(公告)号：US20090279571A1
公开(公告)日：2009-11-12
申请号：US12115772
申请日：2008-05-06
申请人： Alex Chow , R. David Hopkins , Robert J. Drost
发明人： Alex Chow , R. David Hopkins , Robert J. Drost
IPC分类号： H04J1/00 , H04J15/00 , H04J13/00 , H04J3/00
CPC分类号： H04B5/0012 , H01L25/0657 , H01L2225/06513 , H01L2225/06531 , H01L2924/0002 , H04B7/04 , H01L2924/00
摘要： A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group.
摘要翻译：在两个并置芯片上形成的分集接近通信系统，一个具有发射元件的二维阵列，另一个具有接收元件的二维阵列。接收和发送元件不需要对齐，并且可以具有与四个接收元件的角重叠的一个发射元件的标称对准。元件可以是跨接口电容耦合的电焊盘。四个不同复用组的信号，例如时分复用，被提供给2x2阵列中的发射元件。来自2x2阵列中的四个接收元件的信号被放大，组合和解复用用于所选择的复用组。要组合的四个信号的增益被差分控制以增加信噪比。可以通过每个接收元件与所选多路复用组的发送元件之间的重叠来确定放大。

9. 发明申请

US20090205850A1 Steering fabric that facilitates reducing power use for proximity communication 有权
标题翻译：有助于减少接近通讯用电的转向结构
公开(公告)号：US20090205850A1
公开(公告)日：2009-08-20
申请号：US12317659
申请日：2008-12-24
申请人： Alex Chow , Robert J. Drost , Ronald Ho , Arlene Proebsting , Robert Proebsting
发明人： Alex Chow , Robert J. Drost , Ronald Ho , Arlene Proebsting , Robert Proebsting
IPC分类号： H01B5/00
CPC分类号： H01L23/48 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit signals using proximity communication. This array is comprised of a set of macropads, where each given macropad is comprised of a set of micropads that can be configured to transmit a signal. A steering fabric routes signals to and within macropads, such that a subset of the micropads in the array can be configured to transmit the signal to a receiving component. Each macropad receives a limited number of input signals, with the steering fabric routing input signals to the micropads of the macropads. By limiting the number of input signals that are routed to the micropads of the macropads, the steering fabric eliminates redundant steering configurations for the array and reduces the power needed to transmit the signal.
摘要翻译：本发明的一个实施例提供一种有助于减少邻近通信所需的功率的系统。该系统包括具有使用接近通信传输信号的传输焊盘阵列的集成电路。该阵列由一组宏阵列组成，其中每个给定的宏阵列由可配置为传输信号的一组微阵列组成。转向结构将信号路由到宏阵列内并在宏阵中传送，使得阵列中的微阵列的子集可被配置为将信号发送到接收组件。每个macropad都接收到有限数量的输入信号，其中转向结构将输入信号输入到macropads的微型麦克风。通过限制输入信号的数量，路由到巨型阵列的微阵列，转向结构消除了阵列的冗余转向配置，并减少传输信号所需的功率。

10. 发明授权

US08798530B2 Adaptive offset-compensating decision-feedback receiver 有权
标题翻译：自适应偏移补偿判决反馈接收机
公开(公告)号：US08798530B2
公开(公告)日：2014-08-05
申请号：US12494492
申请日：2009-06-30
申请人： Alex Chow , Robert J. Drost , Robert David Hopkins
发明人： Alex Chow , Robert J. Drost , Robert David Hopkins
IPC分类号： H04B5/00
CPC分类号： H04L25/03063 , H04L25/0268
摘要： A circuit that receives input signals from a transmitter via proximity communication, such as capacitively coupled proximity communication, is described. Because proximity communication may block DC content, the circuit may restore the DC content of input signals. In particular, a refresh circuit in the circuit may short inputs of the circuit to each other at least once per clock cycle (which sets a null value). Furthermore, a feedback circuit ensures that, if there is a signal transition in the input signals during a current clock cycle, it is passed through to an output node of the circuit. On the other hand, if there is no signal transition in the input signals during the current clock cycle, the feedback circuit may select the appropriate output value on the output node based on the output value during the immediately preceding clock cycle.
摘要翻译：描述了通过诸如电容耦合邻近通信之类的接近通信从发射机接收输入信号的电路。因为邻近通信可能会阻塞直流内容，所以电路可以恢复输入信号的直流内容。特别地，电路中的刷新电路可以使每个时钟周期至少一次将电路的输入短路（其设定为空值）。此外，反馈电路确保，如果在当前时钟周期期间在输入信号中存在信号转换，则其被传递到电路的输出节点。另一方面，如果在当前时钟周期期间输入信号中没有信号转换，则反馈电路可以基于在紧接的前一时钟周期期间的输出值在输出节点上选择适当的输出值。

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