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1. 发明授权

US5486234A Removal of field and embedded metal by spin spray etching 失效
标题翻译：通过旋转喷涂蚀刻去除场和嵌入金属
公开(公告)号：US5486234A
公开(公告)日：1996-01-23
申请号：US375054
申请日：1995-01-19
申请人： Robert J. Contolini , Steven T. Mayer , Lisa A. Tarte
发明人： Robert J. Contolini , Steven T. Mayer , Lisa A. Tarte
IPC分类号： H01L21/3213 , H01L21/768 , H01L21/00
CPC分类号： H01L21/76838 , H01L21/32134
摘要： A process of removing both the field metal, such as copper, and a metal, such as copper, embedded into a dielectric or substrate at substantially the same rate by dripping or spraying a suitable metal etchant onto a spinning wafer to etch the metal evenly on the entire surface of the wafer. By this process the field metal is etched away completely while etching of the metal inside patterned features in the dielectric at the same or a lesser rate. This process is dependent on the type of chemical etchant used, the concentration and the temperature of the solution, and also the rate of spin speed of the wafer during the etching. The process substantially reduces the metal removal time compared to mechanical polishing, for example, and can be carried out using significantly less expensive equipment.
摘要翻译：通过将合适的金属蚀刻剂滴落或喷涂到旋转的晶片上以均匀地蚀刻金属，以基本上相同的速率将现场金属（例如铜）和金属（例如铜）两者嵌入电介质或基底中的步骤晶片的整个表面。通过该处理，在以相同或较小的速率蚀刻电介质中的图案化特征内的金属的同时蚀刻完全场地金属。该过程取决于所使用的化学蚀刻剂的类型，溶液的浓度和温度，以及蚀刻期间晶片的旋转速度。例如，与机械抛光相比，该方法显着降低了金属去除时间，并且可以使用显着更便宜的设备进行。

2. 发明授权

US6051493A Process for protecting bonded components from plating shorts 失效
标题翻译：保护接合部件免受镀层短路的工艺
公开(公告)号：US6051493A
公开(公告)日：2000-04-18
申请号：US323410
申请日：1994-10-14
申请人： Lisa A. Tarte , Wayne L. Bonde , Paul G. Carey , Robert J. Contolini , Anthony M. McCarthy
发明人： Lisa A. Tarte , Wayne L. Bonde , Paul G. Carey , Robert J. Contolini , Anthony M. McCarthy
IPC分类号： H01L21/60 , H01L21/44
CPC分类号： H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14
摘要： A method which protects the region between a component and the substrate onto which the components is bonded using an electrically insulating fillet of photoresist. The fillet protects the regions from subsequent plating with metal and therefore shorting the plated conductors which run down the sides of the component and onto the substrate.
摘要翻译：使用光刻胶的电绝缘圆角来保护组件与组件与基板之间的区域的方法。圆角保护区域免受金属的后续镀覆，从而使从元器件的侧面向下延伸到衬底上的电镀导体短路。

3. 发明授权

US06082140A Fusion bonding and alignment fixture 失效
标题翻译：熔接和对准夹具
公开(公告)号：US06082140A
公开(公告)日：2000-07-04
申请号：US334438
申请日：1999-06-16
申请人： Harold D. Ackler , Stefan P. Swierkowski , Lisa A. Tarte , Randall K. Hicks
发明人： Harold D. Ackler , Stefan P. Swierkowski , Lisa A. Tarte , Randall K. Hicks
IPC分类号： C03B23/203 , C03B23/20
CPC分类号： C03B23/203 , Y02P40/57 , Y10S425/06
摘要： An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all the components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.
摘要翻译：改进的真空熔接结合结构和用于对准结合大面积玻璃板的方法，用微通道和进入孔和狭槽进行图案化，以提高玻璃熔融温度。所有组件的真空泵送通过底部平台，其产生未触动的，无缺陷的顶部表面，其大大改善通过该光滑表面的光学接近。此外，具有对准和定位特征的完全非粘附的中间层（例如石墨）位于主钢平台和玻璃板对之间，这大大提高了质量，产量和易用性，并且使得能够对准非常大的玻璃结构。

4. 发明授权

US06205819B1 Method for vacuum fusion bonding 失效
标题翻译：真空熔接方法
公开(公告)号：US06205819B1
公开(公告)日：2001-03-27
申请号：US09546816
申请日：2000-04-11
申请人： Harold D. Ackler , Stefan P. Swierkowski , Lisa A. Tarte , Randall K. Hicks
发明人： Harold D. Ackler , Stefan P. Swierkowski , Lisa A. Tarte , Randall K. Hicks
IPC分类号： C03B2320
CPC分类号： C03B23/203 , Y02P40/57
摘要： An improved vacuum fusion bonding structure and process for aligned bonding of large area glass plates, patterned with microchannels and access holes and slots, for elevated glass fusion temperatures. Vacuum pumpout of all components is through the bottom platform which yields an untouched, defect free top surface which greatly improves optical access through this smooth surface. Also, a completely non-adherent interlayer, such as graphite, with alignment and location features is located between the main steel platform and the glass plate pair, which makes large improvements in quality, yield, and ease of use, and enables aligned bonding of very large glass structures.
摘要翻译：改进的真空熔接结合结构和用于对准结合大面积玻璃板的方法，用微通道和进入孔和狭槽进行图案化，以提高玻璃熔融温度。所有部件的真空泵送通过底部平台，其产生未触动的，无缺陷的顶部表面，其极大地改善通过该光滑表面的光学接近。此外，具有对准和定位特征的完全非粘附的中间层（例如石墨）位于主钢平台和玻璃板对之间，这大大提高了质量，产量和易用性，并且使得能够对准非常大的玻璃结构。

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