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1. 发明授权

US5099311A Microchannel heat sink assembly 失效
标题翻译：微通道散热器组件
公开(公告)号：US5099311A
公开(公告)日：1992-03-24
申请号：US642736
申请日：1991-01-17
申请人： Wayne L. Bonde , Robert J. Contolini
发明人： Wayne L. Bonde , Robert J. Contolini
IPC分类号： F28D9/00 , H01L23/34 , H01L23/44 , H01L23/473
CPC分类号： F28F3/12 , H01L23/345 , H01L23/445 , H01L23/473 , F28F2260/02 , H01L2924/0002
摘要： The present invention provides a microchannel heat sink with a thermal range from cryogenic temperatures to several hundred degrees centigrade. The heat sink can be used with a variety of fluids, such as cryogenic or corrosive fluids, and can be operated at a high pressure. The heat sink comprises a microchannel layer preferably formed of silicon, and a manifold layer preferably formed of glass. The manifold layer comprises an inlet groove and outlet groove which define an inlet manifold and an outlet manifold. The inlet manifold delivers coolant to the inlet section of the microchannels, and the outlet manifold receives coolant from the outlet section of the microchannels. In one embodiment, the manifold layer comprises an inlet hole extending through the manifold layer to the inlet manifold, and an outlet hole extending through the manifold layer to the outlet manifold. Coolant is supplied to the heat sink through a conduit assembly connected to the heat sink. A resilient seal, such as a gasket or an O-ring, is disposed between the conduit and the hole in the heat sink in order to provide a watetight seal. In other embodiments, the conduit assembly may comprise a metal tube which is connected to the heat sink by a soft solder. In still other embodiments, the heat sink may comprise inlet and outlet nipples. The present invention has application in supercomputers, integrated circuits and other electronic devices, and is suitable for cooling materials to superconducting temperatures.
摘要翻译：本发明提供了一种从低温到几百摄氏度的热范围的微通道散热器。散热器可用于各种流体，如低温或腐蚀性流体，并可在高压下运行。散热器包括优选由硅形成的微通道层和优选由玻璃形成的歧管层。歧管层包括限定入口歧管和出口歧管的入口槽和出口槽。入口歧管将冷却剂输送到微通道的入口部分，并且出口歧管从微通道的出口部分接收冷却剂。在一个实施例中，歧管层包括延伸穿过歧管层到入口歧管的入口孔，以及延伸穿过歧管层到出口歧管的出口孔。冷却液通过连接到散热器的导管组件提供给散热器。诸如垫圈或O形环的弹性密封件设置在导管和散热器中的孔之间，以提供密封。在其他实施例中，导管组件可以包括通过软焊料连接到散热器的金属管。在其它实施例中，散热器可以包括入口和出口接头。本发明适用于超级计算机，集成电路和其他电子设备，适用于超导温度下的冷却材料。

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