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1. 发明申请

US20170367172A1 Modular Deformable Platform 审中-公开
公开(公告)号：US20170367172A1
公开(公告)日：2017-12-21
申请号：US15535293
申请日：2015-12-14
申请人： Seow Yuen YEE , Gary YAMA , Bongsang KIM , Ashwin SAMARAO , Robert Bosch GmbH
发明人： Seow Yuen Yee , Gary Yama , Bongsang Kim , Ashwin Samarao
IPC分类号： H05K1/02 , A61B5/11 , A61B5/00 , A61B5/01 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/28 , H05K3/30 , H05K1/03 , H05K1/11 , H05K3/12
CPC分类号： H05K1/028 , A61B5/0022 , A61B5/01 , A61B5/11 , A61B5/4519 , A61B5/4528 , A61B5/4542 , A61B5/6833 , A61B2560/0242 , A61B2560/0412 , A61B2562/0204 , A61B2562/0247 , A61B2562/0271 , A61B2562/028 , A61B2562/029 , A61B2562/066 , A61B2562/12 , A61B2562/164 , H01L2924/0002 , H05K1/0278 , H05K1/0281 , H05K1/0393 , H05K1/118 , H05K1/148 , H05K1/189 , H05K3/005 , H05K3/0052 , H05K3/0058 , H05K3/0097 , H05K3/1216 , H05K3/281 , H05K3/285 , H05K3/30 , H05K2201/053 , H05K2201/09063 , H05K2201/10037 , H05K2201/10121 , H05K2201/10151 , H05K2203/1453 , H05K2203/1545 , H01L2924/0001
摘要： A modular deformable electronics platform is attachable to a deformable surface, such as skin. The platform is tolerant to surface deformation and motion, can flex in and out of a plane of the platform without hindering operability of electrical components included on the platform, and is formed via arrangement of discrete flexible tiles, with corners of adjacent tiles connected by a flexible connection material so that individual tiles can translate and rotate relative to each other. Interconnects disposed on bases of separate tiles electrically connect adjacent tiles via their connected corners, and electrically connect components disposed on different tiles. Each pair of adjacent corner connections defines an axis about which at least a portion of the platform can flex without deformation and without hindering connections between tiles. The flexible material and/or bases of the tiles can include Parylene.

2. 发明授权

US09423303B2 MEMS infrared sensor including a plasmonic lens 有权
标题翻译： MEMS红外传感器包括等离子体透镜
公开(公告)号：US09423303B2
公开(公告)日：2016-08-23
申请号：US14136808
申请日：2013-12-20
申请人： Robert Bosch GmbH
发明人： Ashwin Samarao , Gary O'Brien , Ando Feyh , Gary Yama , Fabian Purkl
IPC分类号： G01J5/02 , G01J5/10 , G01J5/20 , G01J5/04 , G01J5/08
CPC分类号： G01J5/024 , G01J5/045 , G01J5/0815 , G01J5/0837 , G01J5/0856 , G01J5/10 , G01J5/20
摘要： A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.
摘要翻译：便携式热成像系统包括被配置为由用户携带的便携式外壳，由壳体支撑的测辐射热计传感器组件，并且包括热传感器元件阵列和至少一个等离子体激元透镜，包括程序指令的存储器和可操作地处理的处理器连接到存储器和传感器，并且被配置为执行程序指令以从热传感器元件阵列的所选择的一组热传感器元件中的每一个获得信号，将获得的每个信号分配给与感测对象的温度，并呈现彩色数据。

3. 发明申请

US20140294043A1 MEMS INFRARED SENSOR INCLUDING A PLASMONIC LENS 有权
标题翻译： MEMS红外传感器，包括一个等离子体镜头
公开(公告)号：US20140294043A1
公开(公告)日：2014-10-02
申请号：US14136808
申请日：2013-12-20
申请人： Robert Bosch GmbH
发明人： Ashwin Samarao , Gary O'Brien , Ando Feyh , Gary Yama , Fabian Purkl
IPC分类号： G01J5/60
CPC分类号： G01J5/024 , G01J5/045 , G01J5/0815 , G01J5/0837 , G01J5/0856 , G01J5/10 , G01J5/20
摘要： A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.
摘要翻译：便携式热成像系统包括被配置为由用户承载的便携式外壳，由壳体支撑的测辐射热计传感器组件，并且包括热传感器元件阵列和至少一个等离子体激元透镜，包括程序指令的存储器和可操作地处理的处理器连接到存储器和传感器，并且被配置为执行程序指令以从热传感器元件阵列的所选择的一组热传感器元件中的每一个获得信号，将获得的每个信号分配给与感测对象的温度，并呈现彩色数据。

4. 发明申请

US20140054740A1 CMOS BOLOMETER 有权
公开(公告)号：US20140054740A1
公开(公告)日：2014-02-27
申请号：US13969828
申请日：2013-08-19
申请人： Robert Bosch GmbH
发明人： Gary Yama , Ando Feyh , Ashwin Samarao , Fabian Purkl , Gary O'Brien
IPC分类号： H01L31/02
CPC分类号： H01L31/02019 , G01J5/023 , G01J5/0235 , G01J5/024 , G01J5/20 , G01J2005/204 , H01L27/1446
摘要： A method of manufacturing a semiconductor device includes forming at least one sacrificial layer on a substrate during a complementary metal-oxide-semiconductor (CMOS) process. An absorber layer is deposited on top of the at least one sacrificial layer. A portion of the at least one sacrificial layer beneath the absorber layer is removed to form a gap over which a portion of the absorber layer is suspended. The sacrificial layer can be an oxide of the CMOS process with the oxide being removed to form the gap using a selective hydrofluoric acid vapor dry etch release process. The sacrificial layer can also be a polymer layer with the polymer layer being removed to form the gap using an O2 plasma etching process.
摘要翻译：制造半导体器件的方法包括在互补金属氧化物半导体（CMOS）工艺期间在衬底上形成至少一个牺牲层。在所述至少一个牺牲层的顶部上沉积吸收层。吸收层下面的至少一个牺牲层的一部分被去除以形成一个间隙，吸收层的一部分悬挂在该间隙上。牺牲层可以是CMOS工艺的氧化物，其中使用选择性氢氟酸蒸气干蚀刻释放工艺除去氧化物以形成间隙。牺牲层也可以是聚合物层，其中除去聚合物层以使用O 2等离子体蚀刻工艺形成间隙。

5. 发明申请

US20180069166A1 Tunable Lithium Niobate Resonators and Filters Via Lithiation and Delithiation 审中-公开
公开(公告)号：US20180069166A1
公开(公告)日：2018-03-08
申请号：US15258712
申请日：2016-09-07
申请人： Robert Bosch GmbH
发明人： Ashwin Samarao
IPC分类号： H01L41/04 , H03H9/25 , H03H9/64 , H01L41/047 , H01L41/29 , H01L41/25
CPC分类号： H03H9/64 , H03H9/02559 , H03H9/02574 , H03H9/0296 , H03H9/25
摘要： A surface acoustic wave (SAW) device includes a silicon substrate, a piezoelectric substrate formed of lithium niobate, an alumina layer interposed between the silicon substrate and the piezoelectric substrate, and at least one electrode on the piezoelectric substrate.

6. 发明授权

US09511998B2 MEMS device having a getter 有权
标题翻译：具有吸气剂的MEMS装置
公开(公告)号：US09511998B2
公开(公告)日：2016-12-06
申请号：US14207752
申请日：2014-03-13
申请人： Robert Bosch GmbH
发明人： Ashwin Samarao , Gary O'Brien , Ando Feyh , Gary Yama , Andrew Graham , Bongsang Kim , Fabian Purkl
IPC分类号： H01L21/322 , B81C1/00 , H01L23/28
CPC分类号： B81C1/00285 , B81C2201/0115 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , H01L21/3223 , H01L21/3225 , H01L23/28
摘要： A microelectromechanical system (MEMS) device includes a high density getter. The high density getter includes a silicon surface area formed by porosification or by the formation of trenches within a sealed cavity of the device. The silicon surface area includes a deposition of titanium or other gettering material to reduce the amount of gas present in the sealed chamber such that a low pressure chamber is formed. The high density getter is used in bolometers and gyroscopes but is not limited to those devices.
摘要翻译：微机电系统（MEMS）装置包括高密度吸气剂。高密度吸气剂包括通过孔化形成的硅表面积或通过在该装置的密封腔内形成沟槽。硅表面积包括钛或其它吸气材料的沉积物，以减少密封室中存在的气体的量，从而形成低压室。高密度吸气剂用于测辐射仪和陀螺仪，但不限于这些设备。

7. 发明授权

US10175188B2 Trench based capacitive humidity sensor 有权
公开(公告)号：US10175188B2
公开(公告)日：2019-01-08
申请号：US13832904
申请日：2013-03-15
申请人： Robert Bosch GmbH
发明人： Gary O'Brien , Ando Feyh , Andrew Graham , Ashwin Samarao , Gary Yama
IPC分类号： G01N27/22 , B81B7/00
摘要： A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially (e.g., sidewall coverage) or completely with polyimide (Pl) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.

8. 发明申请

US20170314995A1 METHOD TO MODULATE THE SENSITIVITY OF A BOLOMETER VIA NEGATIVE INTERFERENCE 有权
公开(公告)号：US20170314995A1
公开(公告)日：2017-11-02
申请号：US15516821
申请日：2015-10-09
申请人： Thomas ROCZNIK , Fabian PURKL , Gary O'BRIEN , Ando FEYH , Bongsang KIM , Ashwin SAMARAO , Gary YAMA , Robert Bosch GmbH
发明人： Thomas Rocznik , Fabian Purkl , Gary O'Brien , Ando Feyh , Bongsang Kim , Ashwin Samarao , Gary Yama
IPC分类号： G01J5/06 , G01J5/08 , G01J5/24
CPC分类号： G01J5/06 , G01J5/0809 , G01J5/0853 , G01J5/20 , G01J5/24 , G01J2005/066 , G01J2005/067
摘要： A semiconductor sensor system, in particular a bolometer, includes a substrate, an electrode supported by the substrate, an absorber spaced apart from the substrate, a voltage source, and a current source. The electrode can include a mirror, or the system may include a mirror separate from the electrode. Radiation absorption efficiency of the absorber is based on a minimum gap distance between the absorber and mirror. The current source applies a DC current across the absorber structure to produce a signal indicative of radiation absorbed by the absorber structure. The voltage source powers the electrode to produce a modulated electrostatic field acting on the absorber to modulate the minimum gap distance. The electrostatic field includes a DC component to adjust the absorption efficiency, and an AC component that cyclically drives the absorber to negatively interfere with noise in the signal.

9. 发明申请

US20170082567A1 TRENCH BASED CAPACITIVE HUMIDITY SENSOR 审中-公开
公开(公告)号：US20170082567A1
公开(公告)日：2017-03-23
申请号：US13832904
申请日：2013-03-15
申请人： Robert Bosch Gmbh
发明人： Gary O'Brien , Ando Feyh , Andrew Graham , Ashwin Samarao , Gary Yama
IPC分类号： G01N27/22 , B81B7/00
CPC分类号： G01N27/223 , B81B7/0006 , B81B2201/0292 , G01N27/225
摘要： A trenched base capacitive humidity sensor includes a plurality of trenches formed in a conductive layer, such as polysilicon or metal, on a substrate. The trenches are arranged parallel to the each other and partition the conductive layer into a plurality of trenched silicon electrodes. At least two trenched silicon electrodes are configured to form a capacitive humidity sensor. The trenches that define the trenched silicon electrodes can be filled partially (e.g., sidewall coverage) or completely with polyimide (Pl) or silicon nitride (SiN). A polyimide layer may also be provided on the conductive layer over the trenches and trenched electrodes. The trenches and the trenched silicon electrodes may have different widths to enable different sensor characteristics in the same structure.

10. 发明申请

US20140167791A1 Resistive MEMS Humidity Sensor 审中-公开
标题翻译：电阻式MEMS湿度传感器
公开(公告)号：US20140167791A1
公开(公告)日：2014-06-19
申请号：US14108198
申请日：2013-12-16
申请人： Robert Bosch GmbH
发明人： Ando Feyh , Andrew Graham , Ashwin Samarao , Gary Yama , Gary O'Brien
IPC分类号： G01N27/04
CPC分类号： G01N27/121
摘要： A semiconductor device includes a substrate, an insulating film provided on a surface of the substrate, and a sensing film formed of a conductive material deposited on top of the insulating film. The sensing film defines at least one conductive path between a first position and a second position on the insulating film. A first circuit connection is electrically connected to the sensing film at the first position on the insulating layer, and a second circuit connection is electrically connected to the sensing film at the second position. A control circuit is operatively connected to the first circuit connection and the second circuit connection for measuring an electrical resistance of the sensing film. The sensing film has a thickness that enables a resistivity of the sensing film to be altered predictably in a manner that is dependent on ambient moisture content.
摘要翻译：半导体器件包括衬底，设置在衬底的表面上的绝缘膜和由沉积在绝缘膜的顶部上的导电材料形成的感测膜。感测膜在绝缘膜上的第一位置和第二位置之间限定至少一个导电路径。第一电路连接在绝缘层上的第一位置处电连接到感测膜，并且第二电路连接在第二位置电连接到感测膜。控制电路可操作地连接到第一电路连接和用于测量感测膜的电阻的第二电路连接。感测膜具有能够以取决于环境水分含量的方式预测地改变感测膜的电阻率的厚度。

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