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1. 发明授权

US09383145B2 System and method of boiling heat transfer using self-induced coolant transport and impingements 有权
标题翻译：使用自身引导的冷却剂输送和冲击进行沸腾传热的系统和方法
公开(公告)号：US09383145B2
公开(公告)日：2016-07-05
申请号：US12208641
申请日：2008-09-11
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： H01L23/467 , F28D15/02 , F28F3/02 , H01L23/367 , H01L23/427 , H01L23/473 , F28F3/12
CPC分类号： F28D15/0266 , F28F3/022 , F28F3/12 , H01L23/3677 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.
摘要翻译：根据本发明的一个实施例，用于发热结构的冷却系统包括设置在室内的室和结构。腔室有入口和出口。入口将基本上以液体形式的流体冷却剂接收到室中。出口将流体冷却剂至少部分地以蒸气形式排出室外。设置在室内的结构接收来自发热结构的热能，并将至少一部分热能传递到流体冷却剂。来自发热结构的热能导致基本上为液体形式的流体冷却剂的至少一部分在与结构的一部分接触时沸腾并喷射蒸气。蒸汽的积液在室内产生自身的流动。自感应流将基本上以液体形式的非汽化流体冷却剂分配到该结构的其它部分。

2. 发明授权

US08698691B2 Internal cooling system for a radome 有权
标题翻译：天线罩的内部冷却系统
公开(公告)号：US08698691B2
公开(公告)日：2014-04-15
申请号：US12511667
申请日：2009-07-29
申请人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
发明人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
IPC分类号： H01Q1/42 , H05K7/20 , F28D15/00
CPC分类号： H01Q1/422 , H01Q1/002 , H01Q1/02
摘要： According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.
摘要翻译：根据一个实施例，天线罩包括由内层隔开的两个电介质层。内层构造有内部冷却系统，该内部冷却系统包括通过入口接收流体的流体通道，将热量从天线罩传导到流体，并通过出口排出加热的流体。

3. 发明申请

US20100206523A1 INTERNAL COOLING SYSTEM FOR A RADOME 有权
标题翻译：内部冷却系统
公开(公告)号：US20100206523A1
公开(公告)日：2010-08-19
申请号：US12511667
申请日：2009-07-29
申请人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
发明人： Kevin W. Chen , Brandon H. Allen , Kerrin A. Rummel , Gary L. Seiferman , Richard M. Weber , William P. Harokopus
IPC分类号： F28D15/00 , H01Q1/42
CPC分类号： H01Q1/422 , H01Q1/002 , H01Q1/02
摘要： According to one embodiment, a radome includes two dielectric layers separated by an internal layer. The internal layer is configured with an internal cooling system including a fluid channel that receives a fluid through an inlet port, conducts heat from the radome to the fluid, and exhausts the heated fluid through an outlet port.
摘要翻译：根据一个实施例，天线罩包括由内层隔开的两个电介质层。内层构造有内部冷却系统，该内部冷却系统包括通过入口接收流体的流体通道，将热量从天线罩传导到流体，并通过出口排出加热的流体。

4. 发明授权

US08490418B2 Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权
标题翻译：用于在低于环境压力下用冷却剂冷却电子设备的方法和装置
公开(公告)号：US08490418B2
公开(公告)日：2013-07-23
申请号：US13043675
申请日：2011-03-09
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： F25B1/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

5. 发明授权

US06959753B1 Construction of phase change material embedded electronic circuit boards and electronic circuit board assemblies using porous and fibrous media 失效
标题翻译：使用多孔和纤维介质构建相变材料嵌入式电子电路板和电子电路板组件
公开(公告)号：US06959753B1
公开(公告)日：2005-11-01
申请号：US08675280
申请日：1996-07-01
申请人： Richard M. Weber , Kerrin A. Rummel
发明人： Richard M. Weber , Kerrin A. Rummel
IPC分类号： F28D20/02 , H01L23/373 , H01L23/427 , F28D15/00
CPC分类号： H01L23/4275 , F28D20/02 , H01L23/3733 , H01L2924/0002 , Y02E60/145 , Y10S165/042 , Y10S165/901 , Y10S165/902 , Y10S165/905 , Y10S165/907 , H01L2924/00
摘要： A heat sink which comprises an enclosure having a highly thermally conductive surface region and defining an enclosed cavity. A porous, highly thermally conductive material is disposed in the cavity, preferably homogeneously therein, and is thermally coupled to the thermally conductive surface. A phase change material changing from its initial phase, generally solid, to its final phase, generally liquid, responsive to the absorption of heat is disposed in the enclosed cavity and in the porous material. In accordance with a first embodiment, the highly thermally conductive surface region is preferably aluminum and the porous medium is a highly thermally conductive porous medium, preferably aluminum. In accordance with a second embodiment, the thermally conductive surface is composed of highly thermally conductive fibers disposed in a matrix and the porous material is a plurality of the thermally conductive fibers extending from the thermally conductive surface into the cavity. The highly thermally conductive fibers are preferably graphite and the matrix is preferably an epoxy.
摘要翻译：一种散热器，其包括具有高导热表面区域并限定封闭空腔的外壳。多孔的，高导热的材料优选地设置在空腔中，优选地在其中并且热耦合到导热表面。从其初始阶段（通常为固体）改变到其最终阶段（通常是液体）的响应于吸收热的相变材料设置在封闭空腔和多孔材料中。根据第一实施例，高导热表面区域优选为铝，多孔介质为高导热性多孔介质，优选为铝。根据第二实施例，导热表面由设置在基体中的高导热纤维构成，多孔材料是从导热表面延伸到空腔中的多个导热纤维。高导热性纤维优选为石墨，基质优选为环氧树脂。

6. 发明申请

US20110157828A1 Method And Apparatus for Cooling Electronics with a Coolant at a Subambient Pressure 有权
标题翻译：在低压下用冷却液冷却电子的方法和装置
公开(公告)号：US20110157828A1
公开(公告)日：2011-06-30
申请号：US13043675
申请日：2011-03-09
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： H05K7/20 , F28D15/00 , H05K7/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

7. 发明授权

US07908874B2 Method and apparatus for cooling electronics with a coolant at a subambient pressure 有权
标题翻译：用于在低于环境压力下用冷却剂冷却电子设备的方法和装置
公开(公告)号：US07908874B2
公开(公告)日：2011-03-22
申请号：US11381297
申请日：2006-05-02
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： F25D15/00
CPC分类号： F25B23/006 , F25B43/00 , F28D15/0266 , F28D2021/0031 , F28F23/00 , H01L2924/0002 , H01Q1/02 , H01L2924/00
摘要： According to one embodiment of the invention, a method is provided for cooling heat-generating structure disposed in an environment having an ambient pressure. The heat-generating structure includes electronics. The method includes providing a coolant, reducing a pressure of the coolant to a subambient pressure at which the coolant has a boiling temperature less than a temperature of the heat-generating structure, and bringing the heat-generating structure and the coolant at the subambient pressure into contact with one another, so that the coolant boils and vaporizes to thereby absorb heat from the heat-generating structure. In a more particular embodiment the coolant is either pure water or pure methanol with an electrical resistivity level of greater than one million Ohms-cm. Further, in another particular embodiment the method includes filtering the coolant to maintain its purity above a particular level.
摘要翻译：根据本发明的一个实施例，提供一种用于冷却设置在具有环境压力的环境中的发热结构的方法。发热结构包括电子产品。该方法包括提供冷却剂，将冷却剂的压力降低到冷却剂的沸腾温度低于发热结构的温度的次环境压力，并使发热结构和冷却剂处于低于环境压力彼此接触，使得冷却剂沸腾并蒸发，从而从发热结构吸收热量。在更具体的实施方案中，冷却剂是纯水或具有大于100万欧姆 - 厘米的电阻率水平的纯甲醇。此外，在另一个具体实施方案中，该方法包括过滤冷却剂以将其纯度保持在特定水平以上。

8. 发明申请

US20090101311A1 System and Method for Cooling Using Two Separate Coolants 审中-公开
标题翻译：使用两种独立冷却液进行冷却的系统和方法
公开(公告)号：US20090101311A1
公开(公告)日：2009-04-23
申请号：US11876301
申请日：2007-10-22
申请人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
发明人： Richard M. Weber , William G. Wyatt , Kerrin A. Rummel
IPC分类号： F28D15/00
CPC分类号： F25B25/005 , H01L23/473 , H01L2924/0002 , H01Q1/02 , H05K7/20281 , H01L2924/00
摘要： According to one embodiment, a cooling system for a heat-generating structure includes a first cooling loop that directs a flow of a first fluid coolant from a heat-generating structure to a first heat exchanger. The system also includes a second cooling loop that directs a flow of a second fluid coolant from the first heat exchanger to a second heat exchanger. The first heat exchanger receives thermal energy from the first fluid coolant and transfers at least a portion of the thermal energy to the second fluid coolant. The first fluid coolant has a specific heat and a mass flow rate, and the second fluid coolant has a specific heat and a mass flow rate. A product of the specific heat and the mass flow rate of the first fluid coolant is greater than a product of the specific heat and the mass flow rate of the second fluid coolant.
摘要翻译：根据一个实施例，用于发热结构的冷却系统包括将第一流体冷却剂从发热结构流向第一热交换器的第一冷却回路。该系统还包括第二冷却回路，其将来自第一热交换器的第二流体冷却剂的流引导到第二热交换器。第一热交换器从第一流体冷却剂接收热能并将至少一部分热能传递到第二流体冷却剂。第一流体冷却剂具有比热和质量流量，第二流体冷却剂具有比热和质量流量。第一流体冷却剂的比热和质量流量的乘积大于第二流体冷却剂的比热和质量流量的乘积。

9. 发明申请

US20090020266A1 System and Method of Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements 有权
标题翻译：使用自感冷却液运输和冲击的沸腾传热系统和方法
公开(公告)号：US20090020266A1
公开(公告)日：2009-01-22
申请号：US12208641
申请日：2008-09-11
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： F28D20/02 , F28D1/02 , F28F13/06 , F28F13/12
CPC分类号： F28D15/0266 , F28F3/022 , F28F3/12 , H01L23/3677 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.
摘要翻译：根据本发明的一个实施例，用于发热结构的冷却系统包括设置在室内的室和结构。腔室有入口和出口。入口将基本上以液体形式的流体冷却剂接收到室中。出口将流体冷却剂至少部分地以蒸气形式排出室外。设置在室内的结构接收来自发热结构的热能，并将至少一部分热能传递到流体冷却剂。来自发热结构的热能导致基本上为液体形式的流体冷却剂的至少一部分在与结构的一部分接触时沸腾并喷射蒸气。蒸汽的积液在室内产生自身的流动。自感应流将基本上以液体形式的非汽化流体冷却剂分配到该结构的其它部分。

10. 发明授权

US06735086B1 Heat-conducting device for circuit board 有权
标题翻译：电路板导热装置
公开(公告)号：US06735086B1
公开(公告)日：2004-05-11
申请号：US10437361
申请日：2003-05-13
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： H05K720
CPC分类号： H05K7/20445 , F42B15/08 , H05K7/1434
摘要： A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.
摘要翻译：用于在电路板和导弹的机体之间传导热量的导热装置包括安装电路板的热平面和从热平面中的槽部分地突出的一对脚。脚的槽接合部分自由地浮动在槽内，允许脚在相对于狭槽的两个维度上重新定位。诸如弹簧的弹性装置促使脚的外部部分与机身接触。锁定机构可能会阻止脚的延伸，直到导热装置安装在导弹之后。脚自身对准与机身接触，自动调整以补偿不对准和/或翘曲。

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