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1. 发明授权

US09383145B2 System and method of boiling heat transfer using self-induced coolant transport and impingements 有权
标题翻译：使用自身引导的冷却剂输送和冲击进行沸腾传热的系统和方法
公开(公告)号：US09383145B2
公开(公告)日：2016-07-05
申请号：US12208641
申请日：2008-09-11
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： H01L23/467 , F28D15/02 , F28F3/02 , H01L23/367 , H01L23/427 , H01L23/473 , F28F3/12
CPC分类号： F28D15/0266 , F28F3/022 , F28F3/12 , H01L23/3677 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.
摘要翻译：根据本发明的一个实施例，用于发热结构的冷却系统包括设置在室内的室和结构。腔室有入口和出口。入口将基本上以液体形式的流体冷却剂接收到室中。出口将流体冷却剂至少部分地以蒸气形式排出室外。设置在室内的结构接收来自发热结构的热能，并将至少一部分热能传递到流体冷却剂。来自发热结构的热能导致基本上为液体形式的流体冷却剂的至少一部分在与结构的一部分接触时沸腾并喷射蒸气。蒸汽的积液在室内产生自身的流动。自感应流将基本上以液体形式的非汽化流体冷却剂分配到该结构的其它部分。

2. 发明申请

US20090020266A1 System and Method of Boiling Heat Transfer Using Self-Induced Coolant Transport and Impingements 有权
标题翻译：使用自感冷却液运输和冲击的沸腾传热系统和方法
公开(公告)号：US20090020266A1
公开(公告)日：2009-01-22
申请号：US12208641
申请日：2008-09-11
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： F28D20/02 , F28D1/02 , F28F13/06 , F28F13/12
CPC分类号： F28D15/0266 , F28F3/022 , F28F3/12 , H01L23/3677 , H01L23/427 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： According to one embodiment of the invention, a cooling system for a heat-generating structure comprises a chamber and structure disposed within the chamber. The chamber has an inlet and an outlet. The inlet receives fluid coolant into the chamber substantially in the form of a liquid. The outlet dispenses the fluid coolant out of the chamber at least partially in the form of a vapor. The structure disposed within the chamber receive thermal energy from the heat generating structure and transfers at least a portion of the thermal energy to the fluid coolant. The thermal energy from the heat-generating structure causes at least a portion of the fluid coolant substantially in the form of a liquid to boil and effuse vapor upon contact with a portion of the structure. The effusion of vapor creates a self-induced flow in the chamber. The self-induced flow distributes non-vaporized fluid coolant substantially in the form of a liquid to other portions of the structure.
摘要翻译：根据本发明的一个实施例，用于发热结构的冷却系统包括设置在室内的室和结构。腔室有入口和出口。入口将基本上以液体形式的流体冷却剂接收到室中。出口将流体冷却剂至少部分地以蒸气形式排出室外。设置在室内的结构接收来自发热结构的热能，并将至少一部分热能传递到流体冷却剂。来自发热结构的热能导致基本上为液体形式的流体冷却剂的至少一部分在与结构的一部分接触时沸腾并喷射蒸气。蒸汽的积液在室内产生自身的流动。自感应流将基本上以液体形式的非汽化流体冷却剂分配到该结构的其它部分。

3. 发明授权

US06735086B1 Heat-conducting device for circuit board 有权
标题翻译：电路板导热装置
公开(公告)号：US06735086B1
公开(公告)日：2004-05-11
申请号：US10437361
申请日：2003-05-13
申请人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
发明人： Richard M. Weber , Kerrin A. Rummel , Albert P. Payton
IPC分类号： H05K720
CPC分类号： H05K7/20445 , F42B15/08 , H05K7/1434
摘要： A heat-conducting device for conducting heat between a circuit board and an airframe of a missile includes a thermal plane onto which the circuit board is mounted, and a pair of feet that partially protrude from the slots in the thermal plane. Slot-engaging portions of the feet freely float within the slots, allowing repositioning of the feet in two dimensions relative to the slots. Resilient devices such as springs urge outer portions of the feet into contact with the airframe. Locking mechanisms may prevent extension of the feet until after the heat-conducting device is installed in the missile. The feet self-align into contact with the airframe, automatically adjusting to compensate for misalignment and/or warping.
摘要翻译：用于在电路板和导弹的机体之间传导热量的导热装置包括安装电路板的热平面和从热平面中的槽部分地突出的一对脚。脚的槽接合部分自由地浮动在槽内，允许脚在相对于狭槽的两个维度上重新定位。诸如弹簧的弹性装置促使脚的外部部分与机身接触。锁定机构可能会阻止脚的延伸，直到导热装置安装在导弹之后。脚自身对准与机身接触，自动调整以补偿不对准和/或翘曲。

4. 发明授权

US06351383B1 Heat conducting device for a circuit board 有权
标题翻译：电路板导热装置
公开(公告)号：US06351383B1
公开(公告)日：2002-02-26
申请号：US09389655
申请日：1999-09-02
申请人： Albert P. Payton
发明人： Albert P. Payton
IPC分类号： H05K720
CPC分类号： H05K7/20445 , F42B15/08 , F42B15/34 , H05K7/1434
摘要： A heat conducting device for providing a thermal path between a circuit board and a missile airframe includes a thermal plane that is adapted to receive a circuit board and a collar that encompasses at least a portion of the thermal plane. The collar has a first position that disengages the heat conducting device from at least a portion of the airframe and a second position that engages the heat conducting device with at least a portion of the airframe to provide a thermal path between the circuit board and the airframe.
摘要翻译：用于在电路板和导弹机体之间提供热路径的导热装置包括适于接收电路板的热平面和包围热平面的至少一部分的套环。套环具有使导热装置与机身的至少一部分脱离的第一位置，以及与导热装置与机体的至少一部分接合以在电路板和机身之间提供热路径的第二位置。

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