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    • 1. 发明授权
    • High Cv bulk process valve, control system and method
    • 高Cv体积过程阀,控制系统和方法
    • US6026835A
    • 2000-02-22
    • US102625
    • 1998-06-23
    • Richard L. MartinHarry Clay NesbittDavid Edward DwellyJohn F. Schoeppel
    • Richard L. MartinHarry Clay NesbittDavid Edward DwellyJohn F. Schoeppel
    • F16K1/10F16K41/10F16K31/126
    • F16K41/106F16K1/10Y10T137/0318Y10T137/3109
    • A high Cv bulk process valve, control system and method convey a process gas or liquid for manufacturing semiconductors through a fluid passage. The fluid passage contains an aerodynamically shaped expansion chamber within which a valve seat and a moveable poppet are arranged for opening and closing the fluid passage. The aerodynamically shaped expansion chamber includes a conically expanding entry and a conically contracting exit and is shaped such that the resistance to flow of the process gas or liquid through the fluid passage of the valve is very nearly the same as through a straight tubing having a cross-sectional area of an inlet to the valve and a length of the fluid passage through the valve. The valve can be added or subtracted from a gas or liquid control system with virtually no changes in pressure drop of flow restriction, when the valve is in the open position. The valve minimizes the energy consumed by valves in semiconductor gas systems.
    • 高Cv体积过程阀,控制系统和方法通过流体通道输送用于制造半导体的工艺气体或液体。 流体通道包含空气动力学形状的膨胀室,在该膨胀室中布置有用于打开和关闭流体通道的阀座和可移动提升阀。 空气动力学形状的膨胀室包括锥形膨胀入口和锥形收缩出口,并且成形为使得通过阀的流体通道的工艺气体或液体的流动阻力与通过具有十字形的直管非常接近相同 阀的入口的截面面积和通过阀的流体通道的长度。 当阀门处于打开位置时,可以从气体或液体控制系统中添加或减少阀门,实际上流量限制压降几乎没有变化。 该阀将半导体气体系统中的阀消耗的能量最小化。
    • 2. 发明授权
    • Method and apparatus for cleaning surfaces to absolute or near-absolute
cleanliness
    • 将表面清洁为绝对或接近绝对清洁度的方法和设备
    • US5039349A
    • 1991-08-13
    • US524985
    • 1990-05-18
    • John F. Schoeppel
    • John F. Schoeppel
    • B08B3/02H01L21/00
    • H01L21/67028B08B3/02
    • A method and apparatus for cleaning surfaces to absolute or near-absolute cleanliness involves spraying jets of heated cleaning solution so that it flows over and scrubs the surfaces to be cleaned. The cleaning solution is continuously recirculated and filtered during cleaning to remove over 99% of all particles having a diameter equal to or greater than 0.02.mu.. The cleaned surface is rinsed with heated, filtered deionized water and dried to provide a surface having absolute or nearly-absolute cleanliness to the limit of the best commercial instrumentation, e.g., .ltoreq. five particles with a diameter of .gtoreq.0.02.mu. per cubic foot of gas flowed over a cleaned surface as detected by a laser particle counter. The method is useful for cleaning gas valves and regulators and components thereof as well as existing gas flow equipment, for example, for use in semiconductor processing equipment. The cleaned surfaces are sterile and therefore also useful in the health and pharmaceutical industries.
    • 用于将表面清洁为绝对或接近绝对清洁度的方法和设备涉及喷射加热的清洁溶液的喷射流,使其流过并擦洗待清洁的表面。 清洁溶液在清洁过程中连续再循环并过滤,以除去超过99%的直径等于或大于0.02微米的所有颗粒。 清洁后的表面用加热过滤的去离子水冲洗,并干燥,以提供绝对或几乎绝对的清洁度至最佳商业仪器的极限的表面,例如直径> 0.02%的五颗颗粒 立方英尺的气体流过清洁的表面,由激光粒子计数器检测。 该方法对于清洁气体阀门及其调节器及其部件以及例如用于半导体加工设备的现有气流设备是有用的。 清洁的表面是无菌的,因此也可用于健康和制药行业。