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    • 1. 发明授权
    • Hybrid IGBT and MOSFET for zero current at zero voltage
    • 用于零电压零电流的混合IGBT和MOSFET
    • US06627961B1
    • 2003-09-30
    • US09565151
    • 2000-05-05
    • Richard FrancisRanadeep DuttaChiu NgPeter Wood
    • Richard FrancisRanadeep DuttaChiu NgPeter Wood
    • H01L2972
    • H01L29/7395
    • A high voltage MOSgated semiconductor device has a generally linear MOSFET type forward current versus forward voltage characteristic at low voltage and the high current, low forward drop capability of an IGBT. The device is particularly useful as the control transistor for a television tube deflection coil. The device is formed by a copacked discrete IGBT die and power MOSFET die in which the ratio of the MOSFET die area is preferably about 25% that of the IGBT. Alternatively, the IGBT and MOSFET can be integrated into the same die, with the IGBT and MOSFET elements alternating laterally with one another and overlying respective P+ injection regions and N+ contact regions respectively on the bottom of the die. The MOSFET and IGBT elements are preferably spaced apart by a distance of about 1 minority carrier length (50-100 microns for a 1500 volt device).
    • 高压MOS电容半导体器件具有大致线性的MOSFET型正向电流与低电压时的正向电压特性以及IGBT的高电流,低正向下降能力。 该装置特别适用于电视机管偏转线圈的控制晶体管。 该器件由共模封装的分立IGBT管芯和功率MOSFET管芯形成,其中MOSFET管芯面积的比率优选为IGBT的约25%。 或者,IGBT和MOSFET可以集成到相同的管芯中,其中IGBT和MOSFET元件彼此横向交替并且分别叠置在管芯底部上的相应的P +注入区域和N +接触区域。 MOSFET和IGBT元件优选地间隔开约1个少数载流子长度(对于1500伏装置为50-100微米)的距离。
    • 5. 发明授权
    • Bipolar transistor with geometry optimized for device performance, and method of making same
    • 具有针对器件性能优化的几何形状的双极晶体管及其制造方法
    • US07253498B2
    • 2007-08-07
    • US10885250
    • 2004-07-06
    • Ranadeep Dutta
    • Ranadeep Dutta
    • H01L27/82
    • H01L29/73H01L29/0692
    • The present invention is generally directed to bipolar transistors with geometry optimized for device performance and various methods of making same. In one illustrative embodiment, the device includes a substrate, an intrinsic base region formed in the substrate, a continuous emitter region formed within the intrinsic base region, the emitter region having a plurality of substantially hexagonal shaped openings defined therein, and a plurality of extrinsic base regions formed in the substrate, wherein each of the extrinsic base regions is positioned within an area defined by one of the plurality of substantially hexagonal shaped openings.
    • 本发明一般涉及具有针对器件性能优化的几何形状的双极晶体管及其制造方法。 在一个说明性实施例中,器件包括衬底,形成在衬底中的本征基极区域,形成在本征基极区域内的连续发射极区域,发射极区域具有限定在其中的多个基本上六边形形状的开口,以及多个外部 形成在基板中的基部区域,其中每个非本征基极区域位于由多个基本六边形形状的开口之一限定的区域内。
    • 6. 发明申请
    • HIGH VOLTAGE MOSFET DEVICES CONTAINING TIP COMPENSATION IMPLANT
    • 高压MOSFET器件包含提示补偿植入物
    • US20090170269A1
    • 2009-07-02
    • US11968135
    • 2007-12-31
    • Ranadeep Dutta
    • Ranadeep Dutta
    • H01L21/336
    • H01L29/6659H01L29/7833
    • Semiconductor devices and methods for making semiconductor devices are described in this application. The semiconductor devices comprise a MOSFET device in a semiconductor substrate, with the MOSFET device containing source and drain regions with a tip implant region near the surface of the substrate. The tip implant region contains a tip compensation implant region located under the gate of the MOSFET device that overlaps with the source and drain. The tip compensation implant region reduces the dopant concentration in this gate-drain overlap region, while maintaining a graded drain-well junction profile, thereby reducing the band to band tunneling and increasing the drain breakdown voltage. Other embodiments are described.
    • 在本申请中描述了用于制造半导体器件的半导体器件和方法。 半导体器件包括半导体衬底中的MOSFET器件,其中MOSFET器件包含在衬底表面附近具有尖端注入区的源区和漏区。 尖端植入区域包含位于MOSFET器件的栅极下方的与源极和漏极重叠的尖端补偿注入区域。 尖端补偿注入区域减小了该栅极 - 漏极重叠区域中的掺杂剂浓度,同时保持了梯度的漏 - 阱结结构,从而减小了带带隧穿和增加漏极击穿电压。 描述其他实施例。
    • 8. 发明申请
    • Bipolar transistor with geometry optimized for device performance, and method of making same
    • 具有针对器件性能优化的几何形状的双极晶体管及其制造方法
    • US20060006498A1
    • 2006-01-12
    • US10885250
    • 2004-07-06
    • Ranadeep Dutta
    • Ranadeep Dutta
    • H01L27/082
    • H01L29/73H01L29/0692
    • The present invention is generally directed to bipolar transistors with geometry optimized for device performance and various methods of making same. In one illustrative embodiment, the device includes a substrate, an intrinsic base region formed in the substrate, a continuous emitter region formed within the intrinsic base region, the emitter region having a plurality of substantially hexagonal shaped openings defined therein, and a plurality of extrinsic base regions formed in the substrate, wherein each of the extrinsic base regions is positioned within an area defined by one of the plurality of substantially hexagonal shaped openings.
    • 本发明一般涉及具有针对器件性能优化的几何形状的双极晶体管及其制造方法。 在一个说明性实施例中,器件包括衬底,形成在衬底中的本征基极区域,形成在本征基极区域内的连续发射极区域,发射极区域具有限定在其中的多个基本上六边形形状的开口,以及多个外部 形成在基板中的基部区域,其中每个非本征基极区域位于由多个基本六边形形状的开口之一限定的区域内。