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    • 1. 发明申请
    • DRAM refreshment
    • DRAM刷新
    • US20050157534A1
    • 2005-07-21
    • US10627955
    • 2003-07-25
    • Richard FerrantFrancois Jacquet
    • Richard FerrantFrancois Jacquet
    • G11C11/406G11C11/24
    • G11C11/406
    • A DRAM including an array of storage elements arranged in lines and columns, and for each column: write means adapted to biasing at least a selected one of the elements to a charge level chosen from among a first predetermined high level and a second predetermined low level, combined with read circuitry adapted to determining whether the stored charge level is greater or smaller than a predetermined charge level; and isolation circuitry adapted to isolating the array from the read and/or write means, each column further including refreshment means, distinct from the read and write circuit, for increasing, beyond the first and second predetermined levels, the charge stored in a storage element.
    • 一种DRAM,包括排列成行和列的存储元件的阵列,并且用于每列:写入装置,其适于将至少一个所选元素偏置到从第一预定高电平和第二预定低电平中选择的电荷电平 与读取电路组合,适于确定所存储的电荷电平是否大于或小于预定电荷电平; 以及隔离电路,其适于将阵列与读取和/或写入装置隔离,每列还包括与读取和写入电路不同的刷新装置,用于在第一和第二预定级别之外增加存储在存储元件中的电荷 。
    • 3. 发明授权
    • Method and device for voltage multiplication
    • 电压倍增方法和装置
    • US06316986B1
    • 2001-11-13
    • US09578780
    • 2000-05-25
    • Richard FerrantFrancois Jacquet
    • Richard FerrantFrancois Jacquet
    • G05F110
    • H02M3/07
    • At a charging phase, a capacitor (PC) is charged through two complementary charging transistors (TR1, TR2) connected in series to a first terminal (T1) of the capacitor (PC). At a voltage multiplication phase, an input voltage (Vdd) is delivered to the second terminal (T2) of the capacitor and an output voltage (Vout), increased with respect to the input voltage, is recovered at the first terminal (T1) of the, capacitor, and the capacitor is discharged during a discharging phase. During three phases, the substrate (BK2) of the charging transistor (TR2) directly connected to the first terminal (T1) of the capacitor is slaved to the source (S2) of this same charging transistor (TR2), while still keeping the source-substrate junction and the drain-substrate junction of this charging transistor (TR2) reverse-biased.
    • 在充电阶段,通过与电容器(PC)的第一端子(T1)串联连接的两个互补充电晶体管(TR1,TR2)对电容器(PC)进行充电。 在电压倍增阶段,将输入电压(Vdd)输送到电容器的第二端子(T2),并且相对于输入电压增加的输出电压(Vout)在第一端子(T1)处被恢复 电容器和电容器在放电阶段被放电。 在三相期间,直接连接到电容器的第一端子(T1)的充电晶体管(TR2)的基板(BK2)被从属于同一充电晶体管(TR2)的源极(S2),同时仍然保持源极 基极结和该充电晶体管(TR2)的漏 - 基极结反向偏置。
    • 4. 发明授权
    • SRAM-type memory cell
    • SRAM型存储单元
    • US08575697B2
    • 2013-11-05
    • US13039167
    • 2011-03-02
    • Carlos MazureRichard FerrantBich-Yen Nguyen
    • Carlos MazureRichard FerrantBich-Yen Nguyen
    • H01L27/11H01L27/12G11C5/06G11C11/00
    • H01L27/1104G11C11/412H01L21/84H01L27/1203
    • An SRAM-type memory cell that includes a semiconductor on insulator substrate having a thin film of semiconductor material separated from a base substrate by an insulating layer; and six transistors such as two access transistors, two conduction transistors and two charge transistors arranged so as to form with the conduction transistors two back-coupled inverters. Each of the transistors has a back control gate formed in the base substrate below the channel and able to be biased in order to modulate the threshold voltage of the transistor, with a first back gate line connecting the back control gates of the access transistors to a first potential and a second back gate line connecting the back control gates of the conduction transistors and charge transistors to a second potential. The first and second potentials can be modulated according to the type of cell control operation.
    • 一种SRAM型存储单元,包括绝缘体上半导体衬底,其具有通过绝缘层从基底衬底分离的半导体材料薄膜; 以及六个晶体管,例如两个存取晶体管,两个导通晶体管和两个电荷晶体管,其布置成与导通晶体管形成两个反向耦合的反相器。 每个晶体管具有形成在通道下方的基底衬底中的后控制栅极,并且能够被偏置以便调制晶体管的阈值电压,第一背栅极线将存取晶体管的背控制栅极连接到 第一电位和第二背栅极线,其将导通晶体管和电荷晶体管的背控制栅极连接到第二电位。 第一和第二电位可以根据电池控制操作的类型进行调制。
    • 5. 发明授权
    • Data-path cell on an SeOI substrate with a back control gate beneath the insulating layer
    • SeOI衬底上的数据通道单元,在绝缘层下面带有一个后控制栅极
    • US08432216B2
    • 2013-04-30
    • US13007483
    • 2011-01-14
    • Carlos MazureRichard Ferrant
    • Carlos MazureRichard Ferrant
    • G05F1/10H01L27/105G06F17/50
    • H01L27/1203H01L29/78609H01L29/78648
    • The invention provides a data-path cell specifically adapted to its environment for use in an integrated circuit produced on a semiconductor-on-insulator (SeOI) substrate. The data-path cell includes an array of field-effect transistors, each transistor having a source region, a drain region and a channel region formed in the thin semiconductor layer of the SeOI substrate, and further having a front gate control region formed above the channel region. In particular, one or more transistors of the data-path cell further includes a back gate control region formed in the bulk substrate beneath the channel region and configured so as to modify the performance characteristics of the transistor in dependence on its state of bias. Also, an integrated circuit including one or more of the data-path cells and methods for designing or driving these data-path cells.
    • 本发明提供一种特别适用于其环境的数据通道单元,用于在绝缘体上半导体(SeOI)衬底上制造的集成电路中。 数据通道单元包括场效应晶体管阵列,每个晶体管具有形成在SeOI衬底的薄半导体层中的源极区,漏极区和沟道区,并且还具有形成在栅极上的前栅极控制区 渠道区域。 特别地,数据通道单元的一个或多个晶体管还包括形成在沟道区下面的体衬底中的背栅极控制区域,并且被配置为根据其偏置状态来修改晶体管的性能特性。 而且,包括一个或多个数据路径单元的集成电路以及用于设计或驱动这些数据路径单元的方法。
    • 9. 发明授权
    • Integrated circuit comprising a transistor and a capacitor, and fabrication method
    • 包括晶体管和电容器的集成电路及其制造方法
    • US07994560B2
    • 2011-08-09
    • US12173702
    • 2008-07-15
    • Christian CaillatRichard Ferrant
    • Christian CaillatRichard Ferrant
    • H01L29/94
    • H01L27/10823H01L27/0218H01L27/10829H01L27/10876H01L27/10885H01L27/1203
    • An integrated circuit includes a substrate and at least one active region. A transistor produced in the active region separated from the substrate. This transistor includes a source or drain first region and a drain or source second region which are connected by a channel. A gate structure is position on top of said channel and operates to control the channel. The gate structure is formed in a trench whose sidewalls have a shape which converges (narrows) in the width dimension towards the substrate. A capacitor is also formed having a first electrode, a second electrode and a dielectric layer between the electrodes. This capacitor is also formed in a trench. An electrode line is connected to the first electrode of the capacitor. The second electrode of the capacitor is formed in a layer shared in common with at least part of the drain or source second region of the transistor. A bit line is located beneath the gate structure. The integrated circuit may, for example, be a DRAM memory cell.
    • 集成电路包括衬底和至少一个有源区。 在与基板分离的有源区中产生的晶体管。 该晶体管包括源极或漏极第一区域以及通过沟道连接的漏极或源极第二区域。 栅极结构位于所述通道的顶部并且用于控制通道。 栅极结构形成在其侧壁具有朝向衬底的宽度尺寸收敛(窄))的形状的沟槽中。 电容器也形成为具有在电极之间的第一电极,第二电极和电介质层。 该电容器也形成在沟槽中。 电极线连接到电容器的第一电极。 电容器的第二电极形成在与晶体管的漏极或源极第二区域的至少一部分共同共享的层中。 位线位于门结构下方。 集成电路例如可以是DRAM存储单元。
    • 10. 发明申请
    • DATA-PATH CELL ON AN SeOI SUBSTRATE WITH A BACK CONTROL GATE BENEATH THE INSULATING LAYER
    • 具有后控制门的SeOI基板上的数据路径电池绝缘层
    • US20110133822A1
    • 2011-06-09
    • US13013580
    • 2011-01-25
    • Carlos MazureRichard Ferrant
    • Carlos MazureRichard Ferrant
    • G05F1/10H01L27/105G06F17/50
    • H01L21/84H01L27/0207H01L27/11807H01L27/1203
    • This invention provides a semiconductor device structure formed on a conventional semiconductor-on-insulator (SeOI) substrate defined by a pattern defining at least one field-effect transistor having: in the thin film of the SeOI substrate, a source region, a drain region, a channel region, and a front control gate region formed above the channel region; and in the base substrate beneath the buried oxide of the SeOI substrate, a back control gate region, arranged under the channel region and configured to shift the threshold voltage of the transistor in response to bias voltages. This invention also provides patterns defining standard-cell-type circuit structures and data-path-cell type circuit structures that include arrays of the FET patterns provided by this invention. Such circuit structures also include back gate lines connecting the back gate control regions. This invention also provides methods of operating and designing such semiconductor device structures.
    • 本发明提供了一种半导体器件结构,其形成在传统的绝缘体上半导体(SeOI)衬底上,该衬底由限定至少一个场效应晶体管的图案限定,该场效应晶体管具有:在SeOI衬底的薄膜中,源极区, ,沟道区和形成在沟道区上方的前控制栅区; 以及位于所述SeOI衬底的所述掩埋氧化物之下的所述基底衬底中,所述背面控制栅极区域布置在所述沟道区域下方并且被配置为响应于偏压而移位所述晶体管的阈值电压。 本发明还提供了定义包括由本发明提供的FET图案的阵列的标准单元型电路结构和数据路径单元型电路结构的图案。 这种电路结构还包括连接背栅极控制区域的后栅极线。 本发明还提供了操作和设计这种半导体器件结构的方法。