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1. 发明申请

US20080246106A1 Integrated circuits having photonic interconnect layers and methods for fabricating same 有权
标题翻译：具有光互连层的集成电路及其制造方法
公开(公告)号：US20080246106A1
公开(公告)日：2008-10-09
申请号：US11732549
申请日：2007-04-03
申请人： Raymond G. Beausoleil , Scott Corzine , Sean Spillane , Wei Wu , R. Stanley Williams
发明人： Raymond G. Beausoleil , Scott Corzine , Sean Spillane , Wei Wu , R. Stanley Williams
IPC分类号： H01L31/0232
CPC分类号： G02B6/1225 , B82Y20/00 , G02B6/12002 , G02B6/43 , H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： Various embodiments of the present invention are directed to integrated circuits having photonic interconnect layers and methods for fabricating the integrated circuits. In one embodiment of the present invention, an integrated circuit comprises an electronic device layer and one or more photonic interconnect layers. The electronic device layer includes one or more electronic devices, and the electronic device layer is attached to a surface of an intermediate layer. One of the photonic interconnect layers is attached to an opposing surface of the intermediate layer, and each of the photonic interconnect layers has at least one photonic device in communication with at least one of the electronic devices of the electronic device layer.
摘要翻译：本发明的各种实施例涉及具有光子互连层的集成电路和用于制造集成电路的方法。在本发明的一个实施例中，集成电路包括电子器件层和一个或多个光子互连层。电子器件层包括一个或多个电子器件，并且电子器件层附着到中间层的表面。光子互连层中的一个附着到中间层的相对表面，并且每个光子互连层具有与电子器件层的至少一个电子器件通信的至少一个光子器件。

2. 发明授权

US07778501B2 Integrated circuits having photonic interconnect layers and methods for fabricating same 有权
标题翻译：具有光互连层的集成电路及其制造方法
公开(公告)号：US07778501B2
公开(公告)日：2010-08-17
申请号：US11732549
申请日：2007-04-03
申请人： Raymond G. Beausoleil , Scott Corzine , Sean Spillane , Wei Wu , R. Stanley Williams
发明人： Raymond G. Beausoleil , Scott Corzine , Sean Spillane , Wei Wu , R. Stanley Williams
IPC分类号： G02B6/12
CPC分类号： G02B6/1225 , B82Y20/00 , G02B6/12002 , G02B6/43 , H01L31/0203 , H01L2224/48091 , H01L2924/00014
摘要： Various embodiments of the present invention are directed to integrated circuits having photonic interconnect layers and methods for fabricating the integrated circuits. In one embodiment of the present invention, an integrated circuit comprises an electronic device layer and one or more photonic interconnect layers. The electronic device layer includes one or more electronic devices, and the electronic device layer is attached to a surface of an intermediate layer. One of the photonic interconnect layers is attached to an opposing surface of the intermediate layer, and each of the photonic interconnect layers has at least one photonic device in communication with at least one of the electronic devices of the electronic device layer.
摘要翻译：本发明的各种实施例涉及具有光子互连层的集成电路和用于制造集成电路的方法。在本发明的一个实施例中，集成电路包括电子器件层和一个或多个光子互连层。电子器件层包括一个或多个电子器件，并且电子器件层附着到中间层的表面。光子互连层中的一个附着到中间层的相对表面，并且每个光子互连层具有与电子器件层的至少一个电子器件通信的至少一个光子器件。

3. 发明授权

US07427525B2 Methods for coupling diamond structures to photonic devices 有权
公开(公告)号：US07427525B2
公开(公告)日：2008-09-23
申请号：US11580344
申请日：2006-10-13
申请人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
发明人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
IPC分类号： H01L21/00
CPC分类号： G02B6/122 , G02F2202/32
摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a method for coupling a photonic device with a diamond structure comprises embedding the diamond structure in a first substrate, where the first substrate comprises a first transparent material. The photonic device is formed in a semiconductor material, which is supported by a second substrate. An intermediate structure is formed by depositing a second transparent material over the photonic device. The second transparent material may have substantially the same refractive index as the first transparent material. The intermediate structure is then separated from the second substrate, and the intermediated structure is adhered to the first substrate so that the photonic device optically couples with the diamond structure.

4. 发明申请

US20080096308A1 Methods for coupling diamond structures to photonic devices 有权
标题翻译：将金刚石结构耦合到光子器件的方法
公开(公告)号：US20080096308A1
公开(公告)日：2008-04-24
申请号：US11580344
申请日：2006-10-13
申请人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
发明人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
IPC分类号： H01L21/00
CPC分类号： G02B6/122 , G02F2202/32
摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a method for coupling a photonic device with a diamond structure comprises embedding the diamond structure in a first substrate, where the first substrate comprises a first transparent material. The photonic device is formed in a semiconductor material, which is supported by a second substrate. An intermediate structure is formed by depositing a second transparent material over the photonic device. The second transparent material may have substantially the same refractive index as the first transparent material. The intermediate structure is then separated from the second substrate, and the intermediated structure is adhered to the first substrate so that the photonic device optically couples with the diamond structure.
摘要翻译：本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。在本发明的一个实施例中，用于将光子器件与金刚石结构耦合的方法包括将金刚石结构嵌入第一衬底中，其中第一衬底包括第一透明材料。光子器件形成在由第二衬底支撑的半导体材料中。通过在光子器件上沉积第二透明材料形成中间结构。第二透明材料可以具有与第一透明材料基本上相同的折射率。然后将中间结构与第二衬底分离，并且中间结构粘附到第一衬底，使得光子器件与金刚石结构光学耦合。

5. 发明授权

US08039845B2 Methods for coupling diamond structures to photonic devices 有权
标题翻译：将金刚石结构耦合到光子器件的方法
公开(公告)号：US08039845B2
公开(公告)日：2011-10-18
申请号：US12228039
申请日：2008-08-08
申请人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
发明人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
IPC分类号： H01L29/66 , H01L21/00
CPC分类号： G02B6/122 , G02F2202/32
摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.
摘要翻译：本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。在本发明的一个实施例中，光子器件与金刚石结构光学耦合。光子器件包括半导体材料，并与金刚石结构光学耦合，粘合剂物质将光子器件粘附到金刚石结构上。还提供了一种用于将光子器件与金刚石结构耦合的方法。该方法包括：在金刚石结构上沉积半导体材料; 在半导体材料中形成光子器件，使得光子器件与金刚石结构耦合; 并将光子器件粘附到金刚石结构上。

6. 发明申请

US20080303049A1 Methods for coupling diamond structures to photonic devices 有权
标题翻译：将金刚石结构耦合到光子器件的方法
公开(公告)号：US20080303049A1
公开(公告)日：2008-12-11
申请号：US12228039
申请日：2008-08-08
申请人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
发明人： Charles Santori , Sean Spillane , Marco Fiorentino , David Fattal , Raymond G. Beausoleil , Wei Wu , Theodore I. Kamins
IPC分类号： H01L33/00 , H01L21/00
CPC分类号： G02B6/122 , G02F2202/32
摘要： Various embodiments of the present invention are directed to methods for coupling semiconductor-based photonic devices to diamond. In one embodiment of the present invention, a photonic device is optically coupled with a diamond structure. The photonic device comprises a semiconductor material and is optically coupled with the diamond structure with an adhesive substance that adheres the photonic device to the diamond structure. A method for coupling the photonic device with the diamond structure is also provided. The method comprises: depositing a semiconductor material on the diamond structure; forming the photonic device in the semiconductor material so that the photonic device couples with the diamond structure; and adhering the photonic device to the diamond structure.
摘要翻译：本发明的各种实施例涉及将基于半导体的光子器件耦合到金刚石的方法。在本发明的一个实施例中，光子器件与金刚石结构光学耦合。光子器件包括半导体材料，并与金刚石结构光学耦合，粘合剂物质将光子器件粘附到金刚石结构上。还提供了一种用于将光子器件与金刚石结构耦合的方法。该方法包括：在金刚石结构上沉积半导体材料; 在半导体材料中形成光子器件，使得光子器件与金刚石结构耦合; 并将光子器件粘附到金刚石结构上。

7. 发明授权

US07050659B1 Optically modulable photonic bandgap medium 有权
标题翻译：光学可调光子带隙介质
公开(公告)号：US07050659B1
公开(公告)日：2006-05-23
申请号：US11096670
申请日：2005-03-31
申请人： R. Stanley Williams , Raymond G. Beausoleil , Wei Wu , Zhiyong Li , Philip J. Kuekes
发明人： R. Stanley Williams , Raymond G. Beausoleil , Wei Wu , Zhiyong Li , Philip J. Kuekes
IPC分类号： G02F1/295
CPC分类号： G02F1/3511 , G02F1/0541 , G02F1/29 , G02F1/365 , G02F2202/13 , G02F2202/32
摘要： Controlling the propagation of electromagnetic radiation is described. A photonic bandgap medium is placed in the path of the electromagnetic radiation, the photonic bandgap medium comprising a photorefractive material. Control radiation is projected onto a surface of the photonic bandgap medium. The control radiation spatially varies a refractive index of the photorefractive material to control propagation of the electromagnetic radiation through the photonic bandgap medium.
摘要翻译：描述控制电磁辐射的传播。光子带隙介质放置在电磁辐射的路径中，光子带隙介质包括光折射材料。控制辐射投影到光子带隙介质的表面上。控制辐射在空间上改变光折射材料的折射率，以控制通过光子带隙介质的电磁辐射的传播。

8. 发明授权

US07359048B2 Raman signal-enhancing structures and devices 有权
标题翻译：拉曼信号增强结构和器件
公开(公告)号：US07359048B2
公开(公告)日：2008-04-15
申请号：US11413910
申请日：2006-04-28
申请人： Shih-Yuan Wang , R. Stanley Williams , Raymond G. Beausoleil , Theodore I. Kamins , Zhiyong Li , Wei Wu
发明人： Shih-Yuan Wang , R. Stanley Williams , Raymond G. Beausoleil , Theodore I. Kamins , Zhiyong Li , Wei Wu
IPC分类号： G01J3/44 , G01N21/65
CPC分类号： G01N21/658 , G01J3/44
摘要： Raman systems include a radiation source, a radiation detector, and a Raman device or signal-enhancing structure. Raman devices include a tunable resonant cavity and a Raman signal-enhancing structure coupled to the cavity. The cavity includes a first reflective member, a second reflective member, and an electro-optic material disposed between the reflective members. The electro-optic material exhibits a refractive index that varies in response to an applied electrical field. Raman signal-enhancing structures include a substantially planar layer of Raman signal-enhancing material having a major surface, a support structure extending from the major surface, and a substantially planar member comprising a Raman signal-enhancing material disposed on an end of the support structure opposite the layer of Raman signal-enhancing material. The support structure separates at least a portion of the planar member from the layer of Raman signal-enhancing material by a selected distance of less than about fifty nanometers.
摘要翻译：拉曼系统包括辐射源，辐射检测器和拉曼器件或信号增强结构。拉曼器件包括耦合到空腔的可调谐谐振腔和拉曼信号增强结构。空腔包括第一反射构件，第二反射构件和设置在反射构件之间的电光材料。电光材料表现出响应于所施加的电场而变化的折射率。拉曼信号增强结构包括具有主表面的基本平坦的拉曼信号增强材料层，从主表面延伸的支撑结构和包括设置在支撑结构的端部上的拉曼信号增强材料的基本上平面的构件与拉曼信号增强材料层相对。支撑结构将平面构件的至少一部分与拉曼信号增强材料层分开小于约五十纳米的选定距离。

9. 发明授权

US08390800B2 Angle sensor, system and method employing guided-mode resonance 失效
标题翻译：采用导模共振的角度传感器，系统和方法
公开(公告)号：US08390800B2
公开(公告)日：2013-03-05
申请号：US12864234
申请日：2008-03-04
申请人： David A. Fattal , Anna Pyayt , Raymond G. Beausoleil , Wei Wu
发明人： David A. Fattal , Anna Pyayt , Raymond G. Beausoleil , Wei Wu
IPC分类号： G01B11/26 , G01C1/00 , G01J3/28
CPC分类号： G01B11/26 , G01D5/38
摘要： An angle sensor, system and method employ a guided-mode resonance. The angle sensor includes a guided-mode resonance (GMR) grating and a resonance processor. The resonance processor determines an angle of incidence of a signal incident on the GMR grating. The resonance processor uses a guided-mode resonance response of the GMR grating to the signal to determine the angle of incidence. The angle sensing system includes the GMR grating, the resonance processor and further includes an optical source that produces the signal. The method includes providing a GMR grating, detecting a guided-mode resonance produced in the GMR grating when subjected to an incident signal, and determining an angle of incidence of the incident signal from one or both of a number of and a spectral distance between guided-mode resonances present in a response of the GMR grating to the incident signal.
摘要翻译：角度传感器，系统和方法采用导模共振。角度传感器包括导模谐振（GMR）光栅和谐振处理器。谐振处理器确定入射在GMR光栅上的信号的入射角。谐振处理器使用GMR光栅的导模谐振响应信号来确定入射角。角度感测系统包括GMR光栅，谐振处理器，还包括产生该信号的光源。该方法包括：提供GMR光栅，检测在受到入射信号时在GMR光栅中产生的导模共振，以及确定入射信号之间的数量和频谱距离之间的一个或两个的入射角在GMR光栅对入射信号的响应中存在共模谐振。

10. 发明申请

US20090103095A1 Sensor using plasmon resonance 有权
标题翻译：传感器使用等离子体共振
公开(公告)号：US20090103095A1
公开(公告)日：2009-04-23
申请号：US11975538
申请日：2007-10-18
申请人： Raymond G. Beausoleil , Wei Wu , David A. Fattal , Marco Fiorentino
发明人： Raymond G. Beausoleil , Wei Wu , David A. Fattal , Marco Fiorentino
IPC分类号： G01N21/25 , G01J3/46
CPC分类号： G01N21/251 , B82Y20/00 , G01J3/51 , G01J3/513 , G01N2021/258 , G02B5/008 , G02B5/201
摘要： A sensing system can include one or more particles having one or more plasmon resonances. The particles can be positioned adjacent to the active region of a sensor to enhance the sensitivity of the sensor to electromagnetic radiation having frequencies corresponding to the plasmon resonances. An array of sensors such as used for color imaging can employ different types of particles adjacent to different sensors, so that different sensors sense different colors. During fabrication of such sensors, the particles can be applied mechanically or using a process such as inkjet printing.
摘要翻译：感测系统可以包括具有一个或多个等离子体共振的一个或多个颗粒。颗粒可以邻近传感器的有源区域定位，以增强传感器对具有对应于等离子体共振的频率的电磁辐射的灵敏度。诸如用于彩色成像的传感器阵列可以使用与不同传感器相邻的不同类型的颗粒，使得不同的传感器感测不同的颜色。在制造这种传感器期间，颗粒可以机械地应用或者使用诸如喷墨印刷的工艺。

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