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    • 1. 发明授权
    • Removal of post-rie polymer on A1/CU metal line
    • 去除A1 / CU金属线上的后聚合物
    • US06849153B2
    • 2005-02-01
    • US09204706
    • 1998-12-03
    • Ravikumar RamachandranWesley NatzleMartin GutscheHiroyuki AkatsuChien Yu
    • Ravikumar RamachandranWesley NatzleMartin GutscheHiroyuki AkatsuChien Yu
    • H01L21/302G03F7/42H01L21/02H01L21/027H01L21/306H01L21/3065H01L21/3205H01L21/3213C23F1/08
    • H01L21/02071H01L21/02054H01L21/31138H01L21/32136Y10S134/902
    • A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising: 1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure is supported to form a water soluble material of sidewall polymer rails left behind on the Al/Cu metal line from the RIE process; removing the water soluble material with deionized water; and removing photo-resist from said composite structure by either a water-only plasma process or a chemical down stream etching method; or 2) forming a water-only plasma process to strip the photo-resist layer of a semiconductor or microelectronic composite structure previously subjected to a RIE process; supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber on which said structure is supported to form a water soluble material of saidwall polymer rails left behind on the Al/Cu metal line from the RIE process; and removing the water soluble material with deionized water.
    • 一种用于去除在半导体或微电子复合结构的Al / Cu金属线上的反应活性离子蚀刻侧壁聚合物轨道的方法,包括:1)将蚀刻气体和酸中和气体的混合物供应到真空室中,其中所述复合材料 结构被支撑以形成从RIE工艺在Al / Cu金属线上留下的侧壁聚合物轨道的水溶性材料; 用去离子水去除水溶性物质; 以及通过水纯等离子体工艺或化学下游蚀刻方法从所述复合结构中除去光致抗蚀剂; 或2)形成仅水性等离子体工艺以剥离先前经受RIE工艺的半导体或微电子复合结构的光致抗蚀剂层;将蚀刻气体和酸中和气体的混合物供应到真空室中,在真空室中, 被支撑以形成从RIE工艺在Al / Cu金属线上留下的所述壁聚合物轨道的水溶性材料; 并用去离子水去除水溶性物质。
    • 2. 发明授权
    • Removal of post-RIE polymer on Al/Cu metal line
    • 在Al / Cu金属线上去除RIE后聚合物
    • US5980770A
    • 1999-11-09
    • US061565
    • 1998-04-16
    • Ravikumar RamachandranWesley NatzleMartin GutscheHiroyuki AkatsuChien Yu
    • Ravikumar RamachandranWesley NatzleMartin GutscheHiroyuki AkatsuChien Yu
    • H01L21/302H01L21/02H01L21/3213C03C25/06C23F1/12
    • H01L21/02071H01L21/31138H01L21/32136Y10S438/906
    • A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising:1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure is supported to form a water soluble material of sidewall polymer rails left behind on the Al/Cu metal line from the RIE process; removing the water soluble material with deionized water; and removing photo-resist from said composite structure by either a water-only plasma process or a chemical down stream etching method; or2) forming a water-only plasma process to strip the photo-resist layer of a semiconductor or microelectronic composite structure previously subjected to a RIE process;supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber on which said structure is supported to form a water soluble material of saidwall polymer rails left behind on the Al/Cu metal line from the RIE process; andremoving the water soluble material with deionized water.
    • 一种用于去除在半导体或微电子复合结构的Al / Cu金属线上的反应活性离子蚀刻侧壁聚合物轨道的方法,包括:1)将蚀刻气体和酸中和气体的混合物供应到真空室中,其中所述复合材料 结构被支撑以形成从RIE工艺在Al / Cu金属线上留下的侧壁聚合物轨道的水溶性材料; 用去离子水去除水溶性物质; 以及通过水纯等离子体工艺或化学下游蚀刻方法从所述复合结构中除去光致抗蚀剂; 或2)形成仅水等离子体工艺以剥离先前经过RIE工艺的半导体或微电子复合结构的光致抗蚀剂层; 将一种蚀刻气体和酸中和气体的混合物供给到所述结构被支撑的真空室中,以形成从RIE工艺在Al / Cu金属管线上留下的所述壁聚合物轨道的水溶性材料; 并用去离子水除去水溶性物质。
    • 6. 发明授权
    • Apparatus and method for improved washing and drying of semiconductor
wafers
    • 用于改善半导体晶片的洗涤和干燥的装置和方法
    • US5934299A
    • 1999-08-10
    • US95985
    • 1998-06-11
    • Hiroyuki AkatsuRavikumar Ramachandran
    • Hiroyuki AkatsuRavikumar Ramachandran
    • H01L21/304H01L21/00B08B3/00
    • H01L21/67028H01L21/67023Y10S134/902
    • Apparatus and method are provided for improved washing and drying of semiconductor wafers utilizing an enhanced "Marangoni effect" flow of liquid off of the wafers for superior prevention of watermarks (water spots) on integrated circuits (ICs) on the wafers. The apparatus includes a housing 12 which may be hermetically sealed, an open-top wash tank 60 within a lower part of the housing, a moveable rack 16 for holding the wafers either in the tank for washing or in an upper part of the housing for drying, apparatus 34 for supplying chilled (near freezing) de-ionized water (DIW) to a lower part of the tank, the DIW flowing within the tank and overflowing the top thereof, a pump 20 for draining overflowing DIW from the housing, and apparatus 40 for supplying to the housing organic vapor such as isopropyl alcohol (IPA) in a dry gas such as nitrogen. During wafer drying operation of the apparatus the pressure within the housing is kept at about one Torr or less.
    • 提供了用于利用晶片的液体增强的“马兰戈尼效应”流动来改善半导体晶片的洗涤和干燥的装置和方法,以优越地防止晶片上的集成电路(IC)上的水印(水斑)。 该装置包括可以气密密封的壳体12,在壳体的下部内的开放式清洗罐60,用于将晶片保持在用于洗涤的罐中或在壳体的上部中的可移动的支架16 干燥装置34,用于向罐的下部供应冷冻(近冷冻)去离子水(DIW),DIW在罐内流动并溢出其顶部;泵20,用于从壳体排出溢流的DIW;以及 用于在诸如氮气的干燥气体中供应到壳体有机蒸气如异丙醇(IPA)的装置40。 在设备的晶片干燥操作期间,壳体内的压力保持在约1托或更低。
    • 7. 发明授权
    • Vertical semiconductor devices
    • 垂直半导体器件
    • US06887761B1
    • 2005-05-03
    • US10708647
    • 2004-03-17
    • Hiroyuki AkatsuThomas W. DyerRavikumar RamachandranKenneth T. Settlemyer, Jr.
    • Hiroyuki AkatsuThomas W. DyerRavikumar RamachandranKenneth T. Settlemyer, Jr.
    • H01L21/336H01L21/762H01L29/78H01I29/76
    • H01L29/66666H01L21/2257H01L21/76224H01L29/7827
    • A method and structure for increasing the threshold voltage of vertical semiconductor devices. The method comprises creating a deep trench in a substrate whose semiconductor material has an orientation plane perpendicular to the surface of the substrate. Then, vertical transistors are formed around and along the depth of the deep trench. Next, two shallow trench isolation are formed such that they sandwich the deep trench in an active region and the two shallow trench isolation regions abut the active region via planes perpendicular to the orientation plane. Then, the channel regions of the vertical transistors are exposed to the atmosphere in the deep trench and then chemically etched to planes parallel to the orientation plane. Then, a gate dielectric layer is formed on the wall of the deep trench. Finally, the deep trench is filled with poly-silicon to form the gate for the vertical transistors.
    • 一种用于增加垂直半导体器件的阈值电压的方法和结构。 该方法包括在其半导体材料具有垂直于衬底表面的取向平面的衬底中形成深沟槽。 然后,在深沟槽的深度周围形成垂直晶体管。 接下来,形成两个浅沟槽隔离,使得它们在有源区域中夹住深沟槽,并且两个浅沟槽隔离区域经由垂直于取向平面的平面邻接有源区。 然后,垂直晶体管的沟道区域暴露在深沟槽中的大气中,然后化学蚀刻到平行于取向平面的平面上。 然后,在深沟槽的壁上形成栅极电介质层。 最后,深沟槽充满多晶硅,形成垂直晶体管的栅极。
    • 9. 发明申请
    • SYSTEM AND METHOD FOR MANAGING WORKFLOW
    • 用于管理工作流的系统和方法
    • US20080052144A1
    • 2008-02-28
    • US11776151
    • 2007-07-11
    • Hiroyuki AkatsuKenji EdaYo MuraiTeruaki OkanoYasuharu YadaMasao Yamada
    • Hiroyuki AkatsuKenji EdaYo MuraiTeruaki OkanoYasuharu YadaMasao Yamada
    • G06F9/46
    • G06Q10/06G06Q10/063G06Q10/0633
    • A system and method for managing a workflow are provided. A system for managing a workflow in accordance with an embodiment of the invention includes: a storage unit for storing, as an access history for each of at least one artifact, identification information of a business process that has accessed the artifact; a request reception unit for receiving an access request to an artifact from a user; a first notification unit for retrieving an access history corresponding to a first artifact from the storage unit on a condition that a first access request received from the user corresponding to a first business process is an update request of the first artifact, and for notifying a user corresponding to the business process that is identified in the retrieved access history that the first artifact is to be updated; and a history adding unit for adding identification information of the first business process to the access history corresponding to the first artifact in response to an accessing of the first artifact based on the first access request.
    • 提供了一种用于管理工作流的系统和方法。 根据本发明的实施例的用于管理工作流的系统包括:存储单元,用于存储已访问所述工件的业务处理的识别信息作为至少一个工件中的每一个的访问历史; 请求接收单元,用于从用户接收对工件的访问请求; 第一通知单元,用于在从与第一业务处理对应的用户接收到的第一访问请求是第一伪像的更新请求的条件下从存储单元检索与第一伪像相对应的访问历史,并且用于通知用户 对应于在检索的访问历史中识别出的第一个工件将被更新的业务流程; 以及历史添加单元,用于响应于基于第一访问请求访问第一伪像,将第一业务处理的标识信息添加到与第一伪像相对应的访问历史。