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    • 1. 发明授权
    • Gate prespacers for high density, high performance DRAMs
    • 用于高密度,高性能DRAM的Gate Prepacers
    • US06326260B1
    • 2001-12-04
    • US09599703
    • 2000-06-22
    • Ramachandra DivakaruniJames William AdkissonMary Elizabeth WeybrightScott HalleJeffrey Peter GambinoHeon Lee
    • Ramachandra DivakaruniJames William AdkissonMary Elizabeth WeybrightScott HalleJeffrey Peter GambinoHeon Lee
    • H01L218242
    • H01L27/10894H01L21/823462H01L27/10873
    • A memory device structure is provided in which the array oxide layer has a thickness that is greater than the thickness of the support oxide layer. Specifically, the structure comprises a semiconductor substrate having a gate oxide layer formed thereon, said substrate including array regions and support regions, said array regions include at least one patterned gate conductor, said patterned gate conductor having a polysilicon layer formed on said gate oxide layer, a conductor material layer formed on said polysilicon layer, and a nitride cap layer formed on said conductor material layer, said nitride cap layer and said conductor material layer having spacers formed on sidewalls thereof and said polysilicon layer having an array oxide layer formed on sidewalls thereof, said spacers being substantially flush with the oxide sidewalls, said support regions include at least one patterned gate conductor, said patterned gate conductor having a polysilicon layer formed on said gate oxide layer, a conductor material layer formed on said polysilicon layer, and a nitride cap layer on said conductor material layer, said polysilicon layer having a support oxide layer formed on sidewalls thereof, wherein said array oxide layer has a thickness that is greater than said support oxide layer.
    • 提供了一种存储器件结构,其中阵列氧化物层的厚度大于支撑氧化物层的厚度。 具体地,该结构包括其上形成有栅极氧化层的半导体衬底,所述衬底包括阵列区域和支撑区域,所述阵列区域包括至少一个图案化栅极导体,所述图案化栅极导体具有形成在所述栅极氧化物层上的多晶硅层 形成在所述多晶硅层上的导体材料层和形成在所述导体材料层上的氮化物覆盖层,所述氮化物覆盖层和所述导体材料层具有形成在其侧壁上的隔离物,并且所述多晶硅层具有形成在侧壁上的阵列氧化物层 所述间隔件与氧化物侧壁基本齐平,所述支撑区域包括至少一个图案化栅极导体,所述图案化栅极导体具有形成在所述栅极氧化物层上的多晶硅层,形成在所述多晶硅层上的导体材料层,以及 所述多晶硅层在所述导体材料层上形成氮化物覆盖层 形成在其侧壁上的支撑氧化物层,其中所述阵列氧化物层的厚度大于所述支撑氧化物层。
    • 10. 发明授权
    • Protect diodes for hybrid-orientation substrate structures
    • 用于混合取向衬底结构的保护二极管
    • US07687340B2
    • 2010-03-30
    • US11849489
    • 2007-09-04
    • James William AdkissonJeffrey Peter GambinoAlain LoiseauKirk David Peterson
    • James William AdkissonJeffrey Peter GambinoAlain LoiseauKirk David Peterson
    • H01L21/8234
    • H01L27/1203H01L21/823807H01L21/823878H01L21/84H01L27/0255H01L27/0922H01L27/1207H01L29/045
    • A semiconductor structure fabrication method. First, a semiconductor structure is provided including (a) a semiconductor block having a first semiconductor material doped with a first doping polarity and having a first lattice orientation, and (b) a semiconductor region on the semiconductor block, wherein the semiconductor region is physically isolated from the semiconductor block by a dielectric region, and wherein the semiconductor region includes a second semiconductor material (i) doped with a second doping polarity opposite to the first doping polarity and (ii) having a second lattice orientation different from the first lattice orientation. Next, first and second gate stacks are formed on the semiconductor block and the semiconductor region, respectively. Then, (i) first and second S/D regions are simultaneously formed in the semiconductor block on opposing sides of the first gate stack and (ii) first and second discharge prevention semiconductor regions in the semiconductor block.
    • 半导体结构制造方法。 首先,提供半导体结构,其包括:(a)具有掺杂有第一掺杂极性且具有第一晶格取向的第一半导体材料的半导体块,以及(b)半导体块上的半导体区域,其中半导体区域是物理上的 并且其中所述半导体区域包括掺杂有与所述第一掺杂极性相反的第二掺杂极性的第二半导体材料(i)和(ii)具有不同于所述第一晶格取向的第二晶格取向 。 接下来,分别在半导体块和半导体区域上形成第一和第二栅极叠层。 然后,(i)第一和第二S / D区域同时形成在半导体块中的第一栅极堆叠的相对侧上,以及(ii)半导体块中的第一和第二放电预防半导体区域。