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1. 发明申请

US20140252645A1 THERMAL DESIGN AND ELECTRICAL ROUTING FOR MULTIPLE STACKED PACKAGES USING THROUGH VIA INSERT (TVI) 有权
标题翻译：使用通过插入（TVI）的多个堆叠包的热设计和电气路由
公开(公告)号：US20140252645A1
公开(公告)日：2014-09-11
申请号：US13787476
申请日：2013-03-06
申请人： QUALCOMM INCORPORATED
发明人： Dong Wook Kim , Victor A. Chiriac , Kyu-Pyung Hwang , Changhan Yun , Young K. Song
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/367 , H01L23/3677 , H01L23/5384 , H01L23/5385 , H01L23/5389 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2224/16 , H01L2224/16145 , H01L2224/16227 , H01L2225/06513 , H01L2225/06517 , H01L2225/06565 , H01L2924/0002 , H01L2924/15311 , H01L2924/00
摘要： Some implementations provide a semiconductor package structure that includes a package substrate, a first package, an interposer coupled to the first package, and a first set of through via insert (TVI). The first set of TVI is coupled to the interposer and the package substrate. The first set of TVI is configured to provide heat dissipation from the first package. In some implementations, the semiconductor package structure further includes a heat spreader coupled to the interposer. The heat spreader is configured to dissipate heat from the first package. In some implementations, the first set of TVI is further configured to provide an electrical path between the first package and the package substrate. In some implementations, the first package is electrically coupled to the package substrate through the interposer and the first set of TVI. In some implementations, the first set of TVI includes a dielectric layer and a metal layer.
摘要翻译：一些实施方案提供半导体封装结构，其包括封装衬底，第一封装，耦合到第一封装的插入器和第一组通孔插入件（TVI）。第一组TVI耦合到插入器和封装衬底。第一组TVI配置为提供第一包装散热。在一些实施方案中，半导体封装结构还包括耦合到插入件的散热器。散热器被配置为从第一包装散发热量。在一些实施方式中，第一组TVI被进一步配置成在第一封装和封装衬底之间提供电路径。在一些实施方案中，第一封装通过插入器和第一组TVI电耦合到封装衬底。在一些实施方案中，第一组TVI包括电介质层和金属层。

2. 发明申请

US20130286595A1 THERMAL MANAGEMENT FLOORPLAN FOR A MULTI-TIER STACKED IC PACKAGE 审中-公开
标题翻译：用于多层堆叠IC封装的热管理FLOORPLAN
公开(公告)号：US20130286595A1
公开(公告)日：2013-10-31
申请号：US13681409
申请日：2012-11-19
申请人： QUALCOMM INCORPORATED
发明人： Durodami J. Lisk , Victor A. Chiriac , Ratibor Rakojcic
IPC分类号： H05K13/00 , H05K7/20
CPC分类号： H05K13/00 , H01L23/36 , H01L23/433 , H01L25/0657 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H05K7/2039 , Y10T29/49124 , H01L2224/0401
摘要： A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.
摘要翻译：提供具有热管理平面布局的第一层模具，其具有热区域，该热区域具有用于热耦合到散热器的区域，第二层模具被提供成形并且尺寸设计成能够与第一层模具堆叠成多层堆叠并且当堆叠在多层堆叠中时，基本不与热区域重叠。提供散热器，并且布置热耦合元件，散热器，具有第一层管芯和第二层管芯的堆叠以及散热器，以形成多层堆叠集成电路。在该布置中，热耦合元件被定位成形成从第一层模具的热区域到散热器的热路径。

3. 发明授权

US09148979B2 Heat dissipating apparatus for folding electronic devices 有权
标题翻译：用于折叠电子设备的散热装置
公开(公告)号：US09148979B2
公开(公告)日：2015-09-29
申请号：US13706492
申请日：2012-12-06
申请人： QUALCOMM Incorporated
发明人： Victor A. Chiriac , Dexter T. Chun
IPC分类号： H05K7/20 , G06F1/20 , H05K13/04 , H01L23/473
CPC分类号： H05K7/20436 , G06F1/203 , G06F1/206 , G06F2200/203 , H05K13/04 , Y10T29/49117
摘要： Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.
摘要翻译：一些实施方案提供一种折叠电子设备，其包括基部，盖部分和耦合器。基部包括被配置为产生热量的区域。盖部分包括显示屏，散热部件和隔热部件。散热部件与显示屏共面。隔热部件与显示屏共面。隔热部件位于显示屏和散热部件之间。联接器用于将基部热耦合到盖部分。耦合器包括第一部件和第二部件。第一部件耦合到被配置为产生热量的区域。第二部件耦合到盖部分的散热部件。耦合器提供传递热量的路径。

4. 发明申请

US20140098489A1 HEAT DISSIPATING APPARATUS FOR FOLDING ELECTRONIC DEVICES 有权
标题翻译：用于折叠电子设备的散热装置
公开(公告)号：US20140098489A1
公开(公告)日：2014-04-10
申请号：US13706492
申请日：2012-12-06
申请人： QUALCOMM INCORPORATED
发明人： Victor A. Chiriac , Dexter T. Chun
IPC分类号： H05K7/20 , H05K13/04 , G06F1/20
CPC分类号： H05K7/20436 , G06F1/203 , G06F1/206 , G06F2200/203 , H05K13/04 , Y10T29/49117
摘要： Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.
摘要翻译：一些实施方案提供一种折叠电子设备，其包括基部，盖部分和耦合器。基部包括被配置为产生热量的区域。盖部分包括显示屏，散热部件和隔热部件。散热部件与显示屏共面。隔热部件与显示屏共面。隔热部件位于显示屏和散热部件之间。联接器用于将基部热耦合到盖部分。耦合器包括第一部件和第二部件。第一部件耦合到被配置为产生热量的区域。第二部件耦合到盖部分的散热部件。耦合器提供传递热量的路径。

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