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    • 3. 发明授权
    • Heterojunction bipolar transistor with self-aligned emitter and sidewall base contact
    • 具有自对准发射极和侧壁基极接触的异质结双极晶体管
    • US06924202B2
    • 2005-08-02
    • US10683142
    • 2003-10-09
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • H01L21/331H01L29/08H01L29/737
    • H01L29/66242H01L29/0817H01L29/7378
    • A heterojunction bipolar transistor (HBT), and manufacturing method therfor, comprising a semiconductor substrate having a collector region is provided. A base contact layer is formed over the collector region, and a base trench is formed in the base contact layer and the collector region. An intrinsic base structure having a sidewall portion and a bottom portion is formed in the base trench. An insulating spacer is formed over the sidewall portion of the intrinsic base structure, and an emitter structure is formed over the insulating spacer and the bottom portion of the intrinsic base structure. An interlevel dielectric layer is formed over the base contact layer and the emitter structure. Connections are formed through the interlevel dielectric layer to the collector region, the base contact layer, and the emitter structure. The intrinsic base structure is silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
    • 提供了具有集电极区域的半导体衬底的异质结双极晶体管(HBT)及其制造方法。 基极接触层形成在集电极区域上,基底沟槽形成在基极接触层和集电极区域中。 在基底沟槽中形成具有侧壁部分和底部的本征基底结构。 在本征基底结构的侧壁部分上形成绝缘间隔物,并且在绝缘间隔物和本征基底结构的底部上形成发射极结构。 在基极接触层和发射极结构之上形成层间电介质层。 通过层间绝缘层到集电极区,基极接触层和发射极结构形成连接。 本征基础结构是硅和硅 - 锗,硅 - 锗 - 碳及其组合中的至少一种。
    • 4. 发明授权
    • Self-aligned lateral heterojunction bipolar transistor
    • 自对准横向异质结双极晶体管
    • US06908824B2
    • 2005-06-21
    • US10703284
    • 2003-11-06
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • H01L21/331H01L29/737
    • H01L29/66242H01L29/737
    • A method for manufacturing a lateral heterojunction bipolar transistor (HBT) is provided comprising a semiconductor substrate having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
    • 提供一种用于制造横向异质结双极晶体管(HBT)的方法,包括半导体衬底上的第一绝缘层的半导体衬底。 基底沟槽形成在第一绝缘层上的第一硅层中,以在半导体衬底的暴露部分和第一绝缘层上的发射极层之上形成集电极层。 半导体层形成在基底沟槽的侧壁上,以形成与集电极层接触的集电极结构和与发射极层接触的发射极结构。 基底结构形成在基底沟槽中。 通过层间电介质层到集电极层,发射极层和基底结构形成多个连接。 基底结构优选是硅的化合物半导体材料和硅 - 锗,硅 - 锗 - 碳及其组合中的至少一种。
    • 5. 发明授权
    • Self-aligned lateral heterojunction bipolar transistor
    • 自对准横向异质结双极晶体管
    • US07238971B2
    • 2007-07-03
    • US11123748
    • 2005-05-04
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • Jian Xun LiLap ChanPurakh Raj VermaJia Zhen ZhengShao-fu Sanford Chu
    • H01L29/732
    • H01L29/66242H01L29/737
    • A lateral heterojunction bipolar transistor (HBT) comprising a semiconductor substrate having having a first insulating layer over the semiconductor substrate. A base trench is formed in a first silicon layer over the first insulating layer to form a collector layer over an exposed portion of the semiconductor substrate and an emitter layer over the first insulating layer. A semiconductive layer is formed on the sidewalls of the base trench to form a collector structure in contact with the collector layer and an emitter structure in contact with the emitter layer. A base structure is formed in the base trench. A plurality of connections is formed through an interlevel dielectric layer to the collector layer, the emitter layer, and the base structure. The base structure preferably is a compound semiconductive material of silicon and at least one of silicon-germanium, silicon-germanium-carbon, and combinations thereof.
    • 一种横向异质结双极晶体管(HBT),包括在半导体衬底上具有第一绝缘层的半导体衬底。 基底沟槽形成在第一绝缘层上的第一硅层中,以在半导体衬底的暴露部分和第一绝缘层上的发射极层之上形成集电极层。 半导体层形成在基底沟槽的侧壁上,以形成与集电极层接触的集电极结构和与发射极层接触的发射极结构。 基底结构形成在基底沟槽中。 通过层间电介质层到集电极层,发射极层和基底结构形成多个连接。 基底结构优选是硅的化合物半导体材料和硅 - 锗,硅 - 锗 - 碳及其组合中的至少一种。
    • 7. 发明授权
    • MOSFET device with low gate contact resistance
    • 具有低栅极接触电阻的MOSFET器件
    • US07382027B2
    • 2008-06-03
    • US11045958
    • 2005-01-28
    • Purakh Raj VermaSanford ChuLap ChanYelehanka PradeepKai ShaoJia Zhen Zheng
    • Purakh Raj VermaSanford ChuLap ChanYelehanka PradeepKai ShaoJia Zhen Zheng
    • H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L21/76802H01L21/76829
    • A CMOS RF device and a method to fabricate said device with low gate contact resistance are described. Conventional MOS transistor is first formed with isolation regions, poly-silicon gate structure, sidewall spacers around poly gate, and implanted source/drain with lightly and heavily doped regions. A silicon dioxide layer such as TEOS is deposited, planarized with chemical mechanical polishing (CMP) to expose the gate and treated with dilute HF etchant to recess the silicon dioxide layer below the surface of the gate. Silicon nitride is then deposited and planarized with CMP and then etched except around the gates, using a oversize poly-silicon gate mask. Inter-level dielectric mask is then deposited, contact holes etched, and contact metal is deposited to form the transistor. During contact hole etch over poly-silicon gate, silicon nitride around the poly gate acts as an etch stop. Resulting structure with direct gate contact achieves significantly reduced gate resistance and thereby improved noise performance at high frequency operation, increased unit power gain frequency (fmax), and reduced gate delay.
    • 描述CMOS RF器件和制造具有低栅极接触电阻的所述器件的方法。 传统的MOS晶体管首先形成有隔离区域,多晶硅栅极结构,围绕多晶硅栅极的侧壁隔离物以及具有轻掺杂和重掺杂区域的注入源极/漏极。 沉积诸如TEOS的二氧化硅层,通过化学机械抛光(CMP)平坦化以暴露栅极,并用稀的HF蚀刻剂处理以使位于栅极表面下方的二氧化硅层凹陷。 然后将氮化硅沉积并用CMP平坦化,然后使用超大型多晶硅栅极掩模在栅极周围进行蚀刻。 然后沉积层间电介质掩模,蚀刻接触孔,并沉积接触金属以形成晶体管。 在多晶硅栅极的接触孔蚀刻期间,多晶硅周围的氮化硅作为蚀刻停止。 具有直接栅极接触的所得结构实现了显着降低的栅极电阻,从而改善了高频操作下的噪声性能,增加的单位功率增益频率(f max)和减小的栅极延迟。
    • 8. 发明授权
    • Method of making direct contact on gate by using dielectric stop layer
    • 通过使用介电阻挡层在栅极上直接接触的方法
    • US06861317B1
    • 2005-03-01
    • US10664211
    • 2003-09-17
    • Purakh Raj VermaSanford ChuLap ChanYelehanka PradeepKai ShaoJia Zhen Zheng
    • Purakh Raj VermaSanford ChuLap ChanYelehanka PradeepKai ShaoJia Zhen Zheng
    • H01L21/00H01L21/3205H01L21/336H01L21/4763H01L21/768H01L21/84H01L29/76H01L29/94H01L31/062H01L31/113H01L31/119
    • H01L21/76802H01L21/76829
    • A CMOS RF device and a method to fabricate said device with low gate contact resistance are described. Conventional MOS transistor is first formed with isolation regions, poly-silicon gate structure, sidewall spacers around poly gate, and implanted source/drain with lightly and heavily doped regions. A silicon dioxide layer such as TEOS is deposited, planarized with chemical mechanical polishing (CMP) to expose the gate and treated with dilute HF etchant to recess the silicon dioxide layer below the surface of the gate. Silicon nitride is then deposited and planarized with CMP and then etched except around the gates, using a oversize poly-silicon gate mask. Inter-level dielectric mask is then deposited, contact holes etched, and contact metal is deposited to form the transistor. During contact hole etch over poly-silicon gate, silicon nitride around the poly gate acts as an etch stop. Resulting structure with direct gate contact achieves significantly reduced gate resistance and thereby improved noise performance at high frequency operation, increased unit power gain frequency (fmax), and reduced gate delay.
    • 描述CMOS RF器件和制造具有低栅极接触电阻的所述器件的方法。 传统的MOS晶体管首先形成有隔离区域,多晶硅栅极结构,围绕多晶硅栅极的侧壁隔离物以及具有轻掺杂和重掺杂区域的注入源极/漏极。 沉积诸如TEOS的二氧化硅层,通过化学机械抛光(CMP)平坦化以暴露栅极,并用稀的HF蚀刻剂处理以使位于栅极表面下方的二氧化硅层凹陷。 然后将氮化硅沉积并用CMP平坦化,然后使用超大型多晶硅栅极掩模在栅极周围进行蚀刻。 然后沉积层间电介质掩模,蚀刻接触孔,并沉积接触金属以形成晶体管。 在多晶硅栅极的接触孔蚀刻期间,多晶硅周围的氮化硅作为蚀刻停止。 具有直接栅极接触的所得结构实现了显着降低的栅极电阻,从而改善了高频操作时的噪声性能,增加的单位功率增益频率(fmax)和减小的栅极延迟。