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1. 发明公开

US20240355702A1 INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS 审中-公开
公开(公告)号：US20240355702A1
公开(公告)日：2024-10-24
申请号：US18756860
申请日：2024-06-27
申请人： Phil Geng , Donald Tiendung Tran , Srikant Nekkanty , Baris Bicen , James Trevor Goulding , Jeffory L. Smalley , Steven Adam Klein , Andres Ramirez Macias
发明人： Phil Geng , Donald Tiendung Tran , Srikant Nekkanty , Baris Bicen , James Trevor Goulding , Jeffory L. Smalley , Steven Adam Klein , Andres Ramirez Macias
IPC分类号： H01L23/367 , H01L23/00 , H01L23/498
CPC分类号： H01L23/367 , H01L23/49816 , H01L23/562
摘要： Integrated circuit packages with dampeners to reduce vibration effects are disclosed. An example apparatus comprises a substrate, a semiconductor die carried by the substrate, and a dampener carried by the substrate. Further, the example dampener is dimensioned to interface with a heatsink when the heatsink is thermally coupled to the semiconductor die.

2. 发明公开

US20240349457A1 DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS 审中-公开
公开(公告)号：US20240349457A1
公开(公告)日：2024-10-17
申请号：US18754759
申请日：2024-06-26
申请人： Phil Geng , David Shia , Donald Tiendung Tran , James Trevor Goulding , Jeffory L. Smalley , Ralph V. Miele , Sanjoy Kumar Saha , Jing-Hua He , Steven Adam Klein , Ethan Russell Long , Andres Ramirez Macias , Irving Joseph Castro Guzman
发明人： Phil Geng , David Shia , Donald Tiendung Tran , James Trevor Goulding , Jeffory L. Smalley , Ralph V. Miele , Sanjoy Kumar Saha , Jing-Hua He , Steven Adam Klein , Ethan Russell Long , Andres Ramirez Macias , Irving Joseph Castro Guzman
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20709
摘要： Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.

3. 发明公开

US20240179832A1 MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE 审中-公开
公开(公告)号：US20240179832A1
公开(公告)日：2024-05-30
申请号：US18435821
申请日：2024-02-07
申请人： Phil Geng , Xiaoning Ye , Yipeng Zhong , Meng Wang , Hongfei Yan , Chuansheng Liu , Lejie Liu , Mohanraj Prabhugoud , Fernando Gonzalez Lenero , Dongwang Chen , Sanjoy Saha , Ralph Miele , Baris Bicen , David Shia , Jeffory Smalley , Eric Erike
发明人： Phil Geng , Xiaoning Ye , Yipeng Zhong , Meng Wang , Hongfei Yan , Chuansheng Liu , Lejie Liu , Mohanraj Prabhugoud , Fernando Gonzalez Lenero , Dongwang Chen , Sanjoy Saha , Ralph Miele , Baris Bicen , David Shia , Jeffory Smalley , Eric Erike
IPC分类号： H05K1/02
CPC分类号： H05K1/0263 , H05K2201/10189 , H05K2201/2009
摘要： A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

4. 发明公开

US20240240688A1 MITIGATION OF SEISMIC EVENT EFFECTS ON LIQUID IMMERSION COOLING SYSTEMS 审中-公开
公开(公告)号：US20240240688A1
公开(公告)日：2024-07-18
申请号：US18620216
申请日：2024-03-28
申请人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
发明人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
IPC分类号： F16F9/50 , G01V1/36 , H05K7/20
CPC分类号： F16F9/50 , G01V1/36 , H05K7/20236 , H05K7/20272 , H05K7/20281 , F16F2230/08 , F16F2230/18 , G01V2210/144 , G01V2210/6222
摘要： In some embodiments, an immersion cooling system comprises a spring damper, a crumple block, a frictional layer, and/or preloaded spring-based mounts to mitigate the effects of seismic events. In other embodiments, the combined mass of liquids in the immersion tank and a compensation tank is kept constant to maintain the system's response to seismic events. In still other embodiments, an immersion cooling system comprises a tunable mass to provide an active response to seismic events. In yet other embodiments, an immersion tank is located within a housing pallet and is moveable within the palette. Spring dampers dampen tank movement within the pallet and shutoff switches housed in the pallet cause power to components in the tank to be shut off in response to tank movement. Cooling liquid can be transferred from the tank to a secondary reservoir to avoid cooling liquid loss and protect the tank.

5. 发明申请

US20050090040A1 Via-in-pad with off-center geometry and methods of manufacture 有权
标题翻译：具有偏心几何形状和制造方法的通孔
公开(公告)号：US20050090040A1
公开(公告)日：2005-04-28
申请号：US10994995
申请日：2004-11-22
申请人： Phil Geng , Stephen Joy
发明人： Phil Geng , Stephen Joy
IPC分类号： H05K3/42 , H01L23/12 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H05K3/3436 , H01L2224/81 , H05K1/113 , H05K3/0094 , H05K2201/0959 , H05K2201/10734 , H05K2203/1178 , Y02P70/613
摘要： The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.
摘要翻译：诸如集成电路（IC）的球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。根据电子组件的实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由放热热膨胀物质引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如来自通道的挥发性有机化合物（VOC）。接合焊盘被分成两组，每组具有沿不同方向偏移的通孔，使得在回流焊接操作期间熔融焊料中的不对称表面张力不会导致IC滑到一侧。还描述了基板，电子组件，电子系统和制造方法。

6. 发明授权

US06833615B2 Via-in-pad with off-center geometry 有权
标题翻译：带偏心几何的通孔
公开(公告)号：US06833615B2
公开(公告)日：2004-12-21
申请号：US09751614
申请日：2000-12-29
申请人： Phil Geng , Stephen C. Joy
发明人： Phil Geng , Stephen C. Joy
IPC分类号： H01L2304
CPC分类号： H05K3/3436 , H01L2224/81 , H05K1/113 , H05K3/0094 , H05K2201/0959 , H05K2201/10734 , H05K2203/1178 , Y02P70/613
摘要： The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. According to one embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. A substrate and an electronic system are also described.
摘要翻译：集成电路的诸如球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。根据电子组件的一个实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由膨胀膨胀物质的放气所引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如来自通道的挥发性有机化合物（VOC）。还描述了基板和电子系统。

7. 发明授权

US07208348B2 Methods of fabricating a via-in-pad with off-center geometry 有权
标题翻译：制造具有偏心几何形状的通孔的方法
公开(公告)号：US07208348B2
公开(公告)日：2007-04-24
申请号：US10994995
申请日：2004-11-22
申请人： Phil Geng , Stephen C. Joy
发明人： Phil Geng , Stephen C. Joy
IPC分类号： H01L21/48 , H01L23/48 , H05K7/10
CPC分类号： H05K3/3436 , H01L2224/81 , H05K1/113 , H05K3/0094 , H05K2201/0959 , H05K2201/10734 , H05K2203/1178 , Y02P70/613
摘要： The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.
摘要翻译：诸如集成电路（IC）的球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。根据电子组件的实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由放热热膨胀物质引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如来自通道的挥发性有机化合物（VOC）。接合焊盘被分成两组，每组具有沿不同方向偏移的通孔，使得在回流焊接操作期间熔融焊料中的不对称表面张力不会导致IC滑到一侧。还描述了基板，电子组件，电子系统和制造方法。

8. 发明授权

US06622905B2 Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias 有权
公开(公告)号：US06622905B2
公开(公告)日：2003-09-23
申请号：US09751433
申请日：2000-12-29
申请人： Daniel E. Shier , Phil Geng , Scott N. Dixon
发明人： Daniel E. Shier , Phil Geng , Scott N. Dixon
IPC分类号： B23K3102
CPC分类号： H05K3/3436 , B23K1/0016 , B23K1/085 , B23K2101/42 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/0347 , H01L2224/03618 , H01L2224/0401 , H01L2224/0557 , H01L2224/05647 , H01L2224/11428 , H01L2224/1147 , H01L2924/00011 , H01L2924/01322 , H05K1/114 , H05K2201/10734 , H05K2203/0455 , H05K2203/1178 , Y02P70/613 , H01L2924/00014 , H01L2224/81805
摘要： An apparatus, comprising a substrate having a surface, comprising one or more solder pads, each having a center and connected to a via, each via having a center; positioned relative to the surface such that at least one of the one or more solder pad centers is offset from the connecting via center and an area of the at least one of the one or more solder pads overlaps an area of the connecting via.

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