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1. 发明授权

US07208348B2 Methods of fabricating a via-in-pad with off-center geometry 有权
标题翻译：制造具有偏心几何形状的通孔的方法
公开(公告)号：US07208348B2
公开(公告)日：2007-04-24
申请号：US10994995
申请日：2004-11-22
申请人： Phil Geng , Stephen C. Joy
发明人： Phil Geng , Stephen C. Joy
IPC分类号： H01L21/48 , H01L23/48 , H05K7/10
CPC分类号： H05K3/3436 , H01L2224/81 , H05K1/113 , H05K3/0094 , H05K2201/0959 , H05K2201/10734 , H05K2203/1178 , Y02P70/613
摘要： The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.
摘要翻译：诸如集成电路（IC）的球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。根据电子组件的实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由放热热膨胀物质引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如来自通道的挥发性有机化合物（VOC）。接合焊盘被分成两组，每组具有沿不同方向偏移的通孔，使得在回流焊接操作期间熔融焊料中的不对称表面张力不会导致IC滑到一侧。还描述了基板，电子组件，电子系统和制造方法。

2. 发明授权

US06833615B2 Via-in-pad with off-center geometry 有权
标题翻译：带偏心几何的通孔
公开(公告)号：US06833615B2
公开(公告)日：2004-12-21
申请号：US09751614
申请日：2000-12-29
申请人： Phil Geng , Stephen C. Joy
发明人： Phil Geng , Stephen C. Joy
IPC分类号： H01L2304
CPC分类号： H05K3/3436 , H01L2224/81 , H05K1/113 , H05K3/0094 , H05K2201/0959 , H05K2201/10734 , H05K2203/1178 , Y02P70/613
摘要： The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. According to one embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. A substrate and an electronic system are also described.
摘要翻译：集成电路的诸如球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。根据电子组件的一个实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由膨胀膨胀物质的放气所引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如来自通道的挥发性有机化合物（VOC）。还描述了基板和电子系统。

3. 发明授权

US06395995B1 Apparatus for coupling integrated circuit packages to bonding pads having vias 有权
标题翻译：用于将集成电路封装耦合到具有通孔的焊盘的装置
公开(公告)号：US06395995B1
公开(公告)日：2002-05-28
申请号：US09525399
申请日：2000-03-15
申请人： Stephen C. Joy , Dan Shier
发明人： Stephen C. Joy , Dan Shier
IPC分类号： H05K116
CPC分类号： H05K3/3436 , H05K1/113 , H05K1/116 , H05K3/3484 , H05K2203/0455 , H05K2203/0545 , Y02P70/613 , Y10T29/49165
摘要： The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for of any shape, including a circle, ellipse, polygon, or a free-form shape. Solder paste is screened through the mask onto the printed circuit board pads but not the via channels. The electrical contacts of a surface mount technology component such as a ball grid array component can then be affixed to the bonding pads using a reflow soldering technique according to one embodiment.
摘要翻译：集成电路封装的电触点耦合到印刷电路板接合焊盘，其包括具有通孔的通孔。在一个实施例中，用于任何形状的方法，包括圆形，椭圆形，多边形或自由形状。将焊膏通过掩模屏蔽到印刷电路板焊盘上而不是通孔上。然后可以使用根据一个实施例的回流焊接技术将诸如球栅阵列部件的表面贴装技术部件的电触点固定到焊盘。

4. 发明授权

US06429389B1 Via-in-pad apparatus and methods 有权
标题翻译：通过焊盘装置和方法
公开(公告)号：US06429389B1
公开(公告)日：2002-08-06
申请号：US09712996
申请日：2000-11-15
申请人： Ji Yoon Chung , Stephen C. Joy
发明人： Ji Yoon Chung , Stephen C. Joy
IPC分类号： H01R909
CPC分类号： H01L24/81 , H01L23/49827 , H01L24/75 , H01L2224/75 , H01L2224/81801 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/014 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K3/3436 , H05K3/3489 , H05K2201/09481 , H05K2203/0455 , H05K2203/0485 , H05K2203/1178 , Y02P70/613 , H01L2924/00
摘要： The electrical contacts of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. A method for fabricating an electronic assembly utilizes at least one operation in which a thermally expansive substance, such as a volatile organic compound (VOC), is applied to the PCB. Some of the VOC goes into the via channels. The electrical contacts of a surface mount technology component such as a ball grid array (BGA) component are affixed to the bonding pads using a reflow soldering technique. According to one embodiment, the via channels are formed so as to inhibit bridging between adjacent BGAs during a solder reflow operation by minimizing outgassing of the VOC from the via channels. A substrate and an electronic system are also described.
摘要翻译：集成电路的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。一种用于制造电子组件的方法使用至少一种操作，其中将热膨胀性物质（例如挥发性有机化合物（VOC））施加到PCB。一些VOC进入通道。使用回流焊接技术将诸如球栅阵列（BGA）部件的表面安装技术部件的电触头固定到焊盘。根据一个实施例，形成通孔通道，以便通过使来自过孔通道的VOC的除气最小化来阻止焊料回流操作期间相邻BGA之间的桥接。还描述了基板和电子系统。

5. 发明授权

US07036712B2 Methods to couple integrated circuit packages to bonding pads having vias 失效
标题翻译：将集成电路封装耦合到具有通孔的焊盘的方法
公开(公告)号：US07036712B2
公开(公告)日：2006-05-02
申请号：US10118280
申请日：2002-04-08
申请人： Stephen C. Joy , Dan Shier
发明人： Stephen C. Joy , Dan Shier
IPC分类号： B23K31/02
CPC分类号： H05K3/3436 , H05K1/113 , H05K1/116 , H05K3/3484 , H05K2203/0455 , H05K2203/0545 , Y02P70/613 , Y10T29/49165
摘要： The electrical contacts of an integrated circuit package are coupled to printed circuit board bonding pads that include vias having via channels. In one embodiment, a method for fabricating an electronic assembly utilizes a mask having at least one aperture that overlies the bonding pad without substantially overlying the bonding pad's via channel. The aperture can be of any shape, including a circle, ellipse, polygon, or a free-form shape. Solder paste is screened through the mask onto the printed circuit board pads but not the via channels. The electrical contacts of a surface mount technology component such as a ball grid array component can then be affixed to the bonding pads using a reflow soldering technique according to one embodiment.
摘要翻译：集成电路封装的电触点耦合到印刷电路板接合焊盘，其包括具有通孔的通孔。在一个实施例中，一种用于制造电子组件的方法利用具有覆盖在焊盘上的至少一个孔的掩模，而基本上不覆盖焊盘的通孔。孔可以是任何形状，包括圆形，椭圆形，多边形或自由形状。将焊膏通过掩模屏蔽到印刷电路板焊盘上而不是通孔上。然后可以使用根据一个实施例的回流焊接技术将诸如球栅阵列部件的表面贴装技术部件的电触点固定到焊盘。

6. 发明授权

US6046909A Computer card with a printed circuit board with vias providing strength to the printed circuit board 有权
标题翻译：具有印刷电路板的计算机卡，其通孔为印刷电路板提供强度
公开(公告)号：US6046909A
公开(公告)日：2000-04-04
申请号：US192793
申请日：1998-11-16
申请人： Stephen C. Joy
发明人： Stephen C. Joy
IPC分类号： H05K1/11 , H05K3/46 , H05K1/18
CPC分类号： H05K1/112 , H05K2201/09227 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/10734 , H05K3/4602
摘要： A card for a computer is described which has a printed circuit board having a substrate which includes a number of layers, and vias extending into the substrate. By configuring the vias correctly they can be used for distributing stresses on the printed circuit board which may result from a combined effect of a change in temperature and a mismatch between thermal coefficients of the printed circuit board and an electronic device mounted to the printed circuit board. The vias may be configured by providing more deep vias which extend through more layers of the substrate, by positioning the deeper vias correctly, and by controlling the dimensions of contact pads which are connected to the vias. By correctly configuring the vias, stresses on the printed circuit board can be reduced to and extent which would allow for a substrate having fewer layers and having larger surface areas.
摘要翻译：描述了一种用于计算机的卡，其具有印刷电路板，该印刷电路板具有包括多个层的基板和延伸到基板中的通孔。通过正确地配置通孔，它们可以用于在印刷电路板上分布应力，这可能是由于温度变化和印刷电路板的热系数与安装到印刷电路板的电子装置之间的不匹配而产生的组合效应。可以通过提供更深的通孔来构造通孔，其通过正确地定位较深的通孔以及通过控制连接到通孔的接触焊盘的尺寸延伸穿过衬底的更多层。通过正确地配置通孔，印刷电路板上的应力可以减小到允许具有较少层并且具有较大表面积的基板的程度。

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