会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Low heat release polymeric composites
    • 低放热聚合物复合材料
    • US5490967A
    • 1996-02-13
    • US371332
    • 1995-01-11
    • Patrick H. MartinStephen E. BalesPeter K. KimRitchie A. Wessling
    • Patrick H. MartinStephen E. BalesPeter K. KimRitchie A. Wessling
    • B32B27/08C08K7/02B32B5/24
    • B32B27/08C08K7/02Y10T428/249962Y10T428/249964Y10T428/249989
    • This invention relates to a low heat release, low density, fiber-reinforced composite comprising a matrix comprising a thermoplastic polymer selected from the group consisting of polyarylsulfone, polyethersulfone, polyetheretherketone, polyetherketoneketone, a copolycarbonate of 4,4'-thiodiphenol and at least one member of the group consisting of bisphenol A, 9,9-bis(4-hydroxyphenyl) fluorene, and 1,1-bis-(4-hydroxyphenyl)-1-phenyl ethane, a copolycarbonate of bisphenol A and 9,9-bis(4-hydroxyphenyl) fluorene, 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane polycarbonate, bisphenol A polycarbonate, and polyetherimide, and from about 10 to about 70 percent by weight of the composite of randomly oriented reinforcing fibers, less than 0.5 inch in length, distributed throughout the matrix. The matrix has a void volume of from about 20 to about 90 percent by volume. The composite has a thermoplastic skin layer on each of the major surfaces thereof. A process for making the composite is also disclosed.
    • 本发明涉及一种低放热,低密度纤维增强复合材料,其包含基质,其包含选自聚芳基砜,聚醚砜,聚醚醚酮,聚醚酮酮,4,4'-硫代二酚的共聚碳酸酯和至少一种 由双酚A,9,9-双(4-羟基苯基)芴和1,1-双 - (4-羟基苯基)-1-苯基乙烷组成的组的成员,双酚A的共聚碳酸酯和9,9-双 (4-羟基苯基)芴,1,1-双(4-羟基苯基)-1-苯基乙烷聚碳酸酯,双酚A聚碳酸酯和聚醚酰亚胺,和约10至约70重量%的无规取向增强纤维的复合材料, 长度小于0.5英寸,分布在整个矩阵中。 基质具有约20至约90体积%的空隙体积。 复合材料在其每个主表面上具有热塑性表层。 还公开了制备复合材料的方法。
    • 4. 发明授权
    • Low heat release polymeric composites
    • 低放热聚合物复合材料
    • US5419957A
    • 1995-05-30
    • US245152
    • 1994-05-17
    • Patrick H. MartinPeter K. KimStephen E. BalesRitchie A. Wessling
    • Patrick H. MartinPeter K. KimStephen E. BalesRitchie A. Wessling
    • B32B27/08C08K7/02B32B5/24
    • B32B27/08C08K7/02Y10T428/249962Y10T428/249964Y10T428/249989
    • This invention relates to a low heat release, low density, fiber-reinforced composite comprising a matrix comprising a thermoplastic polymer selected from the group consisting of polyarylsulfone, polyethersulfone, polyetheretherketone, polyetherketoneketone, a copolycarbonate of 4,4'-thiodiphenol and at least one member of the group consisting of bisphenol A, 9,9-bis(4-hydroxyphenyl)fluorene, and 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane, a copolycarbonate of bisphenol A and 9,9-bis(4-hydroxyphenyl)fluorene, 1,1-bis(4-hydroxyphenyl)-1-phenyl ethane polycarbonate, bisphenol A polycarbonate, and polyetherimide, and from about 10 to about 70 percent by weight of the composite of randomly oriented reinforcing fibers, less than 0.5 inch in length, distributed throughout the matrix. The matrix has a void volume of from about 20 to about 90 percent by volume. The composite has a thermoplastic skin layer on each of the major surfaces thereof. A process for making the composite is also disclosed.
    • 本发明涉及一种低放热,低密度纤维增强复合材料,其包含基质,其包含选自聚芳基砜,聚醚砜,聚醚醚酮,聚醚酮酮,4,4'-硫代二酚的共聚碳酸酯和至少一种 由双酚A,9,9-双(4-羟基苯基)芴和1,1-双(4-羟基苯基)-1-苯基乙烷组成的组,双酚A的共聚碳酸酯和9,9-双( 4-羟基苯基)芴,1,1-双(4-羟基苯基)-1-苯基乙烷聚碳酸酯,双酚A聚碳酸酯和聚醚酰亚胺,和约10至约70重量%的无规取向增强纤维的复合材料 长度大于0.5英寸,分布在整个矩阵中。 基质具有约20至约90体积%的空隙体积。 复合材料在其每个主表面上具有热塑性表层。 还公开了制备复合材料的方法。