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    • 3. 发明授权
    • Backlight modulation over external display interfaces to save power
    • 背光调制通过外部显示接口节省电力
    • US09524681B2
    • 2016-12-20
    • US13996935
    • 2011-12-19
    • Maximino VasquezPaul WinerAkihiro Takagi
    • Maximino VasquezPaul WinerAkihiro Takagi
    • G09G3/34G09G3/20
    • G09G3/3406G09G3/2096G09G2320/064G09G2320/0646G09G2330/023G09G2354/00G09G2360/16G09G2370/047G09G2370/12
    • In general, in one aspect, an apparatus receives pixels associated with an image destined for an external display and determines a reduced backlight brightness for the external display and corresponding changes to the pixels to approximate overall quality of the image with current backlight brightness. Backlight commands are generated for the reduced backlight brightness and the pixels are enhanced to correspond to the reduced backlight brightness. The enhanced pixels and the backlight commands are transmitted to the external display via a display interface that supports backlight control. The display interface may be a wireless interface or a wired (cabled) interface (e.g., display port (DP), high definition multimedia interface (HDMI), video graphics array (VGA)). The functionality of the apparatus is included in a computing device so that backlight brightness reductions and corresponding pixel changes can be made taking into account policies of the computing device and user preferences.
    • 通常,在一个方面,一种装置接收与去往外部显示器的图像相关联的像素,并且确定用于外部显示器的降低的背光亮度和对像素的对应改变以近似具有当前背光亮度的图像的整体质量。 生成背光灯命令用于降低背光亮度,并增强像素以对应于降低的背光亮度。 增强像素和背光命令通过支持背光控制的显示接口传输到外部显示器。 显示接口可以是无线接口或有线(有线)接口(例如,显示端口(DP),高分辨率多媒体接口(HDMI),视频图形阵列(VGA))。 设备的功能包括在计算设备中,使得可以考虑计算设备的策略和用户偏好来进行背光亮度降低和相应的像素改变。
    • 6. 发明授权
    • Method and apparatus for fabricating encapsulated micro-channels in a substrate
    • 用于在衬底中制造封装的微通道的方法和装置
    • US06610605B2
    • 2003-08-26
    • US09895128
    • 2001-06-28
    • Jeremy A. RowlettePaul Winer
    • Jeremy A. RowlettePaul Winer
    • H01L21311
    • H01L33/00B81C1/00071H01L21/311H01L31/0328
    • A method for fabricating encapsulated micro-channels in a substrate is described. The method includes the formation of a thin film layer over an area of a substrate. Following the formation of the thin layer, a periodic array of access holes are formed within the thin film layer along dimensions of one or more desired micro-channels. Following formation of the access holes, the one or more micro-channels are formed, via the access holes, within an underlying layer of the substrate. Finally, the one or more micro-channels are encapsulated, thereby closing the one or more access holes along the dimensions of the desired micro-channels. Accordingly, the method is suitable in one context for rapid prototyping of micro-electromechanical systems in the areas of, for example, RF micro-systems, fluidic micro-systems and bio-fluidic applications. In addition, the method enables the rapid prototyping of integrated circuits.
    • 描述了在衬底中制造封装的微通道的方法。 该方法包括在衬底的区域上形成薄膜层。 在形成薄层之后,沿着一个或多个所需微通道的尺寸在薄膜层内形成周期性的存取孔阵列。 在形成接入孔之后,通过接入孔在衬底的下层内形成一个或多个微通道。 最后,一个或多个微通道被封装,从而沿着期望的微通道的尺寸闭合一个或多个访问孔。 因此,该方法适用于在例如RF微系统,流体微系统和生物流体应用领域中的微机电系统的快速成型的一个上下文中。 此外,该方法可以实现集成电路的快速原型设计。