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1. 发明授权

US07193854B2 Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly 有权
标题翻译：使用板簧将带有散热器的夹板连接到安装在印刷电路组件上的部件的两侧
公开(公告)号：US07193854B2
公开(公告)日：2007-03-20
申请号：US11120671
申请日：2005-05-02
申请人： Paul Bonomo , John Andberg
发明人： Paul Bonomo , John Andberg
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K7/20254
摘要： A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the printed circuit board in contact with the waterblock cooling device and the clamp plate. A method is disclosed for connecting together a heat sink assembly and a component, the method comprising inserting standoffs of a clamp plate through passage holes in a printed circuit board; inserting the standoffs of the clamp plate through clearance holes in a waterblock cooling device; and positioning a spring component in contact with the clamp plate and the waterblock cooling device so as to position the printed circuit board in contact with the waterblock cooling device and the printed circuit board in contact with the clamp plate.
摘要翻译：公开了一种用于冷却部件的散热器组件，散热器组件包括印刷电路板; 夹板; 水封冷却装置; 以及力连接部件，其将所述夹板和所述水封块冷却装置与所述印刷电路板连接，以与所述挡水板冷却装置和所述夹板接触。公开了一种用于将散热器组件和部件连接在一起的方法，该方法包括通过印刷电路板中的通孔插入夹板的支座; 将夹板的支座通过挡水板冷却装置中的间隙插入; 并且将弹簧部件定位成与所述夹板和所述水封块冷却装置接触，以使所述印刷电路板与所述挡水板冷却装置和所述印刷电路板接触所述夹板。

2. 发明申请

US20060245166A1 Using a leaf spring to attach clamp plates with a heat sink to both sides of a component mounted on a printed circuit assembly 有权
标题翻译：使用板簧将带有散热器的夹板连接到安装在印刷电路组件上的部件的两侧
公开(公告)号：US20060245166A1
公开(公告)日：2006-11-02
申请号：US11120671
申请日：2005-05-02
申请人： Paul Bonomo , John Andberg
发明人： Paul Bonomo , John Andberg
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K7/20254
摘要： A heat sink assembly for cooling a component is disclosed, the heat sink assembly comprising a printed circuit board; a clamp plate; a waterblock cooling device; and a force attachment component to attach the clamp plate and the waterblock cooling device with the printed circuit board in contact with the waterblock cooling device and the clamp plate. A method is disclosed for connecting together a heat sink assembly and a component, the method comprising inserting standoffs of a clamp plate through passage holes in a printed circuit board; inserting the standoffs of the clamp plate through clearance holes in a waterblock cooling device; and positioning a spring component in contact with the clamp plate and the waterblock cooling device so as to position the printed circuit board in contact with the waterblock cooling device and the printed circuit board in contact with the clamp plate.
摘要翻译：公开了一种用于冷却部件的散热器组件，散热器组件包括印刷电路板; 夹板; 水封冷却装置; 以及力连接部件，其将所述夹板和所述水封块冷却装置与所述印刷电路板连接，以与所述挡水板冷却装置和所述夹板接触。公开了一种用于将散热器组件和部件连接在一起的方法，该方法包括通过印刷电路板中的通孔插入夹板的支座; 将夹板的支座通过挡水板冷却装置中的间隙插入; 并且将弹簧部件定位成与所述夹板和所述水封块冷却装置接触，以使所述印刷电路板与所述挡水板冷却装置和所述印刷电路板接触所述夹板。

3. 发明授权

US07541824B2 Forced air cooling of components on a probecard 有权
标题翻译：强制风冷部件的问题
公开(公告)号：US07541824B2
公开(公告)日：2009-06-02
申请号：US11639010
申请日：2006-12-14
申请人： Romi Mayder , John Andberg
发明人： Romi Mayder , John Andberg
IPC分类号： G01R1/02
CPC分类号： G01R31/2877 , G11C29/56 , G11C29/56016
摘要： A probe card with an air channel over the active components for cooling the active components on the probe card is provided.
摘要翻译：提供了一种探针卡，其具有用于冷却探针卡上的有源部件的有源部件上的空气通道。

4. 发明申请

US20080143364A1 Forced air cooling of components on a probecard 有权
标题翻译：强制风冷部件的问题
公开(公告)号：US20080143364A1
公开(公告)日：2008-06-19
申请号：US11639010
申请日：2006-12-14
申请人： Romi Mayder , John Andberg
发明人： Romi Mayder , John Andberg
IPC分类号： G01R1/02
CPC分类号： G01R31/2877 , G11C29/56 , G11C29/56016
摘要： A probe card with an air channel over the active components for cooling the active components on the probe card is provided.
摘要翻译：提供了一种探针卡，其具有用于冷却探针卡上的有源部件的有源部件上的空气通道。

5. 发明申请

US20130285690A1 STIFFENER PLATE FOR A PROBECARD AND METHOD 有权
标题翻译：一个前提和方法的强化板
公开(公告)号：US20130285690A1
公开(公告)日：2013-10-31
申请号：US13878070
申请日：2011-01-18
申请人： John Andberg
发明人： John Andberg
IPC分类号： G01R1/073
CPC分类号： G01R1/07307 , G01R31/2886
摘要： A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.
摘要翻译：微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。加强件组件可以包括主体和多个安装点，其中至少一个安装点通过一个或多个横向延伸的梁柔性地连接到主体，所述梁具有垂直于横向方向的截面模数，大大地大于在横向上。加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。

6. 发明申请

US20070247140A1 Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array 有权
标题翻译：用于在测试仪与被测试的多个器件之间处理信号的装置，系统和方法在高温下并且具有探针阵列的单次触地
公开(公告)号：US20070247140A1
公开(公告)日：2007-10-25
申请号：US11410699
申请日：2006-04-24
申请人： Romi Mayder , Pam Stellmacher , Edmundo Puente , John Andberg
发明人： Romi Mayder , Pam Stellmacher , Edmundo Puente , John Andberg
IPC分类号： G01R31/28
CPC分类号： G01R31/2889
摘要： Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
摘要翻译：设备用于在测试仪和被测设备之间处理信号。在一个实施例中，该装置包括至少一个多芯片模块。每个多芯片模块在一组连接器与测试器之间具有多个微机电开关，以及一组连接器到被测器件。提供至少一个驱动器以操作每个微机电开关。公开了一种在测试仪和被测器件之间处理信号的方法。在一个实施例中，该方法包括用至少一个多芯片模块连接测试器和被测设备。所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。该方法包括操作每个微机电开关。还公开了其他实施例。

7. 发明申请

US20070089858A1 Waterblock for cooling electrical and electronic circuitry 审中-公开
标题翻译： Waterblock用于冷却电气和电子电路
公开(公告)号：US20070089858A1
公开(公告)日：2007-04-26
申请号：US11257669
申请日：2005-10-25
申请人： John Andberg , Noriyuki Sugihara
发明人： John Andberg , Noriyuki Sugihara
IPC分类号： F28F7/00
CPC分类号： H05K7/20218 , G01R31/2891
摘要： A waterblock and accompanying cooling tube for carrying away heat generated by electrical or electronic components mounted on a circuit board or other substrate are disclosed. The cooling tube is attached to the waterblock by means of an adhesive or other suitable material, and is not positioned in a groove machined into the surface of the waterblock as has been done in past. The unique design of the waterblock and cooling tube eliminates the need to machine expensive grooves in the waterblock, thereby reducing manufacturing costs.
摘要翻译：公开了一种用于承载由安装在电路板或其它基板上的电气或电子部件产生的热量的防水块和伴随的冷却管。冷却管通过粘合剂或其它合适的材料附接到水块上，并且不像以前已经进行的那样被放置在加工到水封面的凹槽中。水封和冷却管的独特设计消除了在防水块中加工昂贵的凹槽的需要，从而降低制造成本。

8. 发明授权

US07859277B2 Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array 有权
标题翻译：用于在测试仪与被测试的多个器件之间处理信号的装置，系统和方法在高温下并且具有探针阵列的单次触地
公开(公告)号：US07859277B2
公开(公告)日：2010-12-28
申请号：US11410699
申请日：2006-04-24
申请人： Romi Mayder , Pam Stellmacher , Edmundo Dela Puente , John Andberg
发明人： Romi Mayder , Pam Stellmacher , Edmundo Dela Puente , John Andberg
IPC分类号： G01R31/02
CPC分类号： G01R31/2889
摘要： Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
摘要翻译：设备用于在测试仪和被测设备之间处理信号。在一个实施例中，该装置包括至少一个多芯片模块。每个多芯片模块在一组连接器与测试器之间具有多个微机电开关，以及一组连接器到被测器件。提供至少一个驱动器以操作每个微机电开关。公开了一种在测试仪和被测器件之间处理信号的方法。在一个实施例中，该方法包括用至少一个多芯片模块连接测试器和被测设备。所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。该方法包括操作每个微机电开关。还公开了其他实施例。

9. 发明授权

US07501844B2 Liquid cooled DUT card interface for wafer sort probing 失效
标题翻译：用于晶圆分选探测的液冷DUT卡接口
公开(公告)号：US07501844B2
公开(公告)日：2009-03-10
申请号：US11638819
申请日：2006-12-14
申请人： John Andberg , Romi Mayder
发明人： John Andberg , Romi Mayder
IPC分类号： G01R31/02 , H05K7/20 , F28F7/00 , F28D15/00
CPC分类号： G01R31/2877 , G11C29/56 , G11C29/56016
摘要： A water block heat dissipation on a probe card interface for cooling active components and other devices requiring heat dissipation on the probe card is presented.
摘要翻译：提出了探针卡接口上的水块散热，用于冷却有源部件和其他需要在探针卡上散热的器件。

10. 发明申请

US20060132154A1 Wafer Burn-In and Test Employing Detachable Cartridge 有权
标题翻译：晶圆老化和测试使用可拆卸墨盒
公开(公告)号：US20060132154A1
公开(公告)日：2006-06-22
申请号：US11276314
申请日：2006-02-23
申请人： Frank Uher , John Andberg , Mark Carbone , Donald Richmond
发明人： Frank Uher , John Andberg , Mark Carbone , Donald Richmond
IPC分类号： G01R31/02
CPC分类号： G01R31/2865 , G01R1/0408 , G01R1/0491 , G01R31/2831 , G01R31/2855 , G01R31/2863 , G01R31/2886
摘要： A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card (50) that is movably mounted to the probe plate by means of a plurality of leaf springs (52.) The mechanical connecting device is preferably a kinematic coupling including a male connector (94) and first and second opposed jaws (122, 124.) Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force that pulls the chuck and probe plates together when the mechanical connecting device is engaged. To load a wafer into the cartridge, the wafer is placed on the chuck plate, the probe plate is aligned with the wafer, and the chuck plate and the probe plate are locked together. The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probe actuation force.
摘要翻译：盒（10）包括用于接收晶片（74）的卡盘板（12）和用于与晶片建立电接触的探针板（14）。在使用中，机械连接装置（90）相对于彼此固定的卡盘板和探针板锁定，以保持晶片和探针板的对准。优选地，使用通过多个板簧（52）可移动地安装到探针板的探针卡（50）来建立与晶片的电接触。机械连接装置优选地是包括公连接器（每个夹爪可以从缩回位置枢转，在该位置中，阳连接器可以插入到夹爪之间和卡合位置，在该接合位置，卡爪防止阳连接器从金属接头在颚之间阳连接器可在延伸位置和缩回位置之间移动，并且朝着缩回位置偏置。这提供了当夹持机械连接装置时将卡盘和探针板拉到一起的正夹紧力。为了将晶片装载到盒中，将晶片放置在夹盘上，探针板与晶片对准，夹盘和探针板被锁定在一起。然后可以将该盒从对准装置移除并放置在本身不需要用于对准晶片或提供探针致动力的装置的老化或测试室中。

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