会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • Wafer Burn-In and Test Employing Detachable Cartridge
    • 晶圆老化和测试使用可拆卸墨盒
    • US20060132154A1
    • 2006-06-22
    • US11276314
    • 2006-02-23
    • Frank UherJohn AndbergMark CarboneDonald Richmond
    • Frank UherJohn AndbergMark CarboneDonald Richmond
    • G01R31/02
    • G01R31/2865G01R1/0408G01R1/0491G01R31/2831G01R31/2855G01R31/2863G01R31/2886
    • A cartridge (10) includes a chuck plate (12) for receiving a wafer (74) and a probe plate (14) for establishing electrical contact with the wafer. In use, a mechanical connecting device (90) locks the chuck plate and the probe plate fixed relative to one another to maintain alignment of the wafer and the probe plate. Preferably, electrical contact with the wafer is established using a probe card (50) that is movably mounted to the probe plate by means of a plurality of leaf springs (52.) The mechanical connecting device is preferably a kinematic coupling including a male connector (94) and first and second opposed jaws (122, 124.) Each of the jaws is pivotable from a retracted position in which the male connector can be inserted between the jaws and an engaging position in which the jaws prevent withdrawal of the male connector from between the jaws. The male connector is movable between an extended and a retracted position, and is biased towards the retracted position. This provides a positive clamping force that pulls the chuck and probe plates together when the mechanical connecting device is engaged. To load a wafer into the cartridge, the wafer is placed on the chuck plate, the probe plate is aligned with the wafer, and the chuck plate and the probe plate are locked together. The cartridge can then be removed from the alignment device and placed in a burn-in or test chamber that does not itself require means for aligning the wafer or for providing a probe actuation force.
    • 盒(10)包括用于接收晶片(74)的卡盘板(12)和用于与晶片建立电接触的探针板(14)。 在使用中,机械连接装置(90)相对于彼此固定的卡盘板和探针板锁定,以保持晶片和探针板的对准。 优选地,使用通过多个​​板簧(52)可移动地安装到探针板的探针卡(50)来建立与晶片的电接触。机械连接装置优选地是包括公连接器( 每个夹爪可以从缩回位置枢转,在该位置中,阳连接器可以插入到夹爪之间和卡合位置,在该接合位置,卡爪防止阳连接器从金属接头 在颚之间 阳连接器可在延伸位置和缩回位置之间移动,并且朝着缩回位置偏置。 这提供了当夹持机械连接装置时将卡盘和探针板拉到一起的正夹紧力。 为了将晶片装载到盒中,将晶片放置在夹盘上,探针板与晶片对准,夹盘和探针板被锁定在一起。 然后可以将该盒从对准装置移除并放置在本身不需要用于对准晶片或提供探针致动力的装置的老化或测试室中。
    • 4. 发明申请
    • STIFFENER PLATE FOR A PROBECARD AND METHOD
    • 一个前提和方法的强化板
    • US20130285690A1
    • 2013-10-31
    • US13878070
    • 2011-01-18
    • John Andberg
    • John Andberg
    • G01R1/073
    • G01R1/07307G01R31/2886
    • A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.
    • 微电子接触器组件可以包括具有微电子接触器的探针头,用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括主体和多个安装点,其中至少一个安装点通过一个或多个横向延伸的梁柔性地连接到主体,所述梁具有垂直于横向方向的截面模数,大大地大于 在横向上。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀,同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。
    • 5. 发明申请
    • Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
    • 用于在测试仪与被测试的多个器件之间处理信号的装置,系统和方法在高温下并且具有探针阵列的单次触地
    • US20070247140A1
    • 2007-10-25
    • US11410699
    • 2006-04-24
    • Romi MayderPam StellmacherEdmundo PuenteJohn Andberg
    • Romi MayderPam StellmacherEdmundo PuenteJohn Andberg
    • G01R31/28
    • G01R31/2889
    • Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
    • 设备用于在测试仪和被测设备之间处理信号。 在一个实施例中,该装置包括至少一个多芯片模块。 每个多芯片模块在一组连接器与测试器之间具有多个微机电开关,以及一组连接器到被测器件。 提供至少一个驱动器以操作每个微机电开关。 公开了一种在测试仪和被测器件之间处理信号的方法。 在一个实施例中,该方法包括用至少一个多芯片模块连接测试器和被测设备。 所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。 该方法包括操作每个微机电开关。 还公开了其他实施例。
    • 7. 发明授权
    • Apparatus, systems and methods for processing signals between a tester and a plurality of devices under test at high temperatures and with single touchdown of a probe array
    • 用于在测试仪与被测试的多个器件之间处理信号的装置,系统和方法在高温下并且具有探针阵列的单次触地
    • US07859277B2
    • 2010-12-28
    • US11410699
    • 2006-04-24
    • Romi MayderPam StellmacherEdmundo Dela PuenteJohn Andberg
    • Romi MayderPam StellmacherEdmundo Dela PuenteJohn Andberg
    • G01R31/02
    • G01R31/2889
    • Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. A method of processing signals between a tester and devices under test is disclosed. In an embodiment, the method includes connecting the tester and the devices under test with at least one multichip module. Each of the at least one multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to the devices under test. The method includes operating each of the micro-electromechanical switches. Other embodiments are also disclosed.
    • 设备用于在测试仪和被测设备之间处理信号。 在一个实施例中,该装置包括至少一个多芯片模块。 每个多芯片模块在一组连接器与测试器之间具有多个微机电开关,以及一组连接器到被测器件。 提供至少一个驱动器以操作每个微机电开关。 公开了一种在测试仪和被测器件之间处理信号的方法。 在一个实施例中,该方法包括用至少一个多芯片模块连接测试器和被测设备。 所述至少一个多芯片模块中的每一个具有在到所述测试器的一组连接器之间的多个微机电开关和一组到所述被测器件的连接器。 该方法包括操作每个微机电开关。 还公开了其他实施例。
    • 9. 发明授权
    • Stiffener plate for a probecard and method
    • 加筋板用于问答和方法
    • US09128122B2
    • 2015-09-08
    • US13878070
    • 2011-01-18
    • John Andberg
    • John Andberg
    • G01R1/073G01R31/28
    • G01R1/07307G01R31/2886
    • A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.
    • 微电子接触器组件可以包括具有微电子接触器的探针头,用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括主体和多个安装点,其中至少一个安装点通过一个或多个横向延伸的梁柔性地连接到主体,所述梁具有垂直于横向方向的截面模数,大大地大于 在横向上。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀,同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。