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1. 发明申请

US20060072882A1 Optical communication module 有权
标题翻译：光通信模块
公开(公告)号：US20060072882A1
公开(公告)日：2006-04-06
申请号：US11235770
申请日：2005-09-27
申请人： Paolo Casati , Guido Chiaretti
发明人： Paolo Casati , Guido Chiaretti
IPC分类号： G02B6/36
CPC分类号： G02B6/4277 , G02B6/4204 , G02B6/4214 , G02B6/4246
摘要： The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.
摘要翻译：光通信模块可以耦合到至少一个光纤并且包括至少一个光电子器件，基底部分和盖部分，其可以连接到基部以限定用于容纳光电子器件的内部腔室。盖部分包括至少一个窗口，用于在至少一个设备和光纤之间耦合至少一个光信号。模块还包括对光信号基本透明的板，具有面向盖部的第一面和面对内室的第二侧，第一板基本上能够密封窗。屏蔽板可以连接到第二侧并且设置有至少一个与窗口大致对准的开口，以使得光信号能够通过。

2. 发明授权

US07192200B2 Optical communication module 有权
标题翻译：光通信模块
公开(公告)号：US07192200B2
公开(公告)日：2007-03-20
申请号：US11235770
申请日：2005-09-27
申请人： Paolo Casati , Guido Chiaretti
发明人： Paolo Casati , Guido Chiaretti
IPC分类号： G02B6/42 , G02B6/43
CPC分类号： G02B6/4277 , G02B6/4204 , G02B6/4214 , G02B6/4246
摘要： The optical communication module can be coupled to at least one optical fiber and includes at least one optoelectronic device, a base portion, and a cover portion which can be connected to the base portion to define an internal chamber to house the optoelectronic device. The cover portion includes at least one window to couple at least one optical signal between the at least one device and the optical fiber. The module further includes a plate, substantially transparent to the optical signal, having a first side facing the cover portion and a second side facing the internal chamber, the first plate substantially enabling sealing of the window. A shielding plate can be connected to the second side and provided with at least one opening substantially aligned with the window to enable passage of the optical signal.
摘要翻译：光通信模块可以耦合到至少一个光纤并且包括至少一个光电子器件，基底部分和盖部分，其可以连接到基部以限定用于容纳光电子器件的内部腔室。盖部分包括至少一个窗口，用于在至少一个设备和光纤之间耦合至少一个光信号。模块还包括对光信号基本透明的板，具有面向盖部的第一面和面对内室的第二侧，第一板基本上能够密封窗。屏蔽板可以连接到第二侧并且设置有至少一个与窗口大致对准的开口，以使得光信号能够通过。

3. 发明授权

US06473310B1 Insulated power multichip package 有权
标题翻译：绝缘电源多芯片封装
公开(公告)号：US06473310B1
公开(公告)日：2002-10-29
申请号：US09507558
申请日：2000-02-18
申请人： Paolo Casati , Carlo Cognetti
发明人： Paolo Casati , Carlo Cognetti
IPC分类号： H05K710
CPC分类号： H01L23/4334 , H01L21/565 , H01L25/0655 , H01L2224/48091 , H01L2224/49171 , H01L2924/00014
摘要： The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is directly coupled to at least two chips, without any intervening insulating layers. The slug is physically separated at an appropriate place between the two chips, so that electrical interference between the two chips is effectively eliminated. Making the integrated circuit package begins with directly attaching the two chips to a heat dissipating slug. The heat dissipating slug can have a pre-cut groove running between the chips. Once the chips are attached to the slug, the slug is molded into the multichip integrated circuit package. Then, the slug is physically separated into two pieces from the underside, the separation running along the pre-cut groove. Usually the slug would be separated by being cut by a saw.
摘要翻译：本发明包括具有彼此电隔离的至少两个芯片的多芯片集成电路封装。在多芯片集成电路封装内是直接耦合到至少两个芯片的芯片，没有任何中间绝缘层。芯片在两个芯片之间的适当位置物理分离，从而有效地消除了两个芯片之间的电气干扰。使集成电路封装开始于将两个芯片直接连接到散热片上。散热片可以在芯片之间运行预切割槽。一旦芯片连接到芯块上，芯块就被模制成多芯片集成电路封装。然后，将塞子从下侧物理分离成两片，分离沿着预切槽延伸。通常，锯屑将被锯切割而分离。

4. 发明授权

US4613460A Process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester 失效
标题翻译：制备α-L-天冬氨酰-L-苯丙氨酸甲酯的方法
公开(公告)号：US4613460A
公开(公告)日：1986-09-23
申请号：US661390
申请日：1984-10-16
申请人： Paolo Casati , Biagio Elefante , Claudio Fuganti
发明人： Paolo Casati , Biagio Elefante , Claudio Fuganti
IPC分类号： C07K1/113 , C07K5/075 , C07K5/06
CPC分类号： C07K5/0613
摘要： A process for preparing .alpha.-L-aspartyl-L-phenylalanine methyl ester: ##STR1## in which: (a) the compound methyl N(.alpha.-L-aspartyl).alpha.-aminocinnamate, protected at the nitrogen, of formula: ##STR2## where R is a protector group at the nitrogen, is subjected to hydrogenation at the olefin bond by means of gaseous hydrogen in the presence of a hydrogenation catalyst, to give the compound of formula: ##STR3## where R has the aforesaid meaning, in the form of a mixture of .alpha.-L-aspartyl-L-phenylalanine methyl ester protected at the nitrogen, and .alpha.-L-aspartyl-D-phenylalanine methyl ester protected at the nitrogen;(b) the protector group is removed from the .alpha.-L-aspartyl-L-phenylalanine and .alpha.-L-aspartyl-D-phenylalanine methyl esters protected at the nitrogen;(c) the .alpha.-L-aspartyl-L-phenylalanine methyl ester is separated and recovered from the deprotection reaction product.
摘要翻译：制备α-L-天冬氨酰基-L-苯丙氨酸甲酯的方法：其中：（a）在氮保护下的式（A）化合物甲基N（α-L-天冬氨酰基）α-氨基肉桂酸酯：其中R是氮的保护基，在氢化催化剂存在下，通过气态氢在烯烃键上进行氢化，得到下式的化合物：（IV））其中R具有上述含义，以氮保护的α-L-天冬氨酰基-L-苯丙氨酸甲酯和氮保护的α-L-天冬氨酰-D-苯丙氨酸甲酯的混合物形式; （b）保护基团从α-L-天冬氨酰基-L-苯丙氨酸和α-L-天冬氨酰-D-苯丙氨酸甲酯在氮气保护下除去; （c）从脱保护反应产物中分离并回收α-L-天冬氨酰基-L-苯丙氨酸甲酯。

5. 发明授权

US07459771B2 Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process 有权
标题翻译：在半导体芯片上形成的电子集成电路的组装结构和相应的制造过程
公开(公告)号：US07459771B2
公开(公告)日：2008-12-02
申请号：US10369114
申请日：2003-02-18
申请人： Paolo Casati , Amedeo Maierna , Bruno Murari
发明人： Paolo Casati , Amedeo Maierna , Bruno Murari
IPC分类号： H01L23/495
CPC分类号： H01L23/49568 , H01L23/4334 , H01L23/49503 , H01L23/552 , H01L2224/83855 , H01L2924/01079 , H01L2924/01322 , H01L2924/3025
摘要： An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.
摘要翻译：一种用于电子集成电力电路的组装结构，该电路制造在具有与所述集成电路相关联的多个接触焊盘并且电连接到所述结构的相应引线的半导体管芯上，其中屏蔽元件通过一层粘合剂材料。

6. 发明授权

US5244838A Process and apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device 失效
标题翻译：用于组装和树脂封装热沉式半导体功率器件的工艺和装置
公开(公告)号：US5244838A
公开(公告)日：1993-09-14
申请号：US784303
申请日：1991-10-31
申请人： Paolo Casati , Carlo C. De Martiis , Giuseppe Marchisi
发明人： Paolo Casati , Carlo C. De Martiis , Giuseppe Marchisi
IPC分类号： H01L21/56 , H01L23/433
CPC分类号： H01L23/4334 , H01L21/565 , H01L2924/0002 , Y10S425/228 , Y10T29/49121
摘要： A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.

7. 发明授权

US06002173A Semiconductor device package with metal-polymer joint of controlled roughness 失效
标题翻译：具有可控粗糙度的金属 - 聚合物接头的半导体器件封装
公开(公告)号：US06002173A
公开(公告)日：1999-12-14
申请号：US995747
申请日：1992-12-21
申请人： Paolo Casati , Pierangelo Magni , Giuseppe Marchisi
发明人： Paolo Casati , Pierangelo Magni , Giuseppe Marchisi
IPC分类号： H01L23/28 , H01L23/29 , H01L23/433 , H01L23/50 , H01L23/48 , H01L23/10
CPC分类号： H01L23/4334 , H01L2224/05554 , H01L2224/45144 , H01L2224/48247 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2924/01039 , H01L2924/01079 , H01L2924/12036 , H01L2924/14 , H01L2924/181
摘要： A structure is disclosed which comprises a metal plate, a chip of a semiconductor material attached to the plate, terminal leads, interconnection wires between the leads and the metallized regions of the chip, and a polymer body encapsulating all this with the exception of a surface of the plate and part of the leads. To achieve improved bond between the polymer and the metal, predetermined areas of the plate and the leads have a higher roughness than 1 (R.sub.a .gtoreq.1 .mu.m).
摘要翻译：公开了一种结构，其包括金属板，连接到板的半导体材料的芯片，端子引线，引线之间的互连线和芯片的金属化区域，以及除了表面之外封装所有这些的聚合物体的板和部分引线。为了实现聚合物和金属之间的改善的接合，板的预定区域和引线具有比1（Ra> / =1μm）更高的粗糙度。

8. 发明授权

US5445995A Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink 失效
标题翻译：制造具有外露金属散热片的塑料封装半导体器件的方法
公开(公告)号：US5445995A
公开(公告)日：1995-08-29
申请号：US994421
申请日：1992-12-21
申请人： Paolo Casati , Pierangelo Magni
发明人： Paolo Casati , Pierangelo Magni
IPC分类号： B29C45/14 , B29C45/26 , H01L21/00 , H01L21/56 , H01L23/29 , H01L23/433 , H05K3/34
CPC分类号： H01L21/67126 , H01L21/565 , H01L23/4334 , H05K3/341 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L24/73 , H01L2924/14 , H05K2201/10689 , H05K2201/10931 , H05K2201/10969 , Y02P70/613 , Y10T29/49121
摘要： A mold is disclosed for semiconductor devices intended for surface mounting, being of a type which comprises a metal plate and a body of solidified plastic resin. It consists of two plates which delimit at least one hollow adapted to receive the plate and to contain resin for forming the device body. Two elements of the mold push the plate from opposed sides against the bottom of the hollow. The hollow has two side extensions which are delimited by the side surfaces of the plate edges, thereby solidified projections are formed thereon which separate readily after the molding process. Thus, a structure is obtained wherein the plate has its bottom surface and two side edge portions fully exposed to allow optimum and controllable soldering to a printed circuit board.
摘要翻译：公开了用于表面安装的半导体器件的模具，其是包括金属板和固化塑料树脂体的类型。它包括两个板，它们限定至少一个适于容纳板的中空孔，并容纳用于形成装置主体的树脂。模具的两个元件将板从相对的侧面推压到中空的底部。中空具有由板边缘的侧表面限定的两个侧延伸部，由此在模制工艺之后容易地形成固化的突起。因此，获得了其中板具有其底表面并且两个侧边缘部分完全暴露以允许对印刷电路板进行最佳和可控焊接的结构。

9. 发明授权

US5370517A Apparatus for assembling and resin-encapsulating a heat sink-mounted semiconductor power device 失效
标题翻译：用于组装和树脂封装散热器安装的半导体功率器件的装置
公开(公告)号：US5370517A
公开(公告)日：1994-12-06
申请号：US45983
申请日：1993-04-09
申请人： Paolo Casati , Carlo C. De Martiis , Giuseppe Marchisi
发明人： Paolo Casati , Carlo C. De Martiis , Giuseppe Marchisi
IPC分类号： H01L21/56 , H01L23/433 , B29C , B29C45/14
CPC分类号： H01L23/4334 , H01L21/565 , H01L2924/0002 , Y10S425/228 , Y10T29/49121
摘要： A die-stamped frame is fastened to a heat sink metal baseplate by wedging flexible tabs into receiving indentations of the baseplate while keeping the frame substantially in contact with the surface of the baseplate. The wire welding operations may then take place on the end of the fingers of the patterned metal frame while the same are solidly resting on the surface of the baseplate thus facilitating the welding. The backing-off of the metal frame from the surface of the heat sink baseplate takes place upon the closing of the mold used for encapsulating in resin the device. The injection of the resin and its solidification "freezes" the pins in the backed-off position imposed by the mold upon closing, thus ensuring the electrical isolation between the pins and the integral heat sink baseplate.
摘要翻译：模压框架通过将柔性突片楔入接收底板的凹槽中而紧固到散热器金属底板上，同时保持框架基本上与基板的表面接触。然后，线焊接操作可以在图案化的金属框架的指状物的端部上发生，同时固定在基板的表面上，从而便于焊接。金属框架从散热器基板表面的脱落发生在用于封装在树脂中的模具的封闭件上。树脂的注入及其固化在关闭时由模具施加的退回位置中的销钉“冻结”，从而确保销和整体式散热器基板之间的电气隔离。

10. 发明授权

US5164378A Supersulfated heparins 失效
标题翻译：超级肝炎
公开(公告)号：US5164378A
公开(公告)日：1992-11-17
申请号：US618051
申请日：1990-11-26
申请人： Renato Conti , Paolo Casati , Maria B. Gorini , Antonio Maggi
发明人： Renato Conti , Paolo Casati , Maria B. Gorini , Antonio Maggi
IPC分类号： C08B37/10 , A61K31/715 , A61P7/02 , A61P9/10 , C08B37/00
CPC分类号： C08B37/0078
摘要： A process for the depolymerization and supersulfation of heparin and the so obtained supersulfated heparins are disclosed. The process comprises treating heparin with oleum containing from 2 to 6% free sulfuric anhydride at a temperature from -10.degree. to +20.degree. C. The obtained heparins have molecular weights from 2000 to 5000 and a sulfation degree from 3.4 to 4.3. All of them are endowed with a remarkable antithrombotic activity.

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