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1. 发明授权

US07235989B2 Electrical test device having isolation slot 有权
标题翻译：具有隔离槽的电气测试装置
公开(公告)号：US07235989B2
公开(公告)日：2007-06-26
申请号：US11233035
申请日：2005-09-23
申请人： Pao-Nan Li , Chih-Wei Tsai
发明人： Pao-Nan Li , Chih-Wei Tsai
IPC分类号： G01R31/02
CPC分类号： G01R1/06772
摘要： An electrical test device including a substrate and a plurality of test pads. The test pads are disposed on a second surface of the substrate. Each test pad has a test hole, and first and second isolation slots. The first isolation slot is disposed on the periphery of the test hole, and defines a signal region for connecting a signal terminal of a test probe. The second isolation slot is disposed on the periphery of the first isolation slot, and a ground region is defined between the first and second isolation slots. The ground region is used for connecting a ground terminal of the test probe. The test pad can match with the test probe so that the test probe can connect to the test pad for providing signal to the test probe. The electrical test device can easily measure the real electrical characteristic of the signal from the substrate.
摘要翻译：一种电测试装置，包括基板和多个测试垫。测试垫设置在基板的第二表面上。每个测试垫具有测试孔，以及第一和第二隔离槽。第一隔离槽设置在测试孔的周边，并且限定用于连接测试探针的信号端子的信号区域。第二隔离槽设置在第一隔离槽的周边上，并且在第一和第二隔离槽之间限定接地区域。接地区域用于连接测试探头的接地端子。测试垫可以与测试探针匹配，以便测试探头可以连接到测试垫，以便向测试探针提供信号。电气测试装置可以容易地测量来自衬底的信号的实际电特性。

2. 发明申请

US20060087333A1 Electrical test device having isolation slot 有权
标题翻译：具有隔离槽的电气测试装置
公开(公告)号：US20060087333A1
公开(公告)日：2006-04-27
申请号：US11233035
申请日：2005-09-23
申请人： Pao-Nan Li , Chih-Wei Tsai
发明人： Pao-Nan Li , Chih-Wei Tsai
IPC分类号： G01R31/02
CPC分类号： G01R1/06772
摘要： The invention relates to an electrical test device having isolation slot. The electrical test device comprises a substrate and a plurality of test pads. The test pads are disposed on a second surface of the substrate. Each test pads has a test hole, a first isolation slot and a second isolation slot. The first isolation slot is disposed on the periphery of the test hole, and defines a signal region for connecting a signal terminal of a test probe. The second isolation slot is disposed on the periphery of the first isolation slot, and a ground region is defined between the first isolation slot and the second isolation slot. The ground region is used for connecting a ground terminal of the test probe. The test pad of the invention can match with the test probe so that the test probe can connect to the test pad for providing signal to the test probe. Therefore, the electrical test device can be utilized to easily measure the real electrical characteristic of the signal from the substrate.
摘要翻译：本发明涉及具有隔离槽的电测试装置。电测试装置包括基板和多个测试垫。测试垫设置在基板的第二表面上。每个测试垫具有测试孔，第一隔离槽和第二隔离槽。第一隔离槽设置在测试孔的周边，并且限定用于连接测试探针的信号端子的信号区域。第二隔离槽设置在第一隔离槽的周边上，并且在第一隔离槽和第二隔离槽之间限定接地区域。接地区域用于连接测试探头的接地端子。本发明的测试垫可以与测试探针相匹配，使得测试探头可以连接到测试垫，以向测试探针提供信号。因此，电气测试装置可以用于容易地测量来自衬底的信号的实际电特性。

3. 发明申请

US20050248037A1 Flip-chip package substrate with a high-density layout 审中-公开
标题翻译：具有高密度布局的倒装芯片封装衬底
公开(公告)号：US20050248037A1
公开(公告)日：2005-11-10
申请号：US11123204
申请日：2005-05-06
申请人： Chih-Pin Hung , Pao-Nan Li , Hsueh-Te Wang , Yun-Hsiang Tien
发明人： Chih-Pin Hung , Pao-Nan Li , Hsueh-Te Wang , Yun-Hsiang Tien
IPC分类号： H01L21/48 , H01L23/28 , H01L23/498 , H01L23/52
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2224/81385 , H01L2924/0002 , H01L2924/00
摘要： A flip-chip package substrate with a high-density layout. A number of pads and a number of traces are formed on an upper surface of the substrate. At least a pad has a short axis and a vertical long axis which are perpendicular to each other. The distance between the elongated pad and the pad adjacent thereto is not smaller than two thirds of the length of the short axis, so that at least two of the traces can pass between the elongated pad and the pad adjacent thereto.
摘要翻译：具有高密度布局的倒装芯片封装基板。在基板的上表面上形成有多个焊盘和多个迹线。至少垫具有彼此垂直的短轴和垂直长轴。细长垫和与其相邻的垫之间的距离不小于短轴长度的三分之二，使得至少两条迹线可以在细长垫和与其相邻的垫之间通过。

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