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1. 发明授权

US5408482A Apparatus for and method of controlling the output of a laser source 失效
标题翻译：用于控制激光源输出的装置和方法
公开(公告)号：US5408482A
公开(公告)日：1995-04-18
申请号：US8622
申请日：1993-01-25
申请人： Osamu Nagano , Masanori Mizuno , Tsukasa Fukushima
发明人： Osamu Nagano , Masanori Mizuno , Tsukasa Fukushima
IPC分类号： B23K26/42 , H01S3/00 , H01S3/10 , H01S3/104 , H01S3/105 , H01S3/131 , H01S3/133
CPC分类号： H01S3/1312 , B23K26/702 , H01S3/10
摘要： An apparatus for and a method of controlling a laser oscillator for use as a laser source in a machining operation or the like is disclosed. In particular, the present invention compensates for a deviation of an actual input/output characteristic of a laser oscillator from a normal (expected) input/output characteristic due to, for example, aging and the like. The present invention approximates the actual input/output characteristic and stores the characteristic as a pattern in a storage device. In response to a detection of the actual laser output and an external intensity command signal, the present invention refers to the input/output characteristic pattern thus approximated and generates an input intensity command signal for controlling the laser oscillator to accurately produce the desired laser beam intensity irrespective of the deviation between the actual input/output characteristic and the normal characteristic.
摘要翻译：公开了一种在加工操作等中控制用作激光源的激光振荡器的装置和方法。特别地，本发明由于例如老化等而补偿激光振荡器的实际输入/输出特性与正常（预期）输入/输出特性的偏差。本发明近似于实际的输入/输出特性，并将特征作为图案存储在存储装置中。响应于实际激光输出的检测和外部强度指令信号，本发明参考如此近似的输入/输出特性图案，并且产生用于控制激光振荡器以精确地产生所需激光束强度的输入强度指令信号而与实际输入/输出特性与正常特性之间的偏差无关。

2. 发明授权

US5638389A Output control apparatus for laser oscillator 失效
标题翻译：激光振荡器输出控制装置
公开(公告)号：US5638389A
公开(公告)日：1997-06-10
申请号：US520643
申请日：1995-08-29
申请人： Osamu Nagano , Tsukasa Fukushima
发明人： Osamu Nagano , Tsukasa Fukushima
IPC分类号： H01S3/13 , H01S3/00 , H01S3/131 , H01S3/134
CPC分类号： H01S3/131 , H01S3/134
摘要： A laser oscillator is connected to a power supply device for supplying excitation power to the laser oscillator and a detector is connected to detect the intensity of a laser beam output by the laser oscillator. An apparatus is provided for measuring the resistance value of the detector. A control circuit is operative to provide constant laser power control in response to the detector output under normal conditions but when the output signal of the measuring apparatus indicates a failure, the constant laser output control is changed to the constant power control. The apparatus prevents a constant laser output control from being disabled and workpieces from being defective if the output detector property of a laser changes abruptly.
摘要翻译：激光振荡器连接到用于向激光振荡器提供激励功率的电源装置，并且连接检测器以检测由激光振荡器输出的激光束的强度。提供了一种用于测量检测器的电阻值的装置。控制电路可操作以在正常条件下响应于检测器输出提供恒定的激光功率控制，但是当测量装置的输出信号指示故障时，恒定的激光输出控制变为恒功率控制。如果激光器的输出检测器特性突然变化，则该装置可以防止激光输出控制不被禁用，并且工件不会有故障。

3. 发明授权

US5499257A Output control apparatus for laser oscillator 失效
标题翻译：激光振荡器输出控制装置
公开(公告)号：US5499257A
公开(公告)日：1996-03-12
申请号：US178002
申请日：1994-01-06
申请人： Osamu Nagano , Tsukasa Fukushima
发明人： Osamu Nagano , Tsukasa Fukushima
IPC分类号： H01S3/13 , H01S3/00 , H01S3/131 , H01S3/134
CPC分类号： H01S3/131 , H01S3/134
摘要： A laser oscillator is connected to a power supply device for supplying excitation power to the laser oscillator and a detector is connected to detect the intensity of a laser beam output by the laser oscillator. An apparatus is provided for measuring the resistance value of the detector. A control circuit is operative to provide constant laser power control in response to the detector output under normal conditions but when the output signal of the measuring apparatus indicates a failure, the constant laser output control is changed to the constant power control. The apparatus prevents a constant laser output control from being disabled and workpieces from being defective if the output detector property of a laser changes abruptly.
摘要翻译：激光振荡器连接到用于向激光振荡器提供激励功率的电源装置，并且连接检测器以检测由激光振荡器输出的激光束的强度。提供了一种用于测量检测器的电阻值的装置。控制电路可操作以在正常条件下响应于检测器输出提供恒定的激光功率控制，但是当测量装置的输出信号指示故障时，恒定的激光输出控制变为恒功率控制。如果激光器的输出检测器特性突然变化，则该装置可以防止激光输出控制不被禁用，并且工件不会有故障。

4. 发明授权

US06972392B2 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board 失效
标题翻译：接线板激光加工方法，接线板激光加工装置，加工布线板用碳酸气体激光振荡器
公开(公告)号：US06972392B2
公开(公告)日：2005-12-06
申请号：US09994719
申请日：2001-11-28
申请人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
发明人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
IPC分类号： B23K26/38 , H05K3/00
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554 , H05K2203/081
摘要： In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 μs and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.
摘要翻译：在布线基板的激光加工方法中，通过脉冲激光束照射约10〜约200μA的束照射时间，能量密度约为20J / cm·SUP的布线基板的加工部 > 2以上，从而对布线板进行加工，例如钻孔，通孔和盲孔，切槽，切割成外形。

5. 发明授权

US5961857A Laser machining apparatus with feed forward and feedback control 失效
标题翻译：具有前馈和反馈控制的激光加工设备
公开(公告)号：US5961857A
公开(公告)日：1999-10-05
申请号：US928080
申请日：1997-09-12
申请人： Teiji Takahashi , Yoshihito Imai , Atsushi Morita , Masato Matsubara , Osamu Nagano , Tsukasa Fukushima
发明人： Teiji Takahashi , Yoshihito Imai , Atsushi Morita , Masato Matsubara , Osamu Nagano , Tsukasa Fukushima
IPC分类号： B23K26/00 , B23K26/42 , H01S3/00 , H01S3/097 , H01S3/102 , H01S3/104 , H01S3/131 , H01S3/134
CPC分类号： H01S3/134 , B23K26/702 , H01S3/102 , H01S3/104
摘要： A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.
摘要翻译：根据本发明的激光加工设备描述具有包括激光功率，脉冲频率和占空比的功能的激光振荡器的特性，根据基于功能的命令计算前馈控制部分中的电源单元的命令并且根据功率，占空比和频率，根据来自功率传感器的功率指令值和功率测量值计算反馈控制部分中的电源单元的命令，并将这些命令输入到电源单元。此外，激光加工装置检测激光振荡器的特性变化，并校正激光振荡器的特性的功能。

6. 发明授权

US5841096A Laser machining apparatus and method of controlling same 失效
标题翻译：激光加工装置及其控制方法
公开(公告)号：US5841096A
公开(公告)日：1998-11-24
申请号：US928226
申请日：1997-09-12
申请人： Teiji Takahashi , Yoshihito Imai , Atsushi Morita , Masato Matsubara , Osamu Nagano , Tsukasa Fukushima
发明人： Teiji Takahashi , Yoshihito Imai , Atsushi Morita , Masato Matsubara , Osamu Nagano , Tsukasa Fukushima
IPC分类号： B23K26/00 , B23K26/42 , H01S3/00 , H01S3/097 , H01S3/102 , H01S3/104 , H01S3/131 , H01S3/134
CPC分类号： H01S3/134 , B23K26/702 , H01S3/102 , H01S3/104
摘要： A laser machining apparatus according to the present invention describes characteristics of a laser oscillator with a function including laser power, pulse frequency and duty ratio, computes a command for a power supply unit in a feed forward control section according to a command based on the function and on the power, duty ratio and frequency, computes a command for a power supply unit in the feedback control section from a power command value and a power measurement value from the power sensor, and inputs these command to the power supply unit. Also the laser machining apparatus detects changes in characteristics in the laser oscillator and corrects the function for characteristics of the laser oscillator.
摘要翻译：根据本发明的激光加工设备描述具有包括激光功率，脉冲频率和占空比的功能的激光振荡器的特性，根据基于功能的命令计算前馈控制部分中的电源单元的命令并且根据功率，占空比和频率，根据来自功率传感器的功率指令值和功率测量值计算反馈控制部分中的电源单元的命令，并将这些命令输入到电源单元。此外，激光加工装置检测激光振荡器的特性变化，并校正激光振荡器的特性的功能。

7. 发明申请

US20050184035A1 Pulsed laser beam machining method and apparatus for machining a wiring board at multiple locations 审中-公开
标题翻译：脉冲激光束加工方法和装置，用于在多个位置加工布线板
公开(公告)号：US20050184035A1
公开(公告)日：2005-08-25
申请号：US11087568
申请日：2005-03-24
申请人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
发明人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
IPC分类号： B23K26/38 , H05K3/00
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554 , H05K2203/081
摘要： In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to 200 μs and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape. The laser beam operates at a frequency of more than 67 Hz, and the spot of the laser beam is sequentially moved to different drilling positions for each pulse. After all of many drilling positions in the range of a scan vision are irradiated with the laser beam pulse by pulse, or after the elapse of a time of 15 ms or more from irradiation of the first drilling position, the laser spot is returned to the first drilling position. The spot is sequentially moved once again, and the movement is repeated several times. A pause of 15 ms or more is required between pulses directed to the same drilling position to avoid formation of a thick char layer and projection of glass cloth into the hole.
摘要翻译：在布线基板的激光加工方法中，对于线束板的加工部照射约10〜200μm的束照射时间的脉冲激光束，能量密度约为20J / 2以上，从而对布线板进行加工，例如钻孔，通孔和盲孔，切槽和切割成外形。激光束以大于67Hz的频率工作，并且激光束的光点顺序地移动到每个脉冲的不同的钻孔位置。在扫描视野范围内的所有许多钻孔位置用脉冲照射激光束脉冲之后，或者在从第一钻孔位置照射经过15ms以上的时间之后，激光点返回到第一钻孔位置。点再次依次移动，运动重复多次。在指向相同钻孔位置的脉冲之间需要15ms或更长的暂停，以避免形成厚的炭层并将玻璃布投射到孔中。

8. 发明授权

US06373026B1 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board 失效
公开(公告)号：US06373026B1
公开(公告)日：2002-04-16
申请号：US09549498
申请日：2000-04-14
申请人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
发明人： Miki Kurosawa , Tsukasa Fukushima , Masanori Mizuno , Shozui Takeno , Masaharu Moriyasu , Masayuki Kaneko
IPC分类号： B23K2638
CPC分类号： H05K3/0032 , B23K26/389 , H05K2203/0554 , H05K2203/081
摘要： In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm2 or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.

9. 发明授权

US5933218A Laser beam machining apparatus 失效
标题翻译：激光束加工设备
公开(公告)号：US5933218A
公开(公告)日：1999-08-03
申请号：US740956
申请日：1996-11-05
申请人： Masato Matsubara , Tsukasa Fukushima , Miki Kurosawa
发明人： Masato Matsubara , Tsukasa Fukushima , Miki Kurosawa
IPC分类号： B23K26/06 , B23K26/067 , B23K26/38 , B23K101/42 , G03F7/20 , H05K3/00 , G03B27/54 , H01S3/098
CPC分类号： B23K26/0673 , B23K26/066 , B23K26/067 , B23K26/382 , B23K26/386 , B23K26/40 , B23K2203/08 , B23K2203/12 , B23K2203/172 , G03F7/2006 , H05K3/0017
摘要： A laser beam machining apparatus including an image-transfer optical system having a mask inserted in an optical path between a laser oscillator and a workpiece, and a lens for reducing and forming an image of the mask on a processing surface; a focusing optical system; a drive unit for selecting one of the image-transfer optical system and the focusing optical system; and a numerical controller for controlling the image-transfer optical system, the focusing optical system, and the drive unit, wherein one of the image-transfer optical system and the focusing optical system is selected in correspondence with the diameter and depth of a hole to be processed.
摘要翻译：一种激光束加工设备，包括具有插入在激光振荡器和工件之间的光路中的掩模的图像转移光学系统和用于在处理表面上减小和形成掩模的图像的透镜; 聚焦光学系统; 用于选择图像转印光学系统和聚焦光学系统之一的驱动单元; 以及用于控制图像转印光学系统，聚焦光学系统和驱动单元的数字控制器，其中，所述图像转印光学系统和聚焦光学系统之一根据孔的直径和深度来选择被处理。

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