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    • 3. 发明授权
    • Thermoelectric module with interarray bridges
    • 带电桥的热电模块
    • US06400013B1
    • 2002-06-04
    • US09709577
    • 2000-11-13
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • H01L2334
    • H01L35/325H01L35/32H01L2924/0002H01L2924/00
    • A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
    • 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片,以形成串联电路。 芯片被布置成给出至少三个芯片阵列,每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥,以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥,其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧,形成多个第二桥,每个第二桥整体地连接两个相邻的第二触点,以给出第二离散耦合,用于电连接每个芯片阵列中的两个相邻的芯片。 因此,阵列间桥仅形成在芯片的一侧,用于相邻芯片阵列之间的第一触点的互连。 因此,施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。
    • 4. 发明授权
    • Thermoelectric module and a method of fabricating the same
    • 热电模块及其制造方法
    • US06391676B1
    • 2002-05-21
    • US09200972
    • 1998-11-30
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • Michimasa TsuzakiNobuteru MaekawaNarimasa IwamotoJunji ImaiHiroaki OkadaTeruaki KomatsuShinya MuraseHiroyuki InoueMasayuki SagawaYuri Sakai
    • H01L2100
    • H01L35/325H01L35/32H01L2924/0002H01L2924/00
    • A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.
    • 热电模块能够成功地降低热应力以提高可靠性。 该模块包括在第一和第二触点组之间以矩阵形式布置的多个P型和N型热电芯片,以形成串联电路。 芯片被布置成给出至少三个芯片阵列,每个芯片阵列具有有限数量的芯片。 第一载体设置在芯片的一侧以承载第一触点并且包括每个一体地连接两个相邻的第一触点的第一桥,以限定用于每个芯片阵列中的芯片的电连接的第一离散耦合。 第一载体还包括至少两个排列间桥,其单独负责相邻芯片阵列之间的电互连。 在芯片的相对侧,形成多个第二桥,每个第二桥整体地连接两个相邻的第二触点,以给出第二离散耦合,用于电连接每个芯片阵列中的两个相邻的芯片。 因此,阵列间桥仅形成在芯片的一侧,用于相邻芯片阵列之间的第一触点的互连。 因此,施加到两个相邻芯片阵列相互连接的芯片阵列的端部的热应力可以在第二接触件的一侧彼此完全隔离的第二触头侧得到很好的缓解。
    • 5. 发明授权
    • Mobile radio communication system
    • 移动无线电通信系统
    • US07804395B2
    • 2010-09-28
    • US12076528
    • 2008-03-19
    • Junya MuramatsuSatoshi MakidoJunji ImaiKenji ItoYukihiro Tadokoro
    • Junya MuramatsuSatoshi MakidoJunji ImaiKenji ItoYukihiro Tadokoro
    • B60Q1/00
    • G01S11/06G01S5/0252G08G1/163
    • A mobile radio communication system estimates the positional relationship between an own moving terminal and another moving terminal around a view obstruction. If the absolute value of the difference between detected reception power levels is lower than a first power threshold value, the own moving terminal determines that the other moving terminal is positioned within the visual range of the own moving terminal, the distance from the own moving terminal to the other moving terminal being shorter than a predetermined distance BP, or that the other moving terminal is positioned outside thereof, the distance to the visual range of the own moving terminal being shorter than the predetermined distance BP. Also if the absolute value is higher than or equal to the first power threshold value, the own moving terminal determines in a similar manner.
    • 移动无线电通信系统估计自身的移动终端与视线障碍物周围的另一移动终端之间的位置关系。 如果检测到的接收功率电平之差的绝对值低于第一功率阈值,则本身的移动终端确定另一个移动终端位于本身的移动终端的视野内,距离自身的移动终端 到另一个移动终端短于预定距离BP,或者另一个移动终端位于其外部,距离本身移动终端的视野范围的距离短于预定距离BP。 此外,如果绝对值高于或等于第一功率阈值,则本身的移动终端以类似的方式确定。
    • 7. 发明授权
    • Ferrous alloy with Fe-Al diffusion layer and method of making the same
    • 含Fe-Al扩散层的铁合金及其制造方法
    • US5981089A
    • 1999-11-09
    • US650520
    • 1996-05-20
    • Junji ImaiTadashi HamadaShuji YamadaHiroshi YamadaFumio Iwane
    • Junji ImaiTadashi HamadaShuji YamadaHiroshi YamadaFumio Iwane
    • C23C2/12C23C10/28C23C26/00B32B15/01
    • C23C2/12C23C10/28C23C26/00Y10T428/12861
    • A ferrous alloy is formed with a Fe--Cr stainless steel having a Vickers hardness of 400 or more as a substrate and a Fe--Al diffusion layer having a thickness of 2 to 50 .mu.m. The diffusion layer contains at least 90 vol % of an intermetallic compound of Al and Fe relative to a total volume of the diffusion layer. The Al content included within a depth of at least 2 .mu.m of the diffusion layer is 35 to 65% by weight based upon total weight of a region of the diffusion layer ranging up to the thickness of at least 2 .mu.m. It is preferred to use as the substrate a precipitation-hardening stainless steel comprising 66 to 81.9 wt % of Fe, 15 to 20 wt % of Cr, 3 to 13 wt % of Ni, and one element selected from 3 to 6 wt % of Cu, 0.5 to 2 wt % of Al, and 0.01 to 0.2 wt % of a total of C and N, or a high carbon stainless steel comprising 73 to 89.9 wt % of Fe, 10 to 19 wt % of Cr, 0.1 to 1.2 wt % of C, and less than 3 wt % of Ni. The ferrous alloy may be used for sliding parts such as gears or bearings, and blades of electric shavers or hair clippers.
    • 使用维氏硬度为400以上的Fe-Cr不锈钢作为基材和厚度为2〜50μm的Fe-Al扩散层形成铁系合金。 扩散层相对于扩散层的总体积含有至少90体积%的Al和Fe的金属间化合物。 包含在扩散层的至少2μm深度中的Al含量基于扩散层的区域的总重量为至少2μm的厚度的35至65重量%。 优选使用沉淀硬化不锈钢,其包含66〜81.9重量%的Fe,15〜20重量%的Cr,3〜13重量%的Ni,1个元素选自3〜6重量% Cu,0.5〜2重量%的Al和0.01〜0.2重量%的C和N,或含有73〜89.9重量%的Fe,10〜19重量%的Cr,0.1〜1.2的高碳不锈钢 的C%,小于3重量%的Ni。 铁合金可以用于诸如齿轮或轴承的滑动部件,以及电动剃须刀或剪发器的刀片。
    • 8. 发明授权
    • Process of preparing a ferritic alloy with a wear-resistive alumina scale
    • 使用耐磨铝规格制备合金的方法
    • US5156805A
    • 1992-10-20
    • US735901
    • 1991-07-25
    • Junji ImaiShuji YamadaTadashi HamadaHajime KojimaMasao Tanahashi
    • Junji ImaiShuji YamadaTadashi HamadaHajime KojimaMasao Tanahashi
    • B22F3/24C22C33/02C23C8/10
    • C23C8/10B22F3/24C22C33/0285Y10T428/12056Y10T428/12611
    • A ferritic alloy with a wear resistive oxide scale is obtained through the steps of pressing a ferritic alloy powder containing aluminum into a powder compact of a desired configuration, sintering the powder compact in a non-oxidizing atmosphere to provide a resulting sintered product, and heat-treating the sintered product in an oxidizing gas atmosphere in order to precipitate in the surface thereof alumina in the form of an alumina scale as the wear resistive oxide scale which is responsible for improved surface hardness or wear resistance. Due to the inherent porous nature of the sintered product, the oxidizing gas can readily penetrate deep into the surface of sintered product to facilitate the oxidization of the product surface into the alumina scale, in addition to that the oxidization depth can be controlled such as by the density of the product, which makes it possible to readily control the thickness of the alumina scale. The resulting alumina scale has an improved scale adherence due to the ferritic structure of the alloy.
    • 通过以下步骤获得具有耐磨性氧化皮的铁素体合金:将含有铝的铁素体合金粉末压制成所需构造的粉末压块,在非氧化性气氛中烧结粉末压块以提供所得到的烧结产品,并加热 - 在氧化气体气氛中将烧结产品置于氧化铝气氛中,以氧化铝形式的氧化铝表面沉淀,作为负责提高表面硬度或耐磨性的耐磨性氧化皮。 由于烧结产品固有的多孔性质,氧化气体可以很容易地深入到烧结产品的表面,以便产品表面氧化成氧化铝垢,除了氧化深度可以如下 产品的密度,这使得可以容易地控制氧化铝垢的厚度。 所得到的氧化铝垢由于合金的铁素体结构而具有改进的垢附着力。