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    • 4. 发明申请
    • CLEANING DEVICE AND CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS
    • 清洁装置和清洁方法的半导体制造装置
    • US20100018552A1
    • 2010-01-28
    • US12510314
    • 2009-07-28
    • Takayuki KokuboJun YamawakuTsuyoshi Moriya
    • Takayuki KokuboJun YamawakuTsuyoshi Moriya
    • B08B3/10B08B13/00
    • B08B3/10B08B13/00B08B2230/01
    • Provided are a cleaning device and a cleaning method of a semiconductor manufacturing apparatus, capable of performing a cleaning process more effectively as compared to conventional cases and obtaining a high cleaning effect. A semiconductor manufacturing apparatus cleaning device 100 includes a pure water steam generating vessel 2 for generating pure water steam from pure water; a supply port 5 for supplying the pure water steam to a cleaning target portion; a supply line 4 for connecting the pure water steam generating vessel with the supply port; a collection port 6 for collecting steam used in cleaning from the cleaning target portion; a collection vessel 8 for condensing and collecting the used steam; and a collection line 7 for connecting the collection port 6 with the collection vessel 8.
    • 提供了一种半导体制造装置的清洁装置和清洁方法,与常规情况相比,能够更有效地进行清洁处理并获得高清洁效果。 半导体制造装置清洁装置100包括用于从纯水产生纯水蒸汽的纯水蒸汽发生容器2, 用于将纯水蒸汽供应到清洁目标部分的供应口5; 用于将纯水蒸汽发生容器与供给口连接的供应管线4; 用于从清洁目标部分收集用于清洁的蒸汽的收集口6; 用于冷凝和收集用过的蒸汽的收集容器8; 以及用于将收集口6与收集容器8连接的收集线7。
    • 5. 发明申请
    • SUBSTRATE TRANSFER MODULE AND SUBSTRATE PROCESSING SYSTEM
    • 基板传输模块和基板处理系统
    • US20090028672A1
    • 2009-01-29
    • US12180028
    • 2008-07-25
    • Jun YAMAWAKUTsuyoshi Moriya
    • Jun YAMAWAKUTsuyoshi Moriya
    • H01L21/67
    • H01L21/67766H01L21/67778H01L21/67781
    • A substrate transfer module that can prevent corrosion of components, adhesion of particles to the substrate, and increases in the manufacturing cost and the size of the substrate transfer module. A substrate transfer module is connected to a substrate processing module. The substrate processing module implements desired processing on a substrate. A substrate transfer device transfers a substrate and includes a holding unit and a moving unit. The holding unit holds the substrate, and the moving unit moves the holding unit. A transfer chamber houses the substrate transfer device in an interior thereof that is isolated from an external atmosphere. An isolation device isolates at least the holding unit and the substrate held by the holding unit from an interior atmosphere of the transfer chamber.
    • 可以防止组分腐蚀,颗粒粘附到基底上的衬底转移模块,以及衬底转移模块的制造成本和尺寸的增加。 衬底转移模块连接到衬底处理模块。 衬底处理模块在衬底上实现所需的处理。 衬底传送装置传送衬底并且包括保持单元和移动单元。 保持单元保持基板,移动单元移动保持单元。 传送室在其内部容纳与外部气氛隔离的衬底传送装置。 隔离装置至少将保持单元和由保持单元保持的基板与传送室的内部空气隔离。
    • 8. 发明授权
    • Substrate transfer module and substrate processing system
    • 基板转移模块和基板处理系统
    • US08257498B2
    • 2012-09-04
    • US12180028
    • 2008-07-25
    • Jun YamawakuTsuyoshi Moriya
    • Jun YamawakuTsuyoshi Moriya
    • H01L21/67
    • H01L21/67766H01L21/67778H01L21/67781
    • A substrate transfer module that can prevent corrosion of components, adhesion of particles to the substrate, and increases in the manufacturing cost and the size of the substrate transfer module. A substrate transfer module is connected to a substrate processing module. The substrate processing module implements desired processing on a substrate. A substrate transfer device transfers a substrate and includes a holding unit and a moving unit. The holding unit holds the substrate, and the moving unit moves the holding unit. A transfer chamber houses the substrate transfer device in an interior thereof that is isolated from an external atmosphere. An isolation device isolates at least the holding unit and the substrate held by the holding unit from an interior atmosphere of the transfer chamber.
    • 可以防止组分腐蚀,颗粒粘附到基底上的衬底转移模块,以及衬底转移模块的制造成本和尺寸的增加。 衬底转移模块连接到衬底处理模块。 衬底处理模块在衬底上实现所需的处理。 衬底传送装置传送衬底并且包括保持单元和移动单元。 保持单元保持基板,移动单元移动保持单元。 传送室在其内部容纳与外部气氛隔离的衬底传送装置。 隔离装置至少将保持单元和由保持单元保持的基板与传送室的内部空气隔离。
    • 9. 发明授权
    • Cleaning device and cleaning method of semiconductor manufacturing apparatus
    • 半导体制造装置的清洗装置及清洗方法
    • US08297292B2
    • 2012-10-30
    • US12510314
    • 2009-07-28
    • Takayuki KokuboJun YamawakuTsuyoshi Moriya
    • Takayuki KokuboJun YamawakuTsuyoshi Moriya
    • B08B3/04
    • B08B3/10B08B13/00B08B2230/01
    • Provided are a cleaning device and a cleaning method of a semiconductor manufacturing apparatus, capable of performing a cleaning process more effectively as compared to conventional cases and obtaining a high cleaning effect. A semiconductor manufacturing apparatus cleaning device 100 includes a pure water steam generating vessel 2 for generating pure water steam from pure water; a supply port 5 for supplying the pure water steam to a cleaning target portion; a supply line 4 for connecting the pure water steam generating vessel with the supply port; a collection port 6 for collecting steam used in cleaning from the cleaning target portion; a collection vessel 8 for condensing and collecting the used steam; and a collection line 7 for connecting the collection port 6 with the collection vessel 8.
    • 提供了一种半导体制造装置的清洁装置和清洁方法,与常规情况相比,能够更有效地进行清洁处理并获得高清洁效果。 半导体制造装置清洁装置100包括用于从纯水产生纯水蒸汽的纯水蒸汽发生容器2, 用于将纯水蒸汽供应到清洁目标部分的供应口5; 用于将纯水蒸汽发生容器与供给口连接的供应管线4; 用于从清洁目标部分收集用于清洁的蒸汽的收集口6; 用于冷凝和收集用过的蒸汽的收集容器8; 以及用于将收集口6与收集容器8连接的收集线7。