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    • 6. 发明申请
    • METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
    • 制造碳化硅半导体器件的方法
    • US20090042375A1
    • 2009-02-12
    • US12165841
    • 2008-07-01
    • Takao SawadaTomokatsu Watanabe
    • Takao SawadaTomokatsu Watanabe
    • H01L21/265
    • H01L29/7802H01L21/045H01L21/046H01L21/0465H01L21/67109H01L29/1608H01L29/66068
    • A method of manufacturing a silicon carbide semiconductor device includes a step of ion-implanting an impurity in a surface of a silicon carbide wafer (1 and 2); a step of forming a carbon protection film (6) of a predetermined thickness over the entire surface of the silicon carbide wafer (1 and 2) having been ion-implanted with the impurity, by a chemical vapor deposition method that deposits a film by pyrolyzing a hydrocarbon gas; and a step of annealing the silicon carbide wafer (1 and 2) having been formed with the carbon protection film (6). Thereby, the carbon protection film (6) can be formed that contains extremely few contaminants, and prevents step bunching from creating on the surface of the silicon carbide wafer (1 and 2) and crystal defects created therein due to unbalanced thermal stress form increasing.
    • 制造碳化硅半导体器件的方法包括在碳化硅晶片(1和2)的表面离子注入杂质的步骤; 在通过离子注入杂质的碳化硅晶片(1和2)的整个表面上形成预定厚度的碳保护膜(6)的步骤,通过化学气相沉积法,通过热解沉积膜 烃气; 以及退火已经形成有碳保护膜(6)的碳化硅晶片(1和2)的步骤。 因此,可以形成含有极少污染物的碳保护膜(6),并且防止在碳化硅晶片(1和2)的表面上形成步骤聚集和由于不平衡的热应力增加而产生的晶体缺陷。