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1. 发明授权

US06240782B1 Semiconductor physical quantity sensor and production method thereof 有权
标题翻译：半导体物理量传感器及其制造方法
公开(公告)号：US06240782B1
公开(公告)日：2001-06-05
申请号：US09247865
申请日：1999-02-11
申请人： Nobuyuki Kato , Toshimasa Yamamoto , Tsuyoshi Fukada , Minekazu Sakai
发明人： Nobuyuki Kato , Toshimasa Yamamoto , Tsuyoshi Fukada , Minekazu Sakai
IPC分类号： G01P15125
CPC分类号： G01P15/125 , G01P15/0802 , G01P2015/0814
摘要： A semiconductor physical quantity sensor includes a substrate, a beam-structure movable portion and a fixed portion. The beam-structure movable portion is suspended by four anchors formed of polycrystalline films. A rectangular mass is suspended between beams. Movable electrodes project from both sides of the mass. First fixed electrodes and second fixed electrodes are fixedly provided on the surface of the substrate. The substrate has a laminated structure, wherein an oxide film, attaching film, insulating films, conductive film and insulating film are laminated on the substrate. An anchor formed from the conductive film is electrically connected to the attaching film. An electrode pad made of an aluminum film is provided the above the anchor. Because this structure enables the potential of the attaching film to be fixed, parasitic capacitance can be decreased.
摘要翻译：半导体物理量传感器包括基板，梁结构可动部和固定部。梁结构可移动部分由由多晶膜形成的四个锚固件悬挂。梁之间悬挂有矩形质量块。活动电极从质量两侧投射。第一固定电极和第二固定电极固定地设置在基板的表面上。基板具有叠层结构，其中在基板上层压氧化膜，附着膜，绝缘膜，导电膜和绝缘膜。由导电膜形成的锚固件与连接膜电连接。在锚上方设置由铝膜制成的电极垫。由于该结构能够使固定膜的电位固定，所以可以降低寄生电容。

2. 发明授权

US6048774A Method of manufacturing dynamic amount semiconductor sensor 失效
标题翻译：动态量半导体传感器的制造方法
公开(公告)号：US6048774A
公开(公告)日：2000-04-11
申请号：US103935
申请日：1998-06-25
申请人： Toshimasa Yamamoto , Nobuyuki Kato , Kazuhiko Kano , Makiko Sugiura
发明人： Toshimasa Yamamoto , Nobuyuki Kato , Kazuhiko Kano , Makiko Sugiura
IPC分类号： G01P15/08 , G01P15/125 , H01L29/84 , G01P15/13
CPC分类号： G01P15/125 , G01P15/0802 , G01P2015/0814
摘要： In a method of manufacturing a dynamic amount sensor including a beam structure and a fixed electrode which are respectively supported by anchor parts of a substrate, opening portions are formed on a first semiconductor substrate where the anchor parts are to be formed. Each of the opening portions is composed of a plurality of stripe-like openings. Then a first thin film for forming the anchor parts and a second thin film are formed on the first semiconductor substrate in that order. After the surface of the second thin film is polished, a second semiconductor substrate is bonded to the polished surface of the second thin film. In this method, because the opening portions are composed of the plurality of stripe-like openings, the second thin film is flattened without having any steps thereon.
摘要翻译：在制造分别由基板的锚定部支撑的梁结构和固定电极的动态量传感器的制造方法中，在要形成锚定部的第一半导体基板上形成开口部。每个开口部分由多个条状开口组成。然后在第一半导体衬底上依次形成用于形成锚定部分的第一薄膜和第二薄膜。在第二薄膜的表面被抛光之后，第二半导体衬底被结合到第二薄膜的抛光表面上。在该方法中，由于开口部分由多个条状开口组成，所以第二薄膜在其上没有任何步骤而变平。

3. 发明授权

US5922212A Semiconductor sensor having suspended thin-film structure and method for fabricating thin-film structure body 失效
标题翻译：具有悬浮薄膜结构的半导体传感器和用于制造薄膜结构体的方法
公开(公告)号：US5922212A
公开(公告)日：1999-07-13
申请号：US663001
申请日：1996-06-07
申请人： Kazuhiko Kano , Kenichi Nara , Toshimasa Yamamoto , Nobuyuki Kato , Yoshitaka Gotoh , Yoshinori Ohtsuka , Kenichi Ao
发明人： Kazuhiko Kano , Kenichi Nara , Toshimasa Yamamoto , Nobuyuki Kato , Yoshitaka Gotoh , Yoshinori Ohtsuka , Kenichi Ao
IPC分类号： B81B3/00 , B81C1/00 , G01P15/08 , G01P15/125 , C23F1/00
CPC分类号： G01P15/125 , B81B3/0072 , B81C1/00666 , G01P15/0802 , B81C2201/0164 , B81C2201/0167 , B81C2201/017 , G01P2015/0814
摘要： A semiconductor sensor having a thin-film structure body, in which thin-film structure is prevented from bending due to the internal stress distribution in the thickness direction, is disclosed. A silicon-oxide film is formed as a sacrificial layer on a silicon substrate, and a polycrystalline-silicon thin film is formed on the silicon-oxide film. Thereafter, phosphorus (P) is ion-implanted in the surface of the polycrystalline-silicon thin film, and thereby the surface state of the polycrystalline-silicon thin film is modified. A portion of distribution of stress existing in the thickness direction of the polycrystalline-silicon thin film is changed by this modification, and stress distribution is adjusted. By removal of the silicon-oxide film, a movable member of the polycrystalline-silicon thin film is disposed above the silicon substrate with a gap interposed therebetween.
摘要翻译：公开了一种具有薄膜结构体的半导体传感器，其薄膜结构被防止由于厚度方向上的内部应力分布而弯曲。在硅衬底上形成氧化硅膜作牺牲层，在氧化硅膜上形成多晶硅薄膜。此后，将磷（P）离子注入多晶硅薄膜的表面，从而改变多晶硅薄膜的表面状态。通过该变形例改变在多晶硅薄膜的厚度方向上存在的应力分布的一部分，并且调整应力分布。通过去除氧化硅膜，多晶硅薄膜的可移动部件设置在硅衬底之上，其间插入间隙。

4. 发明授权

US09433542B2 Absorbent article and production method thereof 有权
标题翻译：吸收性物品及其制造方法
公开(公告)号：US09433542B2
公开(公告)日：2016-09-06
申请号：US14002762
申请日：2012-02-27
申请人： Nobuyuki Kato , Tatsuya Tamura , Toshihisa Hayashi , Masashi Kitagawa
发明人： Nobuyuki Kato , Tatsuya Tamura , Toshihisa Hayashi , Masashi Kitagawa
IPC分类号： A61F13/475 , A61F13/533 , A61F13/537 , A61F13/15 , A61F13/535 , A61F13/539 , A61F13/47
CPC分类号： A61F13/537 , A61F13/15617 , A61F13/15731 , A61F13/4704 , A61F13/4756 , A61F13/535 , A61F13/539 , Y10T156/1041
摘要： The absorbent article of the present invention comprises: a liquid-pervious surface sheet, a liquid-impervious backside sheet provided at the position opposing said surface sheet, and an absorption body provided between said surface sheet and said backside sheet, wherein the absorbent article comprises an endless compressed groove, surrounding a central part of said absorbent article, which is formed in said surface sheet and said absorption body in the thickness direction, and a plurality of concave parts, provided inside and outside said compressed groove, which are formed in said surface sheet and said absorption body in the thickness direction, and an uncompressed region bordering inner and outer edges of the compressed groove, wherein the closest distance between said compressed groove and the nearest concave parts is greater than the distance between adjacent ones of those same concave parts.
摘要翻译：本发明的吸收性物品包括：透液性表面片，设置在与所述表面片相对的位置处的不透液性背面片，以及设置在所述表面片和所述背面片之间的吸收体，其中，所述吸收性物品包含围绕形成在所述表面片和所述吸收体的厚度方向的所述吸收性物品的中心部分的无端压缩槽，以及设置在所述压缩槽的内部和外部的多个凹部，表面片和所述吸收体在厚度方向上，以及与所述压缩槽的内边缘和外边缘接合的未压缩区域，其中所述压缩槽和最近的凹入部分之间的最近距离大于相邻的相同凹部部分。

5. 发明授权

US08684712B2 Oil pump for a vehicle 失效
标题翻译：车用油泵
公开(公告)号：US08684712B2
公开(公告)日：2014-04-01
申请号：US12776456
申请日：2010-05-10
申请人： Hiroyasu Honda , Hideki Miyata , Nobuyuki Kato
发明人： Hiroyasu Honda , Hideki Miyata , Nobuyuki Kato
IPC分类号： F01C1/02 , F03C2/00
CPC分类号： F04C2/102 , F04C2/084 , F04C2240/50 , F05C2225/00
摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要翻译：在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。落下面的圆周长度大于上升面的圆周长度。

6. 发明申请

US20130317470A1 ABSORBENT ARTICLE PACKAGE AND METHOD OF FOLDING THE SAME 有权
标题翻译：吸收性物品包装及其折叠方法
公开(公告)号：US20130317470A1
公开(公告)日：2013-11-28
申请号：US13976233
申请日：2011-12-27
申请人： Nobuyuki Kato , Masahiro Kashiwagi , Tatsuya Tamura , Masashi Kitagawa
发明人： Nobuyuki Kato , Masahiro Kashiwagi , Tatsuya Tamura , Masashi Kitagawa
IPC分类号： A61F13/551 , A61F13/15
CPC分类号： A61F13/5514 , A61F13/15577 , A61F13/15747
摘要： An absorbent article package is individually packaged by folding a packaging sheet and an absorbent article in a state where the absorbent article is arranged on the packaging sheet. In a state where the individually-packaged absorbent article is opened, in the packaging sheet and the absorbent article, a first folding line based on which the absorbent article and the packaging sheet are folded towards the topsheet side, and a second folding line based on which the absorbent article and the packaging sheet are folded towards the backsheet side are formed adjacent to each other in the longitudinal direction.
摘要翻译：通过在吸收性物品配置在包装片上的状态下折叠包装片和吸收性物品，分别包装吸收性物品包装。在打开单独包装的吸收性物品的状态下，在包装用片材和吸收性物品中，将吸收性物品和包装用片材朝向顶片侧折叠的第一折叠线和基于所述吸收性物品和所述包装用薄片朝向所述背面侧折叠而形成为在长度方向上彼此相邻地形成。

7. 发明申请

US20110129868A1 CELL CAPABLE OF REPLICATING NOVEL HCV REPLICON, CELL CAPABLE OF REPLICATING FULL-LENGTH HCV RNA, AND USE OF THOSE CELLS 审中-公开
标题翻译：更换新HCV复制细胞的细胞，更换全长HCV RNA的细胞和这些细胞的使用
公开(公告)号：US20110129868A1
公开(公告)日：2011-06-02
申请号：US13054905
申请日：2009-09-01
申请人： Nobuyuki Kato , Masanori Ikeda
发明人： Nobuyuki Kato , Masanori Ikeda
IPC分类号： C12Q1/02 , C12N15/87 , C12N5/071 , C12N7/00
CPC分类号： G01N33/5008 , A61K31/00 , C07K14/005 , C12N7/00 , C12N15/86 , C12N2770/24222 , C12N2770/24243 , C12N2770/24252 , G01N2333/186
摘要： According to the present invention, an HCV replicon-replicating cell is produced by a production method including a step of introducing RNA containing an HCV replicon sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. Further, a full-length HCV RNA-replicating cell is produced by a production method including a step of introducing RNA containing a full-length HCV genome sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. The use of these cells enables the construction of an HCV life cycle reproduction system that is derived from a cell line other than the HuH-7 cell line and that has capabilities equivalent to those of an HCV life cycle reproduction system derived from the HuH-7 cell line.
摘要翻译：根据本发明，通过包括将含有HCV复制子序列和选择标记基因序列的RNA引入到Li23细胞或来自Li23细胞的固化细胞的步骤的制备方法制备HCV复制子复制细胞。此外，通过包括将含有全长HCV基因组序列和选择性标记基因序列的RNA引入到Li23细胞或源自Li23细胞的固化细胞的步骤的制备方法制备全长HCV RNA复制细胞。这些细胞的使用使得能够构建来自除了HuH-7细胞系之外的细胞系的HCV生命周期再生系统，并且具有与源自HuH-7的HCV生命周期再生系统相当的能力细胞系。

8. 发明申请

US20100290941A1 OIL PUMP FOR A VEHICLE 失效
标题翻译：油泵油
公开(公告)号：US20100290941A1
公开(公告)日：2010-11-18
申请号：US12776456
申请日：2010-05-10
申请人： Hiroyasu HONDA , Hideki Miyata , Nobuyuki Kato
发明人： Hiroyasu HONDA , Hideki Miyata , Nobuyuki Kato
IPC分类号： F01C1/18
CPC分类号： F04C2/102 , F04C2/084 , F04C2240/50 , F05C2225/00
摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要翻译：在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。落下面的圆周长度大于上升面的圆周长度。

9. 发明申请

US20070158850A1 Method for manufacturing mold type semiconductor device 有权
标题翻译：模具型半导体器件的制造方法
公开(公告)号：US20070158850A1
公开(公告)日：2007-07-12
申请号：US11702498
申请日：2007-02-06
申请人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
发明人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/482 , H01L23/485 , H01L23/488 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/04941 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2924/01014 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要翻译：一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。焊料层由屈服应力小于金属层的焊料制成。即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

10. 发明授权

US07193326B2 Mold type semiconductor device 有权
标题翻译：模具型半导体器件
公开(公告)号：US07193326B2
公开(公告)日：2007-03-20
申请号：US10859130
申请日：2004-06-03
申请人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
发明人： Naohiko Hirano , Nobuyuki Kato , Takanori Teshima , Yoshitsugu Sakamoto , Shoji Miura , Akihiro Niimi
IPC分类号： H01L23/48
CPC分类号： H01L24/33 , H01L23/482 , H01L23/485 , H01L23/488 , H01L24/32 , H01L24/48 , H01L2224/05599 , H01L2224/291 , H01L2224/29111 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/85444 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/04941 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , H01L2924/01014 , H01L2924/01028 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要翻译：一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。焊料层由屈服应力小于金属层的焊料制成。即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

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