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    • 8. 发明授权
    • Apparatus for repairing an electrically short-circuited semiconductor
device
    • 用于修复电气短路的半导体器件的装置
    • US5418680A
    • 1995-05-23
    • US155655
    • 1993-11-22
    • Keishi SaitoTatsuyuki AoikeMitsuyuki NiwaToshimitsu KariyaYuzo Koda
    • Keishi SaitoTatsuyuki AoikeMitsuyuki NiwaToshimitsu KariyaYuzo Koda
    • H01L21/28H01L31/0224H01L31/0392H01L31/20H05F7/00
    • H01L31/208H01L21/28H01L31/022466H01L31/03921Y02E10/50Y02P70/521Y10S136/29
    • An apparatus for repairing a defective semiconductor device having an electrically short-circuited portion, wherein the semiconductor device includes a semiconductor thin film and a conductive thin film disposed in the named order on a conductive surface of a substrate and in which the conductive thin film and the conductive surface of the substrate are electrically short-circuited at a pinhole occurring in the semiconductor thin film to form an electrically short-circuited portion so that the semiconductor device is defective. The apparatus includes a substrate holding unit for holding the substrate of the defective semiconductor device and an electrode arranged above the substrate holding unit so that, when the defective semiconductor is positioned on the substrate holding unit, there is a predetermined distance between the electrode and the conductive thin film of the defective semiconductor device, the electrode being capable of moving in relation to the substrate of the defective semiconductor device. The apparatus further includes a voltage applying unit for applying a desired voltage to the electrode, wherein discharge is caused between the electrode and the conductive thin film of the defective semiconductor device by applying a desired voltage to the electrode through the voltage applying means to thereby modify a region of the conductive thin film of the defective semiconductor device in electrical contact with the conductive surface of the substrate of the defective semiconductor device.
    • 一种用于修复具有电短路部分的有缺陷的半导体器件的装置,其中所述半导体器件包括半导体薄膜和导电薄膜,所述半导体薄膜和导电薄膜按照所述顺序设置在衬底的导电表面上,并且其中导电薄膜和 衬底的导电表面在发生在半导体薄膜中的针孔处电短路以形成电短路部分,使得半导体器件有缺陷。 该装置包括用于保持有缺陷的半导体器件的衬底的衬底保持单元和布置在衬底保持单元上方的电极,使得当缺陷半导体位于衬底保持单元上时,电极和 有缺陷的半导体器件的导电薄膜,电极能够相对于有缺陷的半导体器件的衬底移动。 该装置还包括用于向电极施加期望电压的电压施加单元,其中通过施加期望的电压通过电压施加装置在电极和缺陷半导体器件的导电薄膜之间引起放电,从而修改 所述有缺陷的半导体器件的导电薄膜的区域与有缺陷的半导体器件的衬底的导电表面电接触。