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1. 发明授权

US06465190B1 Method for producing DNA chip 失效
标题翻译：生产DNA芯片的方法
公开(公告)号：US06465190B1
公开(公告)日：2002-10-15
申请号：US09694135
申请日：2000-10-23
申请人： Toshikazu Hirota , Nobuo Takahashi , Yukihisa Takeuchi , Takao Ohnishi
发明人： Toshikazu Hirota , Nobuo Takahashi , Yukihisa Takeuchi , Takao Ohnishi
IPC分类号： C12Q168
CPC分类号： G01N35/00029 , B01J19/0046 , B01J2219/00317 , B01J2219/00351 , B01J2219/00369 , B01J2219/00378 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00619 , B01J2219/00637 , B01J2219/00659 , B01J2219/00722 , B01L3/0268 , B01L3/5088 , B01L7/52 , B01L2300/10 , B01L2400/0442 , C12Q1/6837 , C40B40/06 , C40B60/14 , G01N2035/00158 , G01N2035/1039 , C12Q2565/507
摘要： Disclosed is a method comprising a pretreatment step of forming a poly-L-lysine layer on a surface of a base plate, a sample preparation step of preparing a sample containing a DNA fragment, a dilution step of diluting the concentration of the obtained sample, and a supply step of supplying a diluted sample solution onto the base plate to produce a DNA chip. The sample preparation step includes an amplification step of PCR-amplifying the DNA fragment to prepare a PCR product, a powder formation step of drying the obtained PCR product to form DNA powder, and a mixing step of dissolving the obtained DNA powder in a buffer solution.
摘要翻译：公开了一种方法，其包括在基板的表面上形成聚-L-赖氨酸层的预处理步骤，制备含有DNA片段的样品的样品制备步骤，稀释所得样品的浓度的稀释步骤，以及将稀释的样品溶液供应到基板上以产生DNA芯片的供给步骤。样品制备步骤包括PCR扩增DNA片段以制备PCR产物的扩增步骤，将获得的PCR产物干燥以形成DNA粉末的粉末形成步骤和将获得的DNA粉末溶解在缓冲溶液中的混合步骤。

2. 发明授权

US5965970A Diaphragm structure 失效
标题翻译：隔膜结构
公开(公告)号：US5965970A
公开(公告)日：1999-10-12
申请号：US639609
申请日：1996-04-29
申请人： Yukihisa Takeuchi , Keizo Miyata , Takao Ohnishi , Nobuo Takahashi
发明人： Yukihisa Takeuchi , Keizo Miyata , Takao Ohnishi , Nobuo Takahashi
IPC分类号： G01L7/08 , G01L9/00 , G01L9/04 , H01L41/09 , H01L41/08
CPC分类号： H01L41/0973
摘要： A diaphragm structure includes a ceramic substrate having at least one window portion and a thin diaphragm laminated onto the ceramic substrate so as to cover the window portion, wherein only a part of an interface between the ceramic substrate and the thin diaphragm is joined to form a joint of the diaphragm. A diaphragm structure is free from instability caused by a breakage or deformation of a partition wall between window portions upon punching or laminating even if a diaphragm structure employs a design in which dimensions of a diaphragm portion is maintained and simultaneously a distance between diaphragm portions is made narrow to restrain a surface area excluding a diaphragm portion of a diaphragm structure or a design in which a plurality of diaphragm portion having various configurations and dimensions are disposed.
摘要翻译：膜片结构包括陶瓷基板，其具有至少一个窗口部分和层叠在陶瓷基板上以便覆盖窗口部分的薄隔膜，其中仅陶瓷基板和薄隔膜之间的界面的一部分接合形成隔膜的关节。即使膜片结构采用保持隔膜部分的尺寸同时设置隔膜部分之间的距离的设计，隔膜结构也不会因冲孔或层压时窗口部分之间的隔壁的断裂或变形而引起的不稳定性狭窄以限制除隔膜结构的隔膜部分之外的表面积或其中设置有具有各种构造和尺寸的多个隔膜部分的设计。

3. 发明授权

US09190604B2 Manufacturing method for thin board-shaped fired piezoelectric body 有权
标题翻译：薄板状烧结压电体制造方法
公开(公告)号：US09190604B2
公开(公告)日：2015-11-17
申请号：US13273608
申请日：2011-10-14
申请人： Nobuo Takahashi , Takao Ohnishi
发明人： Nobuo Takahashi , Takao Ohnishi
IPC分类号： H01L41/25 , H01L41/273 , H01L41/053 , H01L41/29 , H01L41/33 , H01L41/35 , H01L41/338 , H01L41/43 , C04B35/622 , H01L21/48 , C04B35/634
CPC分类号： H01L41/273 , C04B35/62222 , C04B35/634 , H01L21/4807 , H01L21/481 , H01L41/053 , H01L41/29 , H01L41/33 , H01L41/338 , H01L41/35 , H01L41/43 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49165
摘要： A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.
摘要翻译：薄板状烧结压电体的制造方法具有以下步骤：使用压电材料制造比例T / L为0.000002〜0.2的生片，其中T为厚度，L为最大长度烧结后的表面; 以及在通过在生片的至少一个表面上散射而设置用于烧制的加强构件之后，通过进行烧制来获得具有用于烧制的加强构件的薄板状烧结压电体的步骤，以排除作为薄板的区域形式的烧结压电体。可以通过该方法以低成本制造具有优异的平面性和薄板形状的压电体。

4. 发明授权

US07267840B2 Manufacturing method of piezoelectric/electrostrictive film type device 失效
标题翻译：压电/电致伸缩薄膜型器件的制造方法
公开(公告)号：US07267840B2
公开(公告)日：2007-09-11
申请号：US10630887
申请日：2003-07-30
申请人： Takao Ohnishi , Masahiro Murasato , Yuki Bessho , Nobuo Takahashi
发明人： Takao Ohnishi , Masahiro Murasato , Yuki Bessho , Nobuo Takahashi
IPC分类号： B05D5/12
CPC分类号： H01L41/314 , H01L41/0973 , H01L41/273
摘要： A method is provided for manufacturing a piezoelectric/electrostrictive film device including a ceramic substrate and a piezoelectric/electrostrictive operation portion including a lower electrode, a piezoelectric/electrostrictive layer, and upper electrode stacked on the substrate. The piezoelectric/electrostrictive layer is formed to extend beyond at least one of electrodes to form projected portions at its ends. The method includes the steps of forming the piezoelectric/electrostrictive layer so that ends of the piezoelectric/electrostrictive layer are projected to extend beyond ends of at least one electrode, applying a coating liquid in a sufficient amount so that the coating liquid permeates through a gap between at least the projected end portion of the piezoelectric/electrostrictive layer and the substrate, and so as to coat a predetermined portion of the at least one electrode, and drying the applied coating liquid to form a coupling member to couple the projected end portions of the piezoelectric/electrostrictive layer to the substrate.
摘要翻译：提供一种用于制造包括陶瓷基板和压电/电致伸缩操作部分的压电/电致伸缩膜装置的方法，该压电/电致伸缩操作部分包括堆叠在基板上的下电极，压电/电致伸缩层和上电极。压电/电致伸缩层被形成为延伸超过至少一个电极以在其端部处形成突出部分。该方法包括以下步骤：形成压电/电致伸缩层，使得压电/电致伸缩层的端部突出延伸超过至少一个电极的端部，施加足够量的涂覆液体，使得涂布液体渗透通过间隙在压电/电致伸缩层的至少突出的端部与基板之间，并且涂覆至少一个电极的预定部分，并干燥所施加的涂覆液体以形成耦合部件，以将突出的端部压电/电致伸缩层到基板。

5. 发明授权

US5677014A Process for film formation 失效
标题翻译：成膜方法
公开(公告)号：US5677014A
公开(公告)日：1997-10-14
申请号：US687933
申请日：1996-07-29
申请人： Takao Ohnishi , Natsumi Shimogawa , Yukihisa Takeuchi , Nobuo Takahashi
发明人： Takao Ohnishi , Natsumi Shimogawa , Yukihisa Takeuchi , Nobuo Takahashi
IPC分类号： B23K26/351 , B23K26/361 , C04B41/00 , C04B41/53 , C04B41/80 , C04B41/91 , H01C17/242 , H01L41/22 , H05K1/03 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/08 , B05D3/00
CPC分类号： C04B41/009 , C04B41/0036 , C04B41/5346 , C04B41/80 , C04B41/91 , H05K1/0306 , H05K3/027
摘要： A process for forming a film on a ceramic substrate or on a fired film formed thereon includes coating, on a ceramic substrate or on a fired film formed thereon, a material which becomes a metallic film or a ceramic film upon firing, to form an as-coated film, irradiating the as-coated film with an energy beam which does not damage the ceramic substrate or the fired film formed thereon to such an extent that it becomes useless and which can decompose and remove the as-coated film, to trim the unrequired portion(s) of the as-coated film, and firing the trimmed as-coated film to form a desired film. The film can be formed on a ceramic substrate or on a fired film formed thereon while the damage to the substrate or the fired film is minimized.
摘要翻译：在陶瓷基板或其上形成的烧成膜上形成膜的方法包括在陶瓷基板上或其上形成的烧成膜上涂覆在烧制时成为金属膜或陶瓷膜的材料，形成为涂覆膜，用不会损坏陶瓷基板或其上形成的烧成膜的能量束照射到被涂膜，使得其变得无用并且可以分解和去除涂覆膜，从而修整涂覆膜的不需要部分，并且烧制经修整的被涂膜以形成所需的膜。该膜可以形成在陶瓷基板上或形成在其上的烧结膜上，同时对基板或烧制膜的损坏最小化。

6. 发明申请

US20120030916A1 MANUFACTURING METHOD FOR THIN BOARD-SHAPED FIRED PIEZOELECTRIC BODY 有权
标题翻译：薄板形激光压电体的制造方法
公开(公告)号：US20120030916A1
公开(公告)日：2012-02-09
申请号：US13273608
申请日：2011-10-14
申请人： Nobuo Takahashi , Takao Ohnishi
发明人： Nobuo Takahashi , Takao Ohnishi
IPC分类号： H01L41/22
CPC分类号： H01L41/273 , C04B35/62222 , C04B35/634 , H01L21/4807 , H01L21/481 , H01L41/053 , H01L41/29 , H01L41/33 , H01L41/338 , H01L41/35 , H01L41/43 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49165
摘要： A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.
摘要翻译：薄板状烧结压电体的制造方法具有以下步骤：使用压电材料制造比例T / L为0.000002〜0.2的生片，其中T为厚度，L为最大长度烧结后的表面; 以及在通过在生片的至少一个表面上散射而设置用于烧制的加强构件之后，通过进行烧制来获得具有用于烧制的加强构件的薄板状烧结压电体的步骤，以排除作为薄板的区域形式的烧结压电体。可以通过该方法以低成本制造具有优异的平面性和薄板形状的压电体。

7. 发明授权

US06776960B2 Method for producing DNA chip 失效
标题翻译：生产DNA芯片的方法
公开(公告)号：US06776960B2
公开(公告)日：2004-08-17
申请号：US10128777
申请日：2002-04-24
申请人： Toshikazu Hirota , Nobuo Takahashi , Yukihisa Takeuchi , Takao Ohnishi
发明人： Toshikazu Hirota , Nobuo Takahashi , Yukihisa Takeuchi , Takao Ohnishi
IPC分类号： G01N1506
CPC分类号： G01N35/00029 , B01J19/0046 , B01J2219/00317 , B01J2219/00351 , B01J2219/00369 , B01J2219/00378 , B01J2219/00497 , B01J2219/00527 , B01J2219/00529 , B01J2219/00585 , B01J2219/0059 , B01J2219/00596 , B01J2219/00605 , B01J2219/00608 , B01J2219/00612 , B01J2219/00619 , B01J2219/00637 , B01J2219/00659 , B01J2219/00722 , B01L3/0268 , B01L3/5088 , B01L7/52 , B01L2300/10 , B01L2400/0442 , C12Q1/6837 , C40B40/06 , C40B60/14 , G01N2035/00158 , G01N2035/1039 , C12Q2565/507
摘要： Disclosed is a method comprising a pretreatment step of forming a poly-L-lysine layer on a surface of a base plate, a sample preparation step of preparing a sample containing a DNA fragment, a dilution step of diluting the concentration of the obtained sample, and a supply step of supplying a diluted sample solution onto the base plate to produce a DNA chip. The sample preparation step includes an amplification step of PCR-amplifying the DNA fragment to prepare a PCR product, a powder formation step of drying the obtained PCR product to form DNA powder, and a mixing step of dissolving the obtained DNA powder in a buffer solution.
摘要翻译：公开了一种方法，其包括在基板的表面上形成聚-L-赖氨酸层的预处理步骤，制备含有DNA片段的样品的样品制备步骤，稀释所得样品的浓度的稀释步骤，以及将稀释的样品溶液供应到基板上以产生DNA芯片的供给步骤。样品制备步骤包括PCR扩增DNA片段以制备PCR产物的扩增步骤，将获得的PCR产物干燥以形成DNA粉末的粉末形成步骤和将获得的DNA粉末溶解在缓冲溶液中的混合步骤。

8. 发明授权

US09246081B2 Method for manufacturing piezoelectric element 有权
标题翻译：制造压电元件的方法
公开(公告)号：US09246081B2
公开(公告)日：2016-01-26
申请号：US13271597
申请日：2011-10-12
申请人： Takao Ohnishi , Masayuki Uetani
发明人： Takao Ohnishi , Masayuki Uetani
IPC分类号： H01L41/257 , H01L41/04 , H01L41/053 , H01L41/09 , H01L41/332 , H01L41/27 , H01L41/29 , B06B1/06 , H03H9/17 , H03H3/02 , F16K31/00 , H01L41/338
CPC分类号： H01L41/257 , B06B1/0603 , B06B1/0688 , B06B1/0696 , F16K31/005 , H01L41/04 , H01L41/053 , H01L41/0926 , H01L41/0933 , H01L41/0973 , H01L41/27 , H01L41/29 , H01L41/332 , H01L41/338 , H03H3/02 , H03H9/172 , H03H9/178 , H03H2003/022 , H03H2003/023 , H03H2003/027 , Y10T29/42 , Y10T29/49005 , Y10T29/49155 , Y10T29/49156 , Y10T29/49798
摘要： There is provided a method for manufacturing a piezoelectric element, the method having a step of polarizing the fired piezoelectric body while fixing at least two positions in a direction perpendicular to the polarization direction. The method is a means for obtaining a piezoelectric element provided with a thin and flat fired piezoelectric body with no warpage.
摘要翻译：提供了一种用于制造压电元件的方法，该方法具有在垂直于偏振方向的方向固定至少两个位置的同时使烧结的压电体偏振的步骤。该方法是获得具有没有翘曲的薄平坦烧制压电体的压电元件的装置。

9. 发明授权

US08291558B2 Piezoelectric/electrostriction element manufacturing method 失效
标题翻译：压电/电致伸缩元件制造方法
公开(公告)号：US08291558B2
公开(公告)日：2012-10-23
申请号：US11962863
申请日：2007-12-21
申请人： Takao Ohnishi , Takashi Wada , Tomohiro Yamada , Makoto Tani
发明人： Takao Ohnishi , Takashi Wada , Tomohiro Yamada , Makoto Tani
IPC分类号： H04R17/10 , C04B35/64
CPC分类号： H01L41/0973 , H01L41/0475 , H01L41/257 , Y10T29/42 , Y10T29/49155 , Y10T29/49163
摘要： A method for manufacturing a piezoelectric/electrostrictive element includes a step of subjecting the piezoelectric/electrostrictive film to a heat treatment and a polarization treatment after the film is allowed to stand until the value of an electric constant has converged after the heat treatment. The piezoelectric/electrostrictive element manufactured in this method has small stress remaining in the piezoelectric/electrostrictive film, and predetermined performance regarding, for example, a displacement amount, a displacement-generating force, and an electric power efficiency (consumed electric power) as a piezoelectric/electrostrictive element (piezoelectric/electrostrictive film) is never spoiled.
摘要翻译：压电/电致伸缩元件的制造方法包括在使膜静置直到电常数在热处理后收敛的状态下，对压电/电致伸缩薄膜进行热处理和极化处理的步骤。通过该方法制造的压电/电致伸缩元件在压电/电致伸缩膜中残留的应力小，例如在位移量，位移产生力和电力效率（消耗电力）中作为压电/电致伸缩元件（压电/电致伸缩膜）从未被破坏。

10. 发明申请

US20100187953A1 PIEZOELECTRIC/ELECTROSTRICTIVE ELEMENT AND MANUFACTURING METHOD OF THE SAME 失效
标题翻译：压电元件及其制造方法
公开(公告)号：US20100187953A1
公开(公告)日：2010-07-29
申请号：US12693710
申请日：2010-01-26
申请人： Takao Ohnishi , Yuhji Umeda , Naoki Goto
发明人： Takao Ohnishi , Yuhji Umeda , Naoki Goto
IPC分类号： H01L41/047 , H01L41/22
CPC分类号： H01L41/29 , H01L41/047 , H01L41/0477 , H01L41/0973 , H01L41/314 , Y10T29/42
摘要： There is disclosed a piezoelectric/electrostrictive element which can be used as a sensor, even if a piezoelectric/electrostrictive layer cracks. Provided is a piezoelectric/electrostrictive element 10 comprising a substrate 11, a lower electrode layer 12 secured onto the substrate 11, and a piezoelectric/electrostrictive layer 13 secured onto the lower electrode layer 12, and the coverage of the lower electrode layer 12 with respect to the substrate 11 is 98% or less.
摘要翻译：公开了即使压电/电致伸缩层裂纹也可以用作传感器的压电/电致伸缩元件。提供一种压电/电致伸缩元件10，其包括基板11，固定在基板11上的下电极层12和固定在下电极层12上的压电/电致伸缩层13和下电极层12的覆盖范围相对于基板11为98％以下。

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