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1. 发明授权

US07353076B2 Vacuum processing method and vacuum processing apparatus 有权
标题翻译：真空加工方法和真空处理装置
公开(公告)号：US07353076B2
公开(公告)日：2008-04-01
申请号：US11362012
申请日：2006-02-27
申请人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
发明人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
IPC分类号： G06F19/00
CPC分类号： H01L21/68
摘要： The invention provides a semiconductor processing apparatus having a high throughput capable of appropriately coping with the positional displacement that may occur during transfer of the wafer after correcting the position thereof, without slowing down the transfer speed of the wafer. A position correction quantity of the wafer with respect to a vacuum robot is computed based on the outputs of a θ axis sensor for detecting the interception angle of the wafer during rotation of the vacuum robot and an R axis sensor for detecting the interception distance of the wafer during expansion and contraction of the vacuum robot. If the position correction quantity exceeds a predetermined standard value, an operation to change the position data is performed, and if the distance data obtained based on the outputs from the θ axis sensor and the R axis sensor exceeds a predetermined permissible value, it is determined that a displacement error has occurred and the operation is stopped.
摘要翻译：本发明提供了一种具有高通量的半导体处理装置，其能够适当地应对在校正其位置之后在晶片传送期间可能发生的位置偏移，而不会减慢晶片的传送速度。基于用于检测真空机器人旋转期间的晶片的截取角度的θ轴传感器的输出和用于检测真空机器人的截取距离的R轴传感器，计算晶片相对于真空机器人的位置校正量真空机器人的膨胀和收缩期间的晶片。如果位置校正量超过预定的标准值，则执行改变位置数据的操作，并且如果基于θ轴传感器和R轴传感器的输出获得的距离数据超过预定的允许值，则确定发生位移误差，并停止操作。

2. 发明申请

US20070100488A1 Vacuum processing method and vacuum processing apparatus 有权
标题翻译：真空加工方法和真空处理装置
公开(公告)号：US20070100488A1
公开(公告)日：2007-05-03
申请号：US11362012
申请日：2006-02-27
申请人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
发明人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
IPC分类号： G06F19/00
CPC分类号： H01L21/68
摘要： The invention provides a semiconductor processing apparatus having a high throughput capable of appropriately coping with the positional displacement that may occur during transfer of the wafer after correcting the position thereof, without slowing down the transfer speed of the wafer. A position correction quantity of the wafer with respect to a vacuum robot is computed based on the outputs of a θ axis sensor for detecting the interception angle of the wafer during rotation of the vacuum robot and an R axis sensor for detecting the interception distance of the wafer during expansion and contraction of the vacuum robot. If the position correction quantity exceeds a predetermined standard value, an operation to change the position data is performed, and if the distance data obtained based on the outputs from the θ axis sensor and the R axis sensor exceeds a predetermined permissible value, it is determined that a displacement error has occurred and the operation is stopped.
摘要翻译：本发明提供了一种具有高通量的半导体处理装置，其能够适当地应对在校正其位置之后在晶片传送期间可能发生的位置偏移，而不会减慢晶片的传送速度。基于用于检测真空机器人旋转期间的晶片的截取角度的θ轴传感器的输出和用于检测真空机器人的截取距离的R轴传感器，计算晶片相对于真空机器人的位置校正量真空机器人的膨胀和收缩期间的晶片。如果位置校正量超过预定的标准值，则执行改变位置数据的操作，并且如果基于θ轴传感器和R轴传感器的输出获得的距离数据超过预定的允许值，则确定发生位移误差，并停止操作。

3. 外观设计

USD546354S1 Semiconductor manufacturing apparatus 有权
标题翻译：半导体制造装置
公开(公告)号：USD546354S1
公开(公告)日：2007-07-10
申请号：US29237008
申请日：2005-08-26
申请人： Hideki Kihara , Minoru Soraoka , Yuzo Ohirabaru , Nobuo Nagayasu
设计人： Hideki Kihara , Minoru Soraoka , Yuzo Ohirabaru , Nobuo Nagayasu

4. 发明申请

US20060054278A1 Plasma processing apparatus 审中-公开
标题翻译：等离子体处理装置
公开(公告)号：US20060054278A1
公开(公告)日：2006-03-16
申请号：US11065561
申请日：2005-02-25
申请人： Akitaka Makino , Hideki Kihara , Susumu Tauchi , Minoru Yatomi , Nobuo Nagayasu
发明人： Akitaka Makino , Hideki Kihara , Susumu Tauchi , Minoru Yatomi , Nobuo Nagayasu
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01L21/67248 , H01J37/32522 , H01L21/6719 , H01L21/67196
摘要： The present invention provides a plasma processing apparatus for processing a sample on a sample stand in a vacuum container whose inside pressure is reduced, with a plasma generated in an upper space above the sample stand. The apparatus comprises: an electric discharge chamber disposed in the vacuum container and above the sample stand, and having a discharge-chamber sidewall surrounding the upper space; a vacuum chamber disposed in the vacuum container and below the electric discharge chamber, and in communication with the electric discharge chamber; a vacuum-chamber sidewall disposed inside the vacuum container to surround the sample stand, and constituting a side surface of the vacuum chamber; a first temperature regulator disposed outside the discharge-chamber sidewall to adjust a temperature of the discharge-chamber sidewall; and a second temperature regulator controlling a temperature of the vacuum-chamber sidewall to a value lower than the temperature of the discharge-chamber sidewall.
摘要翻译：本发明提供了一种等离子体处理装置，用于在样品台上的上部空间中产生的等离子体，在样品台上处理内部压力降低的真空容器中的样品。该设备包括：放电室，设置在真空容器中并在样品台上方，并具有围绕上部空间的放电室侧壁; 真空室，设置在所述真空容器中并位于所述放电室的下方，并与所述放电室连通; 设置在所述真空容器内部以包围所述样品台的真空室侧壁，并构成所述真空室的侧面; 第一温度调节器，其布置在所述放电室侧壁外侧，以调节所述放电室侧壁的温度; 以及将所述真空室侧壁的温度控制在比所述排出室侧壁的温度低的值的第二温度调节器。

5. 发明授权

US07296783B2 Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US07296783B2
公开(公告)日：2007-11-20
申请号：US11073652
申请日：2005-03-08
申请人： Hideki Kihara , Tsunehiko Tsubone , Nobuo Nagayasu
发明人： Hideki Kihara , Tsunehiko Tsubone , Nobuo Nagayasu
IPC分类号： F16K3/00
CPC分类号： F16K51/02 , F16K3/18
摘要： An inexpensive and reliable vacuum processing apparatus is provided. The vacuum processing apparatus comprises a sealed gate located between two vacuum vessels for allowing them to communicate with each other and a sample subjected to processing to be transferred from one of the vacuum vessels to the other therethrough; and a gate valve located on a path of the gate, the gate valve including a first and second valve body facing a first and second opening, respectively, and a shaft to which the valve bodies are coupled at one end thereof, the gate valve selectively opening and closing each of the openings. The gate valve includes an axial drive section coupled to the other end of the shaft for moving the shaft in the axial direction thereof, and a rotary drive section located between the one end and the other end of the shaft for rotating the shaft about a predetermined pivot crossing the axis of the shaft. The rotating force is transmitted to a spot on the shaft between the pivot and the other end along the axis of the shaft.
摘要翻译：提供廉价可靠的真空处理装置。真空处理装置包括位于两个真空容器之间的密封门，用于允许它们彼此连通，并且经受处理的样品从一个真空容器传递到另一个; 以及闸阀，其位于门的路径上，闸阀包括分别面向第一和第二开口的第一和第二阀体以及阀体在其一端连接的轴，选择性地选择阀门打开和关闭每个开口。所述闸阀包括与所述轴的另一端连接的轴向驱动部，所述另一端用于沿所述轴的轴向移动所述轴;以及旋转驱动部，位于所述轴的一端与另一端之间，用于使所述轴绕预定枢轴穿过轴的轴线。旋转力沿着轴的轴线传递到枢轴和另一端之间的轴上的点。

6. 发明申请

US20060169939A1 Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US20060169939A1
公开(公告)日：2006-08-03
申请号：US11073652
申请日：2005-03-08
申请人： Hideki Kihara , Tsunehiko Tsubone , Nobuo Nagayasu
发明人： Hideki Kihara , Tsunehiko Tsubone , Nobuo Nagayasu
IPC分类号： F16K25/00
CPC分类号： F16K51/02 , F16K3/18
摘要： An inexpensive and reliable vacuum processing apparatus is provided. The vacuum processing apparatus comprises a sealed gate located between two vacuum vessels for allowing them to communicate with each other and a sample subjected to processing to be transferred from one of the vacuum vessels to the other therethrough; and a gate valve located on a path of the gate, the gate valve including a first and second valve body facing a first and second opening, respectively, and a shaft to which the valve bodies are coupled at one end thereof, the gate valve selectively opening and closing each of the openings. The gate valve includes an axial drive section coupled to the other end of the shaft for moving the shaft in the axial direction thereof, and a rotary drive section located between the one end and the other end of the shaft for rotating the shaft about a predetermined pivot crossing the axis of the shaft. The rotating force is transmitted to a spot on the shaft between the pivot and the other end along the axis of the shaft.
摘要翻译：提供廉价可靠的真空处理装置。真空处理装置包括位于两个真空容器之间的密封门，用于允许它们彼此连通，并且经受处理的样品从一个真空容器传递到另一个; 以及闸阀，其位于门的路径上，闸阀包括分别面向第一和第二开口的第一和第二阀体以及阀体在其一端连接的轴，选择性地选择阀门打开和关闭每个开口。所述闸阀包括与所述轴的另一端连接的轴向驱动部，所述另一端用于沿所述轴的轴向移动所述轴;以及旋转驱动部，位于所述轴的一端与另一端之间，用于使所述轴绕预定枢轴穿过轴的轴线。旋转力沿着轴的轴线传递到枢轴和另一端之间的轴上的点。

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