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1. 发明授权

US08812151B2 Vacuum process device and vacuum process method 有权
标题翻译：真空工艺装置和真空工艺方法
公开(公告)号：US08812151B2
公开(公告)日：2014-08-19
申请号：US13479518
申请日：2012-05-24
申请人： Teruo Nakata , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
发明人： Teruo Nakata , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
IPC分类号： G06F7/00 , G06F19/00
CPC分类号： G05B19/41865 , G05B2219/45032 , H01L21/67276 , Y02P90/18 , Y02P90/20
摘要： An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.
摘要翻译：一种在线性工具式真空处理装置中控制运输的有效方法，其处理过程所需的时间长度不稳定。对于每个处理室，计数正在处理或正在运送到处理室的未处理晶片的数量，并且在确定晶片的传送目的地时，当未处理的晶片的数量等于或大于充电极限除了处理室之外，决定晶片的传送目的地。此外，保留了到处理室的传送路径上的晶片保持机构，并且根据预约状态来决定随后要传送的被处理部件的传送目的地。

2. 发明申请

US20120303158A1 VACUUM PROCESS DEVICE AND VACUUM PROCESS METHOD 有权
标题翻译：真空过程装置和真空过程方法
公开(公告)号：US20120303158A1
公开(公告)日：2012-11-29
申请号：US13479518
申请日：2012-05-24
申请人： Teruo NAKATA , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
发明人： Teruo NAKATA , Keita Nogi , Satomi Inoue , Michinori Kawaguchi
IPC分类号： H01L21/677 , G06F7/00
CPC分类号： G05B19/41865 , G05B2219/45032 , H01L21/67276 , Y02P90/18 , Y02P90/20
摘要： An efficient method of controlling transportation in a linear tool type vacuum process device in a state that a length of time required for a process is not stable. For each process chamber, the number of unprocessed wafers that are in process or are being transported to the process chamber is counted, and in deciding a transport destination of a wafer, when the number of unprocessed wafers is equal to or larger than a charge limit amount, a transport destination of a wafer is decided excluding the process chamber. Also, a wafer holding mechanism on a transport path to a process chamber is reserved, and a transport destination of a processed member to be transported next is decided according to a status of reservation.
摘要翻译：一种在线性工具式真空处理装置中控制运输的有效方法，其处理过程所需的时间长度不稳定。对于每个处理室，计数正在处理或正在运送到处理室的未处理晶片的数量，并且在确定晶片的传送目的地时，当未处理的晶片的数量等于或大于充电极限除了处理室之外，决定晶片的传送目的地。此外，保留了到处理室的传送路径上的晶片保持机构，并且根据预约状态来决定随后要传送的被处理部件的传送目的地。

3. 发明授权

US07353076B2 Vacuum processing method and vacuum processing apparatus 有权
标题翻译：真空加工方法和真空处理装置
公开(公告)号：US07353076B2
公开(公告)日：2008-04-01
申请号：US11362012
申请日：2006-02-27
申请人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
发明人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
IPC分类号： G06F19/00
CPC分类号： H01L21/68
摘要： The invention provides a semiconductor processing apparatus having a high throughput capable of appropriately coping with the positional displacement that may occur during transfer of the wafer after correcting the position thereof, without slowing down the transfer speed of the wafer. A position correction quantity of the wafer with respect to a vacuum robot is computed based on the outputs of a θ axis sensor for detecting the interception angle of the wafer during rotation of the vacuum robot and an R axis sensor for detecting the interception distance of the wafer during expansion and contraction of the vacuum robot. If the position correction quantity exceeds a predetermined standard value, an operation to change the position data is performed, and if the distance data obtained based on the outputs from the θ axis sensor and the R axis sensor exceeds a predetermined permissible value, it is determined that a displacement error has occurred and the operation is stopped.
摘要翻译：本发明提供了一种具有高通量的半导体处理装置，其能够适当地应对在校正其位置之后在晶片传送期间可能发生的位置偏移，而不会减慢晶片的传送速度。基于用于检测真空机器人旋转期间的晶片的截取角度的θ轴传感器的输出和用于检测真空机器人的截取距离的R轴传感器，计算晶片相对于真空机器人的位置校正量真空机器人的膨胀和收缩期间的晶片。如果位置校正量超过预定的标准值，则执行改变位置数据的操作，并且如果基于θ轴传感器和R轴传感器的输出获得的距离数据超过预定的允许值，则确定发生位移误差，并停止操作。

4. 发明申请

US20070100488A1 Vacuum processing method and vacuum processing apparatus 有权
标题翻译：真空加工方法和真空处理装置
公开(公告)号：US20070100488A1
公开(公告)日：2007-05-03
申请号：US11362012
申请日：2006-02-27
申请人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
发明人： Nobuo Nagayasu , Hideki Kihara , Michinori Kawaguchi , Yuuzou Oohirabaru
IPC分类号： G06F19/00
CPC分类号： H01L21/68
摘要： The invention provides a semiconductor processing apparatus having a high throughput capable of appropriately coping with the positional displacement that may occur during transfer of the wafer after correcting the position thereof, without slowing down the transfer speed of the wafer. A position correction quantity of the wafer with respect to a vacuum robot is computed based on the outputs of a θ axis sensor for detecting the interception angle of the wafer during rotation of the vacuum robot and an R axis sensor for detecting the interception distance of the wafer during expansion and contraction of the vacuum robot. If the position correction quantity exceeds a predetermined standard value, an operation to change the position data is performed, and if the distance data obtained based on the outputs from the θ axis sensor and the R axis sensor exceeds a predetermined permissible value, it is determined that a displacement error has occurred and the operation is stopped.
摘要翻译：本发明提供了一种具有高通量的半导体处理装置，其能够适当地应对在校正其位置之后在晶片传送期间可能发生的位置偏移，而不会减慢晶片的传送速度。基于用于检测真空机器人旋转期间的晶片的截取角度的θ轴传感器的输出和用于检测真空机器人的截取距离的R轴传感器，计算晶片相对于真空机器人的位置校正量真空机器人的膨胀和收缩期间的晶片。如果位置校正量超过预定的标准值，则执行改变位置数据的操作，并且如果基于θ轴传感器和R轴传感器的输出获得的距离数据超过预定的允许值，则确定发生位移误差，并停止操作。

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