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1. 发明申请

US20060255822A1 Cooling fin connected to a cooling unit and a pusher of the testing apparatus 有权
标题翻译：冷却翅片连接到测试装置的冷却单元和推动器
公开(公告)号：US20060255822A1
公开(公告)日：2006-11-16
申请号：US11483075
申请日：2006-07-10
申请人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
发明人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
IPC分类号： G01R31/02
CPC分类号： G01R31/01 , G01R1/0458 , G01R31/2806 , G01R31/2862 , G01R31/2863 , G01R31/2868 , G01R31/2877
摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.
摘要翻译：一种装置测试装置，包括可拆卸地安装有被测试的电子设备的连接端子，用于沿着连接端子的方向推动电子设备以将电子设备连接到连接端子的推动器，以及用于冷却电子设备。作为冷却单元，例如使用电力冷却装置的元件。冷却单元包括用于吹送电子设备周围的冷却介质的冷却介质鼓风机和通过吹送冷却介质而提高冷却效率的热交换突起或凹部。在设备测试装置中，即使电子设备在测试期间自身产生热量，电子设备通过推动器，连接端子或插座被冷却，因此电子设备产生的热量的影响被消除，并且电子设备可以按照说明书中规定的预定温度进行测试。

2. 发明授权

US07362117B2 Cooling fin connected to a cooling unit and a pusher of the testing apparatus 有权
标题翻译：冷却翅片连接到测试装置的冷却单元和推动器
公开(公告)号：US07362117B2
公开(公告)日：2008-04-22
申请号：US11483075
申请日：2006-07-10
申请人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
发明人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
IPC分类号： G01R31/02
CPC分类号： G01R31/01 , G01R1/0458 , G01R31/2806 , G01R31/2862 , G01R31/2863 , G01R31/2868 , G01R31/2877
摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.
摘要翻译：一种装置测试装置，包括可拆卸地安装有被测试的电子设备的连接端子，用于沿着连接端子的方向推动电子设备以将电子设备连接到连接端子的推动器，以及用于冷却电子设备。作为冷却单元，例如使用电力冷却装置的元件。冷却单元包括用于吹送电子设备周围的冷却介质的冷却介质鼓风机和通过吹送冷却介质而提高冷却效率的热交换突起或凹部。在设备测试装置中，即使电子设备在测试期间自身产生热量，电子设备通过推动器，连接端子或插座被冷却，因此电子设备产生的热量的影响被消除，并且电子设备可以按照说明书中规定的预定温度进行测试。

3. 发明申请

US20050225346A1 Cooling fin connected to a cooling unit and a pusher of the testing apparatus 审中-公开
标题翻译：冷却翅片连接到测试装置的冷却单元和推动器
公开(公告)号：US20050225346A1
公开(公告)日：2005-10-13
申请号：US11148386
申请日：2005-06-09
申请人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
发明人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
IPC分类号： G01R31/26 , G01R1/04 , G01R31/00 , G01R31/01 , G01R31/02 , G01R31/28 , G01R31/303
CPC分类号： G01R31/01 , G01R1/0458 , G01R31/2806 , G01R31/2862 , G01R31/2863 , G01R31/2868 , G01R31/2877
摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.
摘要翻译：一种装置测试装置，包括可拆卸地安装有被测试的电子设备的连接端子，用于沿着连接端子的方向推动电子设备以将电子设备连接到连接端子的推动器，以及用于冷却电子设备。作为冷却单元，例如使用电力冷却装置的元件。冷却单元包括用于吹送电子设备周围的冷却介质的冷却介质鼓风机和通过吹送冷却介质而提高冷却效率的热交换突起或凹部。在设备测试装置中，即使电子设备在测试期间自身产生热量，电子设备通过推动器，连接端子或插座被冷却，因此电子设备产生的热量的影响被消除，并且电子设备可以按照说明书中规定的预定温度进行测试。

4. 发明授权

US06919734B2 Cooling fin connected to a cooling unit and a pusher of the testing apparatus 有权
公开(公告)号：US06919734B2
公开(公告)日：2005-07-19
申请号：US10716613
申请日：2003-11-20
申请人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
发明人： Noboru Saito , Hiroyuki Takahashi , Noriyuki Igarashi , Keiichi Fukumoto , Hiroto Nakamura , Yutaka Watanabe , Kenichi Shimada
IPC分类号： G01R31/26 , G01R1/04 , G01R31/00 , G01R31/01 , G01R31/02 , G01R31/28 , G01R31/303
CPC分类号： G01R31/01 , G01R1/0458 , G01R31/2806 , G01R31/2862 , G01R31/2863 , G01R31/2868 , G01R31/2877
摘要： A device testing apparatus including a connection terminal to which an electronic device under test is detachably attached, a pusher for pushing the electronic device in the direction of the connection terminal so as to connect the electronic device to the connection terminal, and a cooling unit for cooling the electronic device. As the cooling unit, an element cooling the device using electricity is for example used. The cooling unit includes a cooling medium blower for blowing a cooling medium around the electronic device and heat exchange projections or depressions for raising the cooling efficiency by blowing a cooling medium. In the device testing apparatus, even if the electronic device generates heat on its own during testing, the electronic device is cooled through the pusher, connection terminals, or socket, so the effect of the heat generated by the electronic device is canceled out and the electronic device can be tested at the predetermined temperature as prescribed in the specification.

5. 发明授权

US5469953A Transport mechanism for IC handlers 失效
标题翻译： IC处理程序的运输机制
公开(公告)号：US5469953A
公开(公告)日：1995-11-28
申请号：US197190
申请日：1994-02-16
申请人： Noriyuki Igarashi , Keiichi Fukumoto
发明人： Noriyuki Igarashi , Keiichi Fukumoto
IPC分类号： B25J15/06 , G01R31/26 , H01L21/677 , H05K13/04 , B65G47/00
CPC分类号： H05K13/0408
摘要： transport mechanism for integrated circuit (IC) handlers with four transport stations spaced 90.degree. apart on one circumference are supported by a cross-shaped contact arm, and below the circumference, contact-in, contact or test and contact-out stages are provided at intervals of 90.degree.. Each transport station has a vertically movable air chuck unit and an air chuck driving mechanism for driving the air chuck unit vertically and holding by suction and releasing devices under test. The transport station that has reached a predetermined position above the contact-in stage presses the air chuck unit down with the air chuck driving mechanism and suck and lifts the devices to be tested off the contact-in stage. In parallel with the operation at the contact-in stage, the transport station, staying above the contact or test stage, lowers the air chuck unit which holds devices to be tested and fixes them onto the contact or test stage to start testing them, and the transport station above the contact-out stage lowers the air chuck unit holding tested devices and releases them onto the contact-out stage, thereafter raising the empty air chuck unit. Each time the contact arm is turned 90.degree., these operations are repeated.
摘要翻译：具有在一个圆周上间隔90度的四个运输站的集成电路（IC）处理器的传送机构由十字形接触臂支撑，并且在圆周下方，提供接触，接触或测试和接触阶段间隔90度。每个运送站具有垂直移动的空气卡盘单元和用于垂直驱动空气卡盘单元并通过被测试的抽吸和释放装置保持的空气卡盘驱动机构。已经到达接触阶段以上的预定位置的运送站用空气卡盘驱动机构向下压空气卡盘单元，并将待测试的装置从接合阶段抽吸。与接触阶段的操作并行，运输站停留在接触或测试阶段以上，降低了保持要测试设备的空气卡盘单元，并将其固定在接触或测试台上以开始测试，接触台以上的运送站降低了保持测试装置的空气卡盘单元并将其释放到接触阶段，然后升高空气卡盘单元。每当接触臂转90°时，重复这些操作。

6. 发明授权

US5528160A Spacing frame structure for IC handler 失效
标题翻译： IC处理程序的间隔框架结构
公开(公告)号：US5528160A
公开(公告)日：1996-06-18
申请号：US296227
申请日：1994-08-25
申请人： Keiichi Fukumoto , Noriyuki Igarashi
发明人： Keiichi Fukumoto , Noriyuki Igarashi
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66 , G01R31/02
CPC分类号： G01R1/07314 , G01R31/2893
摘要： An improved structure for a spacing frame for interfacing a test head of an IC tester and an IC handler wherein the spacing frame can be changed in a short period of time without moving the test head of the IC tester or the IC handler. The spacing frame and the temperature chamber provide a unique structure which is capable of inserting and replacing the spacing frame within a vertical space in the chamber and locking the spacing frame in the predetermined position in the chamber. The spacing frame structure includes a spacing frame body to interface the IC handler and the IC tester which has a socket guide at its top which is horizontally extended from the body and a flange at its middle portion, a temperature chamber having an opening for receiving said spacing frame body therein, a performance board connected to a bottom of the spacing frame body for providing electric signals from the IC device to be tested to the IC tester, an IC socket for receiving the IC device to be tested therein, and a locking mechanism to provide a vertical movement to the spacing frame body such that the spacing frame body is free when it is in an upper position and is locked when it is in a lower position.
摘要翻译：用于连接IC测试仪的测试头和IC处理器的间隔框架的改进结构，其中间隔框架可以在短时间内改变，而不移动IC测试仪或IC处理器的测试头。间隔框架和温度室提供了独特的结构，其能够插入和更换腔室中的垂直空间内的间隔框架，并将间隔框架锁定在腔室中的预定位置。间隔框架结构包括间隔框架主体，用于连接IC处理器和IC测试器，IC测试器在其顶部具有水平延伸的插座引导件和在其中间部分处的凸缘，温度室具有用于接收所述间隔框架主体，连接到间隔框体的底部的性能板，用于从IC测试仪提供待测试的IC装置的电信号; IC卡插座，用于接收要测试的IC器件;以及锁定机构以向间隔框架体提供垂直运动，使得间隔框架主体在其处于上部位置时是自由的，并且当其处于较低位置时被锁定。

7. 发明授权

US5859540A Constant temperature chamber in a handler for semiconductor device testing apparatus 失效
标题翻译：半导体器件测试仪器处理器中的恒温室
公开(公告)号：US5859540A
公开(公告)日：1999-01-12
申请号：US705859
申请日：1996-08-28
申请人： Keiichi Fukumoto
发明人： Keiichi Fukumoto
IPC分类号： G01R31/26 , B01L7/02 , G01R31/28 , G01R31/30 , A21B1/00
CPC分类号： G01R31/2874 , B01L7/02 , G01R31/2862
摘要： A constant temperature chamber to be disposed in a handler for use with an IC tester is provided which is capable of preheating semiconductor devices to be measured to a preset temperature uniformly and in a short time. A rotary stage adapted to rotate with semiconductor devices to be measured loaded thereon is disposed in the bottom of the constant temperature chamber enclosed by thermal insulation walls. A heater is disposed in the upper portion of the constant temperature chamber. An axial-flow fan is positioned between the heater and the rotary stage. Further, a tubular flow-rectifying member is disposed surrounding and in proximity to the outer periphery of the axial-flow fan. A gas flow produced by rotatively driving the axial-flow fan is rectified by the flow-rectifying member with no turbulences occurring, and a circulating rectified gas flow is thereby formed from the axial-flow fan to pass through the rotary stage, and then advancing radially outwardly through between the undersurface of the rotary stage and the bottom thermal insulation wall of the constant temperature chamber, followed by rising in swirling streams along the interior of the thermal insulation walls of the chamber and flowing back to the axial-flow fan.
摘要翻译：提供一种待设置在与IC测试仪一起使用的处理器中的恒温室，其能够在短时间内将要测量的半导体器件预热到预设温度。设置在由绝热壁包围的恒温室的底部中的适于与被测量的半导体器件一起旋转的旋转台。加热器设置在恒温室的上部。轴流风扇位于加热器和旋转台之间。此外，管状流动整流构件设置在轴流风扇的外周周围并且靠近轴流风扇的外周。通过旋转驱动轴流风扇产生的气流由流动整流构件整流而没有发生湍流，并且由轴流风扇形成循环的整流气流，通过旋转台，然后前进径向向外通过旋转台的下表面和恒温室的底部绝热壁之间，随后沿着室的隔热壁的内部旋转流升起并流回到轴流风扇。

8. 发明授权

US5789685A Structure of rotary arm and device chuck part of a device handler 失效
标题翻译：旋转臂和装置卡盘的结构装置处理器的部件
公开(公告)号：US5789685A
公开(公告)日：1998-08-04
申请号：US773105
申请日：1996-12-26
申请人： Keiichi Fukumoto
发明人： Keiichi Fukumoto
IPC分类号： H05K13/04 , G01R1/04
CPC分类号： H05K13/0408
摘要： A device handler prevents a dropping of a device chuck mounted to a rotary arm owing to a breaking of a coil spring and a stoppage of the device chuck at an elevation in the mid way of vertical movements owing to a defect or failure of a linear guide, preventing the device chuck and/or an exit stage from being damaged or broken. A first guide rail is provided along a downwardly inclined camming surface of a cam member extending from the vicinity above a soak stage to a vicinity above a measuring section, and a second guide rail is provided along an upwardly inclined camming surface of the cam member extending from the vicinity above the measuring section to the vicinity above the exit stage. In addition, on the opposite side of a cam holder about the rotary shaft of the rotary arm unit is placed an arcuate dropping preventive plate mounted to the props depending from the ceiling insulation wall of the constant temperature chamber like the cam holder. Further, a hook is mounted to the upper portion of each of the device chucks. The hook can slide on any one of the first guide rail, the second guide rail, and the dropping preventive plate in the manner engaged therewith when an accident occurs.
摘要翻译：由于线性导轨的缺陷或故障，设备处理器防止由于螺旋弹簧的断裂和装置卡盘在垂直运动的中间方向的高度处的停止而使安装到旋转臂的装置卡盘掉落，防止装置卡盘和/或出口台被损坏或破损。第一导轨沿凸轮构件的向下倾斜的凸轮表面设置，该凸轮构件从浸泡台附近延伸到测量区域附近的附近，并且第二导轨沿着凸轮构件的向上倾斜的凸轮表面设置，从测量区域附近的附近到出口处的附近。此外，在旋转臂单元的旋转轴周围的凸轮保持器的相对侧设置有弧形防滴板，其安装在与恒温室的顶壁绝缘壁相同的支柱上，如同凸轮保持器。此外，钩子安装到每个装置卡盘的上部。当发生事故时，钩可以以与其接合的方式在第一导轨，第二导轨和防落落板中的任何一个上滑动。

9. 发明授权

US5742168A Test section for use in an IC handler 失效
标题翻译：用于IC处理程序的测试部分
公开(公告)号：US5742168A
公开(公告)日：1998-04-21
申请号：US691724
申请日：1996-08-02
申请人： Toshiyuki Kiyokawa , Keiichi Fukumoto
发明人： Toshiyuki Kiyokawa , Keiichi Fukumoto
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/06705
摘要： A test section for use in an IC handler capable of testing even high speed operating IC devices with precision is provided. A mounting fixture 62 for connecting a test head 32 of an IC tester with the constant temperature chamber 20 of the IC handler is configured to be detachable with respect to the base 10a of the body of the IC handler, and a socket guide 70 having IC sockets mounted therein is also configured to be detachable with respect to the mounting fixture 62. With this construction, it is possible to minimize the length of the electric path between the performance board 35 and the terminals of the IC sockets. In addition, the IC sockets may be mounted even directly on the performance board 35. It is thus possible to carry out the testing utilizing all types of test heads by preparing various mounting fixtures matching with the test heads used.
摘要翻译：提供了一种用于能够精确测试高速操作IC器件的IC处理器的测试部分。用于将IC测试器的测试头32与IC处理器的恒温室20连接的安装固定件62被配置为可相对于IC处理器的主体的基座10a拆卸，并且具有IC 安装在其中的插座也被构造成相对于安装固定件62可拆卸。利用这种结构，可以使性能板35和IC插座的端子之间的电路的长度最小化。此外，IC插座甚至可以直接安装在性能板35上。因此，可以通过准备与所使用的测试头相匹配的各种安装夹具，来实现利用所有类型的测试头的测试。

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