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    • 8. 发明授权
    • Heating apparatus with piezoelectric device sensor
    • 带压电装置传感器的加热装置
    • US4672180A
    • 1987-06-09
    • US850571
    • 1986-04-11
    • Shigeru KusunokiNaoyoshi Maehara
    • Shigeru KusunokiNaoyoshi Maehara
    • H05B6/64B01J19/12F24C7/02G01K7/00H05B6/68H05B6/80G01R27/26
    • H05B6/6435B01J19/126H05B6/642H05B6/645H05B6/6458H05B6/666B01J2219/1215
    • In an exhaust passage (37) of a heating apparatus, a piezoelectric device sensor (26) is provided for detecting the heating condition of a heated object (32), such as food in a microwave open heating chamber (31). A piezoelectric device of the sensor may be contained within a metal casing (53) and be hermetically sealed. An output signal from the piezoelectric device sensor is processed by circuitry including an amplifier (27) having a predetermined frequency response so that only particular frequency components lower than that of a conventional a.c. supply are amplified and then compared with a threshold to detect whether a sufficient amount of moisture of hot steam is emitted from the object in the heating chamber of the heating apparatus. The invention may be applied to prevent overheating of food in a microwave oven, temperature control of chemical processes, or the like, to control heating time.
    • 在加热装置的排气通路(37)中,设置有用于检测加热物(32)在微波开放加热室(31)内的食品的加热状态的压电装置传感器(26)。 传感器的压电装置可以容纳在金属壳体(53)内并被密封。 来自压电装置传感器的输出信号由包括具有预定频率响应的放大器(27)的电路处理,使得仅特定频率分量低于常规直流电压的特定频率分量。 电源被放大,然后与阈值进行比较,以检测是否从加热装置的加热室中的物体发出足够量的热蒸汽的水分。 本发明可以应用于防止微波炉中的食物过热,化学处理的温度控制等,以控制加热时间。
    • 9. 发明授权
    • Semiconductor device
    • 半导体器件
    • US09041097B2
    • 2015-05-26
    • US13849344
    • 2013-03-22
    • Shigeru Kusunoki
    • Shigeru Kusunoki
    • H01L29/66H01L29/16H01L29/423H01L29/739H01L29/49
    • H01L29/66666H01L29/1602H01L29/1608H01L29/4232H01L29/4916H01L29/7397
    • A semiconductor device includes a channel layer formed on a substrate, an insulating layer formed in contact with the channel layer, an impurity-doped first semiconductor layer formed on an opposite side of the insulating layer from the channel layer, an impurity-doped second semiconductor layer formed on an opposite side of the first semiconductor layer from the insulating layer, and a gate electrode formed on an opposite side of the second semiconductor layer from the first semiconductor layer. A quotient of an impurity density of the first semiconductor layer divided by a relative permittivity of the first semiconductor layer is greater than a quotient of an impurity density of the second semiconductor layer divided by a relative permittivity of the second semiconductor layer.
    • 半导体器件包括形成在衬底上的沟道层,与沟道层接触形成的绝缘层,形成在绝缘层与沟道层相反的一侧的杂质掺杂的第一半导体层,杂质掺杂的第二半导体 在第一半导体层的与绝缘层相反的一侧形成的层,以及形成在第二半导体层与第一半导体层相反的一侧上的栅电极。 第一半导体层的杂质浓度除以第一半导体层的相对介电常数的商大于第二半导体层的杂质浓度除以第二半导体层的相对介电常数的商。