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    • 7. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US08545668B2
    • 2013-10-01
    • US13545685
    • 2012-07-10
    • Takeshi Yoshida
    • Takeshi Yoshida
    • H01L21/304B08B3/04
    • H01L21/67051
    • A substrate processing apparatus comprises a substrate holding mechanism, a process liquid supplying mechanism supplying a process liquid, a first guide portion around the substrate holding mechanism having an upper edge portion extending toward the rotation axis for guiding scattered process to flow down, a second guide portion provided around the substrate holding mechanism outside the first guide portion and having an upper edge portion extending toward the rotation axis as vertically overlapping with the upper edge portion of the first guide portion for further guiding the scattered process liquid to flow down, a recovery channel provided outside and integrally with the first guide portion for recovering the process liquid guided by the second guide portion, and a driving mechanism for moving up and down the first guide portion and the second guide portion independently of each other.
    • 一种基板处理装置,包括基板保持机构,供给处理液的处理液供给机构,具有朝向旋转轴延伸的上边缘部的基板保持机构周围的第一引导部,用于引导分散处理向下流动;第二引导件 在所述第一引导部的外侧设置在所述基板保持机构周围的部分,具有与所述第一引导部的所述上缘部垂直重叠的朝向所述旋转轴延伸的上边缘部,用于进一步引导所述散射处理液体向下流动, 设置在与第一引导部分的外部并整体上,用于回收由第二引导部分引导的处理液体;以及驱动机构,用于彼此独立地上下移动第一引导部分和第二引导部分。
    • 8. 发明授权
    • Solid-state image sensor and method of manufacturing the same
    • 固态图像传感器及其制造方法
    • US08519499B2
    • 2013-08-27
    • US12845194
    • 2010-07-28
    • Mariko SaitoIkuko InoueTakeshi Yoshida
    • Mariko SaitoIkuko InoueTakeshi Yoshida
    • H01L29/00
    • H01L27/1464H01L27/14609H01L27/14636H01L27/14645
    • According to one embodiment, a solid-state image sensor includes a semiconductor substrate including a first surface on which light enters, and a second surface opposite to the first surface, a pixel region formed in the semiconductor substrate, and including a photoelectric conversion element which converts the incident light into an electrical signal, a peripheral region formed in the semiconductor substrate, and including a circuit which controls an operation of the element in the pixel region, a plurality of interconnects which are formed in a plurality of interlayer insulating films stacked on the second surface, and are connected to the circuit, and a support substrate formed on the stacked interlayer insulating films and the interconnects. An uppermost one of the interconnects formed in an uppermost one of the interlayer insulating films is buried in a first trench formed in the uppermost interlayer insulating film.
    • 根据一个实施例,固态图像传感器包括:半导体衬底,包括光入射的第一表面和与第一表面相对的第二表面;形成在半导体衬底中的像素区域,并且包括光电转换元件, 将入射光转换为电信号,形成在半导体衬底中的周边区域,并且包括控制像素区域中的元件的操作的电路;多个互连,其形成在堆叠在多个层间绝缘膜 第二表面,并且连接到电路,以及形成在层叠的层间绝缘膜和互连件上的支撑衬底。 形成在最上层的层间绝缘膜中的最上层的一个互连掩埋在最上层的层间绝缘膜中形成的第一沟槽中。
    • 9. 发明申请
    • IMAGE FORMING APPARATUS
    • 图像形成装置
    • US20120242035A1
    • 2012-09-27
    • US13425291
    • 2012-03-20
    • Takeshi Yoshida
    • Takeshi Yoshida
    • B65H31/26
    • B65H31/20B65H31/02B65H31/26B65H2301/4212B65H2405/1111B65H2405/1112B65H2405/1114B65H2801/06
    • An image forming apparatus includes a housing, an image forming unit disposed inside the housing, a discharging portion, a stacking unit and a pressing member. The discharging portion is configured to discharge a sheet medium on which an image is formed by the image forming unit. The stacking unit is configured to stack the sheet medium discharged from the discharging portion. The stacking unit includes a stacking surface portion on which the sheet medium is stacked. The stacking surface portion includes a planar portion formed flat and a protruding portion configured to protrude upwardly from the planar portion. The pressing member is disposed in contact with an upper surface of the sheet medium stacked on the stacking surface portion.
    • 图像形成装置包括壳体,设置在壳体内部的图像形成单元,排出部,堆叠单元和按压构件。 排出部被配置为对由图像形成单元在其上形成有图像的片材介质进行排出。 堆叠单元构造成堆叠从排出部排出的片材介质。 堆叠单元包括堆叠表面部分,片材介质堆叠在该堆叠表面部分上。 堆叠表面部分包括平坦部分的平面部分和从平面部分向上突出的突出部分。 按压构件设置成与堆叠在堆叠表面部分上的片介质的上表面接触。