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1. 发明申请

US20090242411A1 POLYIMIDE-METAL LAMINATED BODY AND POLYIMIDE CIRCUIT BOARD 审中-公开
标题翻译：聚酰亚胺金属层压体和聚酰亚胺电路板
公开(公告)号：US20090242411A1
公开(公告)日：2009-10-01
申请号：US12465922
申请日：2009-05-14
申请人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
发明人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
IPC分类号： H05K3/00 , C25D5/02
CPC分类号： H05K3/38 , H05K1/0346 , H05K3/181 , H05K3/426 , H05K2201/0154 , H05K2201/0175 , Y10T428/24917 , Y10T428/31721
摘要： A process for producing a polyimide-metal laminated body includes forming a metal conductive layer on a polyimide film having a ceramic-modified or pseudoceramic-modified surface with a wet plating process which includes forming at least a ground treatment layer by electroless plating, conducting electroless metal plating and conducting electrolytic copper plating.
摘要翻译：一种聚酰亚胺 - 金属层叠体的制造方法，其特征在于，在具有陶瓷改性或假陶瓷改性面的聚酰亚胺膜上形成金属导电层，其中，所述湿式电镀工艺包括通过无电镀形成至少一层地面处理层，金属电镀和导电电解镀铜。

2. 发明申请

US20080286538A1 Polyimide-Metal Laminated Body and Polyimide Circuit Board 审中-公开
标题翻译：聚酰亚胺金属层压体和聚酰亚胺电路板
公开(公告)号：US20080286538A1
公开(公告)日：2008-11-20
申请号：US10585533
申请日：2005-01-11
申请人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
发明人： Tadahiro Yokozawa , Hiroaki Yamaguchi , Keita Banba , Masao Okubo , Sumiko Okubo
IPC分类号： B32B15/08 , H05K1/03
CPC分类号： H05K3/38 , H05K1/0346 , H05K3/181 , H05K3/426 , H05K2201/0154 , H05K2201/0175 , Y10T428/24917 , Y10T428/31721
摘要： A polyimide-metal laminated body obtained by forming a metal conductive layer on a polyimide film, which has been ceramic-modified or pseudoceramic-modified on at least the surface, by a wet plating process capable of accomplishing metal plating on ceramic. A polyimide-metal laminated body and polyimide circuit board having satisfactory cohesion in wet plating steps, maintain practical cohesion even after high temperature aging treatment, and exhibiting satisfactory electrical insulating reliability, can be obtained.
摘要翻译：在聚酰亚胺膜上形成金属导电层的聚酰亚胺 - 金属层叠体，其通过能够在陶瓷上进行金属电镀的湿式电镀法在至少表面进行陶瓷改性或者假陶瓷改性。在湿式电镀步骤中具有令人满意的内聚力的聚酰亚胺 - 金属层压体和聚酰亚胺电路板，即使在高温时效处理之后也能保持实用的内聚力，并且可以获得令人满意的电绝缘可靠性。

3. 发明授权

US06294922B1 Probe for testing a semiconductor integrated circuit 失效
标题翻译：用于测试半导体集成电路的探头
公开(公告)号：US06294922B1
公开(公告)日：2001-09-25
申请号：US08773252
申请日：1996-12-23
申请人： Masao Okubo , Kazumasa Okubo , Hiroshi Iwata
发明人： Masao Okubo , Kazumasa Okubo , Hiroshi Iwata
IPC分类号： G01R3102
CPC分类号： G01R3/00 , G01R1/07357
摘要： A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.
摘要翻译：第一组装构造的特征在于包括：多个探针，其在接触部分的端部接触到半导体集成电路的电极上时具有弯曲部分以弯曲; 第一板，其设置有与所述探针的连接部分连接的第一布线图案; 第二板，其与所述第一板可移除地紧固并设置有与所述第一布线图形连接的第二布线图案; 安装有第二板的壳体构件用于保持探针的接触部分。下一个配置功能包括：两种探头; 重新测量探针和连接探针，并且当插入设置有第二板的孔中时，接触部分的端部与设置有第一板的布线图案接触时，多个连接探针包括弯曲部分以弯曲; 其中设置有第二板的通孔被定位成与设置有第一板的布线图案的布置对准。因此，避免了由探针引起的接触点的不期望的偏差，并且优选地保持适当的接触压力，并且进一步方便了更换损坏的探针的工作。

4. 发明授权

US5055778A Probe card in which contact pressure and relative position of each probe end are correctly maintained 失效
标题翻译：探针卡，其中每个探头端的接触压力和相对位置被正确地保持
公开(公告)号：US5055778A
公开(公告)日：1991-10-08
申请号：US548401
申请日：1990-07-05
申请人： Kazumasa Okubo , Masao Okubo , Yasuro Yoshimitsu , Kiyoshi Sugaya
发明人： Kazumasa Okubo , Masao Okubo , Yasuro Yoshimitsu , Kiyoshi Sugaya
IPC分类号： G01R1/067 , G01R1/073
CPC分类号： G01R1/07342 , G01R1/06733 , G01R1/06711
摘要： Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable. The disclosure refers to additional devices to enhance the convenience in determining the alignment between the probe front ends and the IC ends, and also in obtaining accurate measurements of an IC chip under test.
摘要翻译：探头卡是测试成品IC芯片的一部分。该卡通常安装有多个探针，非常细的针，大致为L字形，每个探针的前端可以朝向IC芯片向下突出。传统探头难以将所有的探针前端与IC芯片上的电端对齐。在探针前端和IC端部之间的所有触点形成之后，通常会使用过度驱动来产生足够的接触压力，但这种作用往往会导致传统的探针端部从IC端部滑落。所提出的探针卡包括具有弹性绝缘特性的树脂层的新设置，以填充组装到探针卡中的支撑件的中心开口区域。通过这种树脂层的填充使得探头前端弹性地保持在适当的位置，使得通过过驱动偏离适当的各自配置变得可避免。本公开涉及增加确定探针前端和IC端之间的对准的便利性的附加装置，并且还用于获得正在测试的IC芯片的精确测量。

5. 发明授权

US4659397A Manufacturing process for plate or forging of ferrite-austenite two-phase stainless steel 失效
标题翻译：铁素体 - 奥氏体两相不锈钢板或锻造的制造工艺
公开(公告)号：US4659397A
公开(公告)日：1987-04-21
申请号：US646896
申请日：1984-08-31
申请人： Mineo Kobayashi , Takeshi Yoshida , Masahiro Aoki , Masao Okubo , Masaaki Nagayama
发明人： Mineo Kobayashi , Takeshi Yoshida , Masahiro Aoki , Masao Okubo , Masaaki Nagayama
IPC分类号： C22C38/00 , C21D8/00 , C21D9/46 , C22C38/40 , C22C38/54 , C21D7/13
CPC分类号： C21D8/005 , C22C38/40
摘要： This invention relates to a manufacturing process for plate or forging (bar, stamp work or the like) of ferrite-austenite two-phase stainless steel, containing C at 0.03% or below, Si at 2.0% or below, Mn at 2.0% or below, Cr at 25 to 35%, Ni at 6 to 15%, N at 0.35% or below, and Fe and inevitable impurity for the remainder with or without adding B at 0.001 to 0.030% with the following nickel balance value specified at -3 to -9 and comprising an average crystal grain size at 0.015 mm or below from heating an ingot of the above mentioned ferrite-austenite two-phase stainless steel at 1,200.degree. C. or below and keeping a forging ratio by hot working at 5 or over.Ni balance value=Ni %+0.5 Mn %+30.times.(C+N) %-1.1(Cr %+1.5 Si %)+8.2
摘要翻译：本发明涉及含有0.03％以下的C，2.0％以下的Si，2.0％以下的Mn的铁素体 - 奥氏体相两相不锈钢的板或锻造（钢筋，冲压加工等）的制造方法， 25％〜35％的Cr，6〜15％的Ni，0.35％以下的N，Fe和不可避免的杂质，其余有或没有添加B为0.001〜0.030％，以下的镍平衡值规定为：在上述铁素体 - 奥氏体相两相不锈钢锭的1200℃或更低温度下加热锭子的平均晶粒尺寸为0.015mm或更小，并且通过热加工保持锻压比为5或过度。 Ni平衡值= Ni％+ 0.5 Mn％+ 30x（C + N）％-1.1（Cr％+ 1.5Si％）+ 8.2

6. 发明授权

US5729799A Image forming method and apparatus having a semiconductive intermediate transfer member 失效
标题翻译：具有半导体中间转印构件的图像形成方法和装置
公开(公告)号：US5729799A
公开(公告)日：1998-03-17
申请号：US730760
申请日：1996-10-15
申请人： Kazunori Numao , Noriaki Kojima , Masao Okubo , Nobukazu Takahashi
发明人： Kazunori Numao , Noriaki Kojima , Masao Okubo , Nobukazu Takahashi
IPC分类号： G03G15/00 , G03G15/16 , G03G21/06 , G03G21/08 , G03G21/10 , G03G21/00
CPC分类号： G03G21/06
摘要： An image forming apparatus of such a type as is provided with a photosensitive member having a semi-conductive intermediate transfer member disposed opposite the photosensitive member. A charger electrically charges the photosensitive member. An exposure device forms an electrostatic latent image on the photosensitive member and developer visualizes the electrostatic latent image using toner identical in polarity to the photosensitive member. A primary transfer device transfers the toner image to the intermediate transfer member by applying a bias opposite in polarity to the photosensitive member, and a secondary transfer apparatus transfers the toner image on the intermediate transfer member to a transfer material. An optical charge-eliminator optically removes the electrical charge from the photosensitive member. A contact charge-eliminator is provided between the optical charge-eliminator and the primary transfer device so as to completely eliminate the electric charge injected into the photosensitive member at the time of the primary transfer.
摘要翻译：这种类型的图像形成装置设置有具有与感光构件相对设置的半导体中间转印构件的感光构件。充电器使感光元件充电。曝光装置在感光构件上形成静电潜像，并且显影剂使用与感光构件极性相同的调色剂使静电潜像显现。一次转印装置通过施加与感光构件极性相反的偏压将调色剂图像转印到中间转印部件，二次转印装置将中间转印部件上的调色剂图像转印到转印材料上。光学电荷消除器从光敏元件光学去除电荷。在光学电荷消除器和一次转印装置之间提供接触电荷消除器，以便完全消除在一次转印时注入到感光构件中的电荷。

7. 发明授权

US5413789A Antimicrobial composition of aluminosilicate coated silica gel 失效
标题翻译：硅铝酸盐涂层硅胶的抗微生物组成
公开(公告)号：US5413789A
公开(公告)日：1995-05-09
申请号：US61685
申请日：1993-05-17
申请人： Zenji Hagiwara , Masao Okubo
发明人： Zenji Hagiwara , Masao Okubo
IPC分类号： A61L2/16 , A01N25/10 , A01N25/26 , A01N59/16 , A01N59/20 , A01N61/00 , C01B33/159 , C02F1/50 , C08K9/02 , D01F1/10 , D01F6/04
CPC分类号： D01F6/04 , A01N25/10 , A01N25/26 , A01N59/16 , A01N59/20 , C02F1/505 , C08K9/02 , D01F1/103
摘要： The invention provides a novel antibacterial compound and a process for producing it. Futhermore, the invention provides a novel antibacterial polymer composite comprising a polymer and the antimicrobial compositon.
摘要翻译：本发明提供了一种新型的抗菌化合物及其生产方法。此外，本发明提供了包含聚合物和抗微生物组合物的新型抗菌聚合物复合物。

8. 发明授权

US4518914A Testing apparatus of semiconductor wafers 失效
标题翻译：半导体晶片测试装置
公开(公告)号：US4518914A
公开(公告)日：1985-05-21
申请号：US404055
申请日：1982-08-02
申请人： Masao Okubo , Yasuro Yoshimitsu , Fumio Nakai , Oliver R. Garretson
发明人： Masao Okubo , Yasuro Yoshimitsu , Fumio Nakai , Oliver R. Garretson
IPC分类号： G01R1/073 , H01L21/66 , G01R1/06 , G01R31/02
CPC分类号： G01R1/07314 , G01R1/07342
摘要： A testing apparatus of semiconductor wafers includes a base plate and a probe card including probe needles, wherein the probe card is detachably affixed to the base plate under air suction, which is derived from a vacuum produced in an airtightly sealed space provided between the base plate and the probe card.
摘要翻译：半导体晶片的测试装置包括基板和包括探针的探针卡，其中探针卡在空气抽吸下可拆卸地固定到底板，该真空源是由设置在基板之间的气密密封空间中产生的真空和探针卡。

9. 发明授权

US6013169A Method of reforming a tip portion of a probe 失效
标题翻译：重整探头的尖端部分的方法
公开(公告)号：US6013169A
公开(公告)日：2000-01-11
申请号：US38929
申请日：1998-03-09
申请人： Masao Okubo , Kazumasa Okubo , Hiroshi Iwata
发明人： Masao Okubo , Kazumasa Okubo , Hiroshi Iwata
IPC分类号： G01R1/067 , H01L21/66 , C25D5/50
CPC分类号： G01R1/06761 , G01R1/0675
摘要： A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.
摘要翻译：重整钨探针尖端的方法包括在钨探针尖端的表面上形成非氧化性金属膜，在非氧化性气氛或真空中加热该膜，并将该膜扩散到钨探针尖端。非氧化性金属膜可以由金，铂，铑，钯，铱等金属形成。重整的钨探针尖端可用于低电压和低电流测试，具有优异的耐磨性，导电性和抗氧化性。

10. 发明授权

US5298252A Antimicrobial composition having resistance to heat and weathers 失效
标题翻译：具有耐热性和耐候性的抗微生物组合物
公开(公告)号：US5298252A
公开(公告)日：1994-03-29
申请号：US751969
申请日：1991-08-29
申请人： Zenji Hagiwara , Masao Okubo
发明人： Zenji Hagiwara , Masao Okubo
IPC分类号： A01N25/08 , A01N59/16 , A01N59/20 , A01N61/00 , C08K3/34 , C08K9/02 , C08K9/12 , C08L101/00 , B32B5/16
CPC分类号： C08K9/12 , A01N59/16 , A01N59/20 , Y10T428/24826 , Y10T428/2991
摘要： A silica gel based heat-resistant and weatherproof antimicrobial composition having an aluminosilicate layer on the surfaces of pores in the silica gel as substituted by silver and an optional antimicrobial metal, said composition containing ion-exchangeable metals that are chiefly an alkali metal and that are present in an amount of up to 2.57 mmol per gram of said composition on an anhydrous basis.
摘要翻译：一种基于硅胶的耐热和耐候性的抗微生物组合物，其在硅胶作为银取代的孔表面上具有铝硅酸盐层和任选的抗微生物金属，所述组合物含有主要为碱金属的可离子交换的金属，以每克所述组合物的无水量存在高达2.57mmol的量。

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