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    • 2. 发明授权
    • Method for fabricating a semiconductor device
    • 半导体器件的制造方法
    • US6013544A
    • 2000-01-11
    • US610227
    • 1996-03-04
    • Naoki MakitaTadayoshi MiyamotoTsukasa Shibuya
    • Naoki MakitaTadayoshi MiyamotoTsukasa Shibuya
    • H01L21/205H01L21/20H01L21/268H01L21/336H01L21/84H01L29/78H01L29/786
    • H01L21/02532H01L21/02422H01L21/02672H01L21/02675H01L27/1277
    • A method for fabricating a semiconductor device including an active region obtained by utilizing a silicon semiconductor film having crystallinity which is formed on an insulating substrate is disclosed. A crystalline silicon semiconductor film is obtained by introducing catalyst elements for promoting the crystallization into a lower amorphous silicon semiconductor film and then performing a heat treatment onto the lower amorphous silicon semiconductor film. Thereafter, an upper amorphous silicon semiconductor film is formed on the obtained lower crystalline silicon semiconductor film, which is subsequently subjected to a heat treatment so as to obtain an upper crystalline silicon semiconductor film. Then, the upper crystalline silicon semiconductor film is removed. By this process, the catalyst elements remaining in the lower crystalline silicon semiconductor film moves into the upper crystalline silicon semiconductor film. As a result, a concentration of the catalyst elements in the lower crystalline silicon semiconductor film is reduced.
    • 公开了一种制造半导体器件的方法,该半导体器件包括通过利用形成在绝缘衬底上的具有结晶性的硅半导体膜而获得的有源区。 通过将用于促进结晶的催化剂元素引入到下部非晶硅半导体膜中,然后对下部非晶硅半导体膜进行热处理,获得结晶硅半导体膜。 此后,在所获得的下部结晶硅半导体膜上形成上部非晶硅半导体膜,随后对其进行热处理,以获得上部结晶硅半导体膜。 然后,除去上部晶体硅半导体膜。 通过该工艺,残留在下结晶硅半导体膜中的催化剂元素移动到上结晶硅半导体膜中。 结果,下层结晶硅半导体膜中的催化剂元素的浓度降低。
    • 6. 发明授权
    • Active matrix type display device and fabrication method of the same
    • 有源矩阵型显示装置及其制造方法
    • US06172671B2
    • 2001-01-09
    • US09325260
    • 1999-06-03
    • Tsukasa ShibuyaAtsushi YoshinouchiHongyong ZhangAkira Takenouchi
    • Tsukasa ShibuyaAtsushi YoshinouchiHongyong ZhangAkira Takenouchi
    • G09G500
    • G02F1/13454H01L27/1214H01L27/1259H01L27/1288
    • There is provided an active matrix type display in which thin film transistors having required characteristics are provided selectively in a pixel matrix portion and a peripheral driving circuit portion. In a structure having the pixel matrix portion and the peripheral driving circuit portion on the same substrate, N-channel type thin film transistors having source and drain regions formed through a non-self-alignment process and low concentrate impurity regions formed through a self-alignment process are formed in the pixel matrix portion and in an N-channel driver portion of the peripheral driving circuit portion. A P-channel type thin film transistor in which no low concentrate impurity region is formed and source and drain regions are formed only through the self-alignment process is formed in a P-channel driver portion of the peripheral driving circuit portion.
    • 提供一种有源矩阵型显示器,其中具有所需特性的薄膜晶体管选择性地设置在像素矩阵部分和外围驱动电路部分中。 在具有同一衬底上的像素矩阵部分和外围驱动电路部分的结构中,通过非自对准工艺形成的源极和漏极区域和通过自对准工艺形成的低浓缩杂质区域的N沟道型薄膜晶体管, 在外围驱动电路部分的像素矩阵部分和N沟道驱动器部分中形成对准处理。 在周边驱动电路部分的P沟道驱动器部分中形成P型沟道型薄膜晶体管,其中不形成低浓度杂质区,而仅通过自对准工艺形成源极和漏极区。
    • 7. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5624861A
    • 1997-04-29
    • US681512
    • 1996-07-23
    • Tsukasa Shibuya
    • Tsukasa Shibuya
    • H01L29/786H01L21/336H01L21/77H01L21/84H01L21/86H01L21/786
    • H01L27/1214Y10S438/911
    • A manufacturing method of a semiconductor device includes the steps of depositing a metallic film (light-shielding film), an insulating film and a semiconductor film in this order on an insulating substrate, and after patterning the insulating film and the semiconductor film in a predetermined shape, oxidizing an exposed region of the metallic film using the insulating film and the semiconductor film as a mask. As a result, the light-shielding film composed of the metallic film is formed so as to cover the semiconductor film to block light from an external portion. The manufacturing method permits a process of forming a resist pattern for use in forming the light-shielding film and a process of etching the light-shielding film to be omitted, thereby reducing the required number of processes. Moreover, as a level difference is not generated around the light-shielding film, a generation of a level difference on the semiconductor film can be prevented. Furthermore, as the light-shielding film can be formed completely overlapped with the semiconductor film, a reduction in a display region of the semiconductor device can be avoided, thereby improving an aperture ratio.
    • 半导体器件的制造方法包括以下步骤:在绝缘基板上依次沉积金属膜(遮光膜),绝缘膜和半导体膜,并且在预定的绝缘膜和半导体膜图案化之后 使用绝缘膜和半导体膜作为掩模来氧化金属膜的暴露区域。 结果,由金属膜构成的遮光膜形成为覆盖半导体膜以阻挡来自外部的光。 制造方法允许形成用于形成遮光膜的抗蚀剂图案的处理和要被省略的蚀刻光屏蔽膜的工艺,从而减少所需的处理次数。 此外,由于在遮光膜周围不产生电平差,因此可以防止在半导体膜上产生电平差。 此外,由于遮光膜可以与半导体膜完全重叠,所以可以避免半导体器件的显示区域的减少,从而提高孔径比。