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    • 9. 发明授权
    • Test apparatus and manufacturing method
    • 试验装置及制造方法
    • US08892381B2
    • 2014-11-18
    • US13044320
    • 2011-03-09
    • Daisuke WatanabeToshiyuki Okayasu
    • Daisuke WatanabeToshiyuki Okayasu
    • G01R31/26G06F19/00G01R31/319G01R31/3185
    • G01R31/318511G01R31/31926
    • A test apparatus that tests a plurality of devices under test formed on a wafer under test includes a test substrate that faces the wafer under test and is electrically connected to the devices under test, a programmable device that is provided on the test substrate and changes a logic relationship of output logic data with respect to input logic data, according to program data supplied thereto, a plurality of input/output circuits that are provided on the test substrate to correspond to the devices under test and that each supply the corresponding device under test with a test signal corresponding to the output logic data of the programmable device, and a judging section that judges pass/fail of each device under test, based on operation results of each device under test according to the test signal.
    • 测试在被测晶片上形成的多个待测器件的测试装置包括面向被测晶片并与被测器件电连接的测试基板,设置在测试基板上的可编程器件, 输出逻辑数据相对于输入逻辑数据的逻辑关系,根据提供给其的程序数据,多个输入/输出电路,设置在测试基板上以对应于被测器件,并且每个输入/输出电路提供相应的被测器件 具有与可编程装置的输出逻辑数据相对应的测试信号,以及判定部,根据测试信号,根据被测设备的运算结果,判定各被测设备的通过/失败。