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1. 发明授权

US09215089B2 Touch sensor system 有权
标题翻译：触摸传感器系统
公开(公告)号：US09215089B2
公开(公告)日：2015-12-15
申请号：US13502078
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G06F13/00 , H04L12/40 , G01L1/14 , G01L5/22 , G06F13/376
CPC分类号： H04L12/40032 , G01L1/142 , G01L1/146 , G01L5/228 , G06F13/376 , H04L12/40013
摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
摘要翻译：触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据发送单元，其将传感器数据信号输出到总线的信号线。快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

2. 发明授权

US08823114B2 Sensor device having electrode draw-out portions through side of substrate 有权
标题翻译：传感器装置具有通过衬底侧的电极引出部分
公开(公告)号：US08823114B2
公开(公告)日：2014-09-02
申请号：US13502083
申请日：2010-10-13
申请人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： H01L29/84 , H01L23/48 , G01L5/22 , G01L1/14 , B81C1/00 , H01L23/00 , H01L23/10
CPC分类号： B81C1/00238 , B81B2201/0264 , B81B2207/012 , B81C2201/019 , B81C2203/032 , B81C2203/0792 , G01L1/146 , G01L1/148 , G01L5/228 , H01L23/10 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/94 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/3512 , H01L2924/00
摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
摘要翻译：提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。传感器结构具有接触感应表面和传感器电极。信号处理集成电路嵌入在半导体衬底中。传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

3. 发明授权

US08613231B2 Sheet-like tactile sensor system 有权
标题翻译：片状触觉传感器系统
公开(公告)号：US08613231B2
公开(公告)日：2013-12-24
申请号：US13502082
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
IPC分类号： G01D7/00 , G01L3/00 , G01L3/22
CPC分类号： G01L5/228 , G01L1/142 , G01L1/144 , G01L1/146 , G06F3/0414
摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
摘要翻译：提供能够检测法向应力的多个法向应力检测传感器单元和片层部。片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置，检测片部分。

4. 发明授权

US08336399B2 Sensor system 有权
标题翻译：传感器系统
公开(公告)号：US08336399B2
公开(公告)日：2012-12-25
申请号：US12903673
申请日：2010-10-13
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G01D7/00
CPC分类号： B25J13/084 , G01L1/146 , G01L5/228 , H01L24/32 , H01L2224/32221 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
摘要翻译：传感器系统包括第一感测装置，其包括传感器，以及至少部分围绕传感器的第一和第二环绕部分，包括传感器的第二感测装置，以及至少部分围绕传感器的第一和第二环绕部分，其中相应的第一和第二感测装置的第一和第二围绕部分的形状的组合中的至少一个以及相应的第一和第二感测装置的第一和第二包围部分的物理特性的组合被构造成使得第一感测装置的检测特性与第二感测装置的检测特性不同。

5. 发明申请

US20120254490A1 TOUCH SENSOR SYSTEM 有权
标题翻译：触摸传感器系统
公开(公告)号：US20120254490A1
公开(公告)日：2012-10-04
申请号：US13502078
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： G06F13/00
CPC分类号： H04L12/40032 , G01L1/142 , G01L1/146 , G01L5/228 , G06F13/376 , H04L12/40013
摘要： A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
摘要翻译：触摸传感器系统包括总线，布置在总线上的多个触摸传感器装置，以及连接到所有总线并且集成来自触摸传感器装置的信息的信息集成装置。触摸传感器装置包括传感器单元和信号处理单元，该单元通过总线将通过处理模拟传感器信号而产生的传感器数据信号发送到信息集成装置。信号处理单元包括：数字转换单元，当传感器值超过预设阈值时给出信号处理开始许可的阈值评估单元;将传感器信号加上发射机标识号的ID添加单元，以及数据发送单元，其将传感器数据信号输出到总线的信号线。快速响应是可能的，而不增加数据量和主机处理负载，同时包括许多触摸传感器元件。

6. 发明申请

US20120247226A1 SHEET-LIKE TACTILE SENSOR SYSTEM 有权
标题翻译：类似战术传感器系统
公开(公告)号：US20120247226A1
公开(公告)日：2012-10-04
申请号：US13502082
申请日：2009-10-14
申请人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
发明人： Masanori Muroyama , Masayoshi Esashi , Shuji Tanaka , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Hitoshi Yamada , Ui Yamaguchi
IPC分类号： G01L1/00
CPC分类号： G01L5/228 , G01L1/142 , G01L1/144 , G01L1/146 , G06F3/0414
摘要： Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
摘要翻译：提供能够检测法向应力的多个法向应力检测传感器单元和片层部。片层部分包括外部片层部分，包含法向应力检测单元的力检测片层部分和夹在外片层部分和力检测片层部分之间的中间层。外层片部分和力检测片层部分包括在彼此相对的方向上突出的多个突起，并且被布置成使得突起彼此接合，并且介于其间的中间层。每个法向应力检测传感器单元包括设置在力检测片部分上的突起的中心部分正下方的中心部分检测传感器装置，以及至少两个边缘检测传感器装置，检测片部分。

7. 发明申请

US20120199921A1 SENSOR DEVICE AND METHOD FOR PRODUCING SENSOR DEVICE 有权
标题翻译：传感器装置及其制造方法
公开(公告)号：US20120199921A1
公开(公告)日：2012-08-09
申请号：US13502083
申请日：2010-10-13
申请人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
发明人： Shuji Tanaka , Masayoshi Esashi , Masanori Muroyama , Sakae Matsuzaki , Mitsutoshi Makihata , Yutaka Nonomura , Motohiro Fujiyoshi , Takahiro Nakayama , Ui Yamaguchi , Hitoshi Yamada
IPC分类号： H01L29/84 , H01L21/50
CPC分类号： B81C1/00238 , B81B2201/0264 , B81B2207/012 , B81C2201/019 , B81C2203/032 , B81C2203/0792 , G01L1/146 , G01L1/148 , G01L5/228 , H01L23/10 , H01L24/04 , H01L24/29 , H01L24/32 , H01L24/82 , H01L24/94 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , H01L2924/3512 , H01L2924/00
摘要： Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
摘要翻译：提供了一种用于封装具有接触感测表面的传感器结构和处理传感器信号的信号处理LSI的技术。传感器结构具有接触感应表面和传感器电极。信号处理集成电路嵌入在半导体衬底中。传感器结构和半导体衬底通过接合层粘接，形成传感器装置作为单个芯片。传感器电极和集成电路密封在传感器装置的内部，并且集成电路的传感器电极和外部端子通过半导体衬底的侧表面被引出到半导体衬底的背面。

8. 发明申请

US20120217638A1 WIRING CONNECTION METHOD AND FUNCTIONAL DEVICE 有权
标题翻译：接线方法和功能设备
公开(公告)号：US20120217638A1
公开(公告)日：2012-08-30
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L21/762
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

9. 发明授权

US08796850B2 Wiring connection method and functional device 有权
标题翻译：接线方式及功能设备
公开(公告)号：US08796850B2
公开(公告)日：2014-08-05
申请号：US13393577
申请日：2010-09-01
申请人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
发明人： Shuji Tanaka , Masayoshi Esashi , Sakae Matsuzaki , Mamoru Mori
IPC分类号： H01L23/48 , H01L23/00
CPC分类号： H01L24/16 , B81B2203/04 , B81C3/001 , B81C2203/031 , H01L24/81 , H01L2224/16225 , H01L2224/16227 , H01L2224/16503 , H01L2224/81192 , H01L2224/8181 , H01L2224/81893 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1461 , H01L2924/15788 , H01R43/0214 , H01L2224/81 , H01L2924/00
摘要： By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
摘要翻译：通过在第一基板10的连接电极12和第二基板15的连接电极17中的至少一个上形成金属层14，将第一基板10和第二基板15放置在一起，以使连接电极12和连接电极17通过金属层14彼此面对，提高温度直到阳极接合温度，并且在保持该温度的同时在第一基板10和第二基板15之间施加直流电压，第一基板10和第二基板 15被阳极结合，同时通过熔化金属层14，连接电极12和连接电极17电连接。该方法以高产率实现了基板的阳极接合，同时建立了线路连接，对包装有效。

10. 发明申请

US20060202769A1 Piezoelectric thin film device and method of producing the same 审中-公开
标题翻译：压电薄膜器件及其制造方法
公开(公告)号：US20060202769A1
公开(公告)日：2006-09-14
申请号：US10551680
申请日：2004-03-30
申请人： Keigo Nagao , Kosuke Nishimura , Tetsuo Yamada , Osamu Otani , Sakae Matsuzaki
发明人： Keigo Nagao , Kosuke Nishimura , Tetsuo Yamada , Osamu Otani , Sakae Matsuzaki
IPC分类号： H03B5/34
CPC分类号： H03H9/174 , H03H3/02 , H03H9/0523 , H03H9/1014 , H03H9/564 , H03H9/568
摘要： A piezoelectric thin film device (10) comprising a substrate (12) having a vibration space (20), and a piezoelectric lamination structure (14) formed on the upper surface of the substrate, the piezoelectric lamination structure comprising a piezoelectric film (16) and a lower electrode (15) and upper electrode (17) which are formed on opposite surfaces thereof, respectively, the vibration space (20) being so formed as to allow the vibration of a vibrating section (23) constituted by including at least part of the piezoelectric lamination structure (14) and part of an insulating layer (13). The vibrating space (20) is composed of a first via hole (21) formed from the lower surface of the substrate (12) toward the upper surface thereof so as to form an intermediate surface (25) in the substrate, and a second via hole (22) formed from the intermediate surface (23) toward the upper surface of the substrate so as to be positioned inside the first via hole (21) as seen vertically.
摘要翻译：一种压电薄膜器件（10），包括具有振动空间（20）的衬底（12）和形成在所述衬底的上表面上的压电层压结构（14），所述压电层压结构包括压电薄膜（16）以及分别形成在其相对表面上的下电极（15）和上电极（17），所述振动空间（20）形成为允许振动部分（23）的振动，所述振动部分（23）包括至少部分的压电层压结构（14）和绝缘层（13）的一部分。所述振动空间（20）由从所述基板（12）的下表面向其上表面形成的第一通孔（21）构成，以在所述基板上形成中间面（25），所述第二通孔从中间表面（23）形成的孔（22）朝向基板的上表面，以便位于第一通孔（21）的内部。

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