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    • 10. 发明申请
    • Method and Composition for Improving Adhesion of Organic Polymer Coatings with Copper Surface
    • 提高铜表面有机聚合物涂层粘合性的方法和组合
    • US20080187672A1
    • 2008-08-07
    • US11914472
    • 2006-05-15
    • Zhigang Yu
    • Zhigang Yu
    • B05D7/14C08K3/30
    • H05K3/383C23C22/63C23F1/34H05K2203/0793H05K2203/0796
    • The present invention provides an aqueous solution composition for treating copper surface to improve adhesion of organic polymer with copper surface, characterized in that, said aqueous solution composition comprises water-soluble persulfate and the pH of said composition is from 11-14. The present invention further provides a method for improving the adhesion of organic polymer with copper surface by treating said copper surface and a method for preparing an article having a copper surface which is coated with organic polymer coating. The present composition and method are applicable to the adhesion of any polymer coatings, especially, epoxy, phenolic aldehyde, melamine and polyurea resin on copper surface.
    • 本发明提供了一种用于处理铜表面以提高有机聚合物与铜表面的粘附性的水溶液组合物,其特征在于,所述水溶液组合物包含水溶性过硫酸盐,所述组合物的pH为11-14。 本发明还提供了一种通过处理所述铜表面来改善有机聚合物与铜表面的粘合力的方法,以及一种制备具有涂覆有机聚合物涂层的铜表面的制品的方法。 本发明的组合物和方法适用于铜表面上任何聚合物涂层,特别是环氧树脂,酚醛树脂,三聚氰胺和聚脲树脂的粘合。