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1. 发明申请

US20060193118A1 Device, apparatus, method and assembly for coupling an electrical component with a circuit board 有权
标题翻译：用于将电气部件与电路板耦合的装置，装置，方法和组件
公开(公告)号：US20060193118A1
公开(公告)日：2006-08-31
申请号：US11066877
申请日：2005-02-25
申请人： Mudasir Ahmad , Mason Hu , Robert Pattison , David Popovich
发明人： Mudasir Ahmad , Mason Hu , Robert Pattison , David Popovich
IPC分类号： H05K7/08
CPC分类号： H05K3/308 , H01R12/523 , H01R13/187 , H05K2201/1059 , H05K2201/10916
摘要： A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability and reworkability while minimizing wear and the possibility of resizing and damage. The device includes a sleeve for coupling with a component pin, which encloses the pin and further couples to a conductive barrel interconnecting multiple PCB layers. The sleeve conforms upon insertion within the barrel to its contour. A flange at an end of the sleeve deters over-insertion. The coupling so formed can be gas-tight.
摘要翻译：描述了一种用于可拆卸地将电气部件与PCB连接的装置，装置和印刷电路板组件，其提供足够的机电能力，对相关加热，部件可移除性，可替换性和可再加工性相对不敏感，同时最小化磨损和调整尺寸和损坏的可能性。该装置包括用于与部件销耦合的套筒，其包围销并进一步耦合到互连多个PCB层的导电筒体。套筒在筒体内插入其轮廓。套筒末端的凸缘阻止过度插入。这样形成的联轴器可以是气密的。

2. 发明授权

US07277297B2 Device, apparatus, method and assembly for coupling an electrical component with a circuit board 有权
标题翻译：用于将电气部件与电路板耦合的装置，装置，方法和组件
公开(公告)号：US07277297B2
公开(公告)日：2007-10-02
申请号：US11066877
申请日：2005-02-25
申请人： Mudasir Ahmad , Mason Hu , Robert Pattison , David Anthony Popovich
发明人： Mudasir Ahmad , Mason Hu , Robert Pattison , David Anthony Popovich
IPC分类号： H05K7/00
CPC分类号： H05K3/308 , H01R12/523 , H01R13/187 , H05K2201/1059 , H05K2201/10916
摘要： A device, apparatus and printed circuit board assembly for removably coupling an electrical component with a PCB are described, which provides adequate electromechanical capability, is relatively insensitive to related heating, component removability, replacability and reworkability while minimizing wear and the possibility of resizing and damage. The device includes a sleeve for coupling with a component pin, which encloses the pin and further couples to a conductive barrel interconnecting multiple PCB layers. The sleeve conforms upon insertion within the barrel to its contour. A flange at an end of the sleeve deters over-insertion. The coupling so formed can be gas-tight.
摘要翻译：描述了一种用于可拆卸地将电气部件与PCB连接的装置，装置和印刷电路板组件，其提供足够的机电能力，对相关加热，部件可移除性，可替换性和可再加工性相对不敏感，同时最小化磨损和调整尺寸和损坏的可能性。该装置包括用于与部件销耦合的套筒，其包围销并进一步耦合到互连多个PCB层的导电筒体。套筒在筒体内插入其轮廓。套筒末端的凸缘阻止过度插入。这样形成的联轴器可以是气密的。

3. 发明授权

US07604491B1 Techniques for providing electrical and thermal conductivity between electrical components and printed circuit boards using sleeves defining substantially conical shapes 有权
标题翻译：使用限定基本上圆锥形的套筒在电气部件和印刷电路板之间提供导电和导热性的技术
公开(公告)号：US07604491B1
公开(公告)日：2009-10-20
申请号：US12107334
申请日：2008-04-22
申请人： Mudasir Ahmad , David Popovich
发明人： Mudasir Ahmad , David Popovich
IPC分类号： H01R12/00
CPC分类号： H05K3/308 , H05K2201/10401 , H05K2201/1059 , H05K2201/10962
摘要： An apparatus includes a printed circuit board having a set of layers and a set of barrels embedded within the set of layers. The apparatus further includes an electrical component having a component body and a set of pins which extends from the component body. The apparatus further includes a set of sleeves. Each sleeve defines a substantially conical shape. The set of sleeves provides electrical and thermal conductivity between the set of pins of the electrical component and the set of barrels of the printed circuit board.
摘要翻译：一种装置包括印刷电路板，该印刷电路板具有一组层和一组嵌入层内的一组桶。该装置还包括具有组件主体和从组件主体延伸的一组销的电气部件。该装置还包括一套套筒。每个套筒限定了大致圆锥形的形状。这套套筒在电气部件的一组销和印刷电路板的一组套筒之间提供电和导热性。

4. 发明申请

US20120074557A1 Integrated Circuit Package Lid Configured For Package Coplanarity 有权
标题翻译：集成电路封装盖配置为封装共面性
公开(公告)号：US20120074557A1
公开(公告)日：2012-03-29
申请号：US12891088
申请日：2010-09-27
申请人： Mudasir Ahmad , Mohan R. Nagar , Weidong Xie
发明人： Mudasir Ahmad , Mohan R. Nagar , Weidong Xie
IPC分类号： H01L23/48 , H01L21/02
CPC分类号： H01L23/3675 , H01L23/49816 , H01L2924/15311 , Y10T428/24066 , Y10T428/24198
摘要： An integrated circuit package apparatus comprises a packaging substrate, an integrated circuit coupled to an upper side of the packaging substrate, an array of contacts coupled to an underside of the packaging substrate for electrically coupling the integrated circuit to a circuit board, and a lid coupled to the upper side of the packaging substrate. In one form, the lid includes a central portion lying on a first plane, corner areas lying on a second plane, and arcuate wall portions disposed between and interconnecting the corner areas and the central portion. Other forms of the lid are provided.
摘要翻译：集成电路封装装置包括封装基板，耦合到封装基板的上侧的集成电路，耦合到封装基板的下侧的触点阵列，用于将集成电路电耦合到电路板，以及盖耦合到包装基板的上侧。在一种形式中，盖包括位于第一平面上的中心部分，位于第二平面上的拐角区域以及设置在拐角区域和中心部分之间并将其相互连接的弓形壁部分。提供其他形式的盖子。

5. 发明申请

US20090310318A1 ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS 审中-公开
标题翻译：在基于LEED的组装条件下将无铅元件连接到印刷电路板
公开(公告)号：US20090310318A1
公开(公告)日：2009-12-17
申请号：US12139783
申请日：2008-06-16
申请人： Mudasir Ahmad
发明人： Mudasir Ahmad
IPC分类号： H05K7/00 , B23K31/02 , B23P19/00
CPC分类号： H05K7/1053 , B23K1/0016 , B23K35/025 , B23K35/268 , B23K2101/36 , B23K2101/42 , H05K3/3436 , H05K3/3463 , H05K3/3484 , H05K2201/10734 , H05K2201/10992 , Y02P70/613 , Y10T29/53174
摘要： A technique for attaching components to PCBs involves providing a lead-free component and a PCB. The lead-free component has a package and lead-free component contacts, and the PCB has PCB contacts. The technique further involves disposing (e.g., printing) solder paste between the lead-free component contacts of the lead-free component and the PCB contacts of the PCB. The solder paste includes lead (Pb), a second metal (e.g., tin (Sn) and a third metal (e.g., Bismusth (Bi)). The technique further involves applying heat to melt the solder paste and form solder joints between the package of the lead-free component and the PCB contacts of the PCB. Such a technique is capable of concurrently mounting lead-free components as well as lead-based components to a PCB under lead-based assembly conditions (e.g., a temperature environment which does not exceed 230 degrees Celsius).
摘要翻译：将组件连接到PCB的技术包括提供无铅元件和PCB。无铅元件具有封装和无铅元件触点，PCB具有PCB触点。该技术还涉及在无铅元件的无铅元件触点和PCB的PCB触点之间布置（例如印刷）焊膏。焊膏包括铅（Pb），第二金属（例如锡（Sn）和第三金属（例如Bismusth（Bi）），该技术还包括加热熔化焊膏并在封装之间形成焊点的无铅元件和PCB的PCB触点，这种技术能够在基于铅的组装条件（例如，温度环境）下同时将无铅元件以及基于铅的元件安装到PCB上不超过230摄氏度）。

6. 发明申请

US20130284796A1 SYSTEM IN PACKAGE MODULE ASSEMBLY 审中-公开
标题翻译：封装模块组件系统
公开(公告)号：US20130284796A1
公开(公告)日：2013-10-31
申请号：US13455908
申请日：2012-04-25
申请人： Mohan R. Nagar , Mudasir Ahmad
发明人： Mohan R. Nagar , Mudasir Ahmad
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K1/0016 , H01L23/16 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0655 , H01L25/16 , H01L2224/13111 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81001 , H01L2224/81136 , H01L2224/81191 , H01L2224/81203 , H01L2224/8121 , H01L2224/81815 , H01L2224/83001 , H01L2224/83855 , H01L2224/83862 , H01L2224/92125 , H01L2924/14 , H01L2924/1434 , H01L2924/15311 , H01L2924/19105 , H01L2924/3511 , H01L2924/00012 , H01L2924/00
摘要： In one implementation, a system in package assembly process includes attaching a cladding to a substrate to keep the substrate flat while components are soldered onto the substrate. The cladding may include a supporting member and a clamping member, and the substrate may be received between the clamping member and the supporting member. The clamping member may have a plurality of openings formed therein, and the components may be positioned on the substrate within at least one of the plurality of openings. A predetermined pressure may be applied to the clamping member and/or supporting to keep the substrate flat.
摘要翻译：在一个实施方案中，包装组装过程中的系统包括将包层附接到基底以在保持基底平坦的同时将部件焊接到基底上。包层可以包括支撑构件和夹紧构件，并且衬底可以被容纳在夹紧构件和支撑构件之间。夹紧构件可以具有形成在其中的多个开口，并且部件可以位于多个开口中的至少一个开口中的基板上。可以将预定的压力施加到夹持构件和/或支撑件以使基板保持平坦。

7. 发明授权

US07621190B2 Method and apparatus for strain monitoring of printed circuit board assemblies 有权
标题翻译：印刷电路板组件应变监测方法和装置
公开(公告)号：US07621190B2
公开(公告)日：2009-11-24
申请号：US11358271
申请日：2006-02-21
申请人： Mudasir Ahmad , Sue Teng
发明人： Mudasir Ahmad , Sue Teng
IPC分类号： G01L1/22
CPC分类号： G01R31/2817 , H05K1/0268 , H05K1/0271 , H05K2201/10151 , H05K2203/163
摘要： A technique of monitoring strain on a printed circuit board assembly involves the use of a strain detector mounted on a printed circuit board. The strain detector is formed of a non-ductile material. The strain detector has a narrowed portion forming a weak link that has a characteristic of breaking when a critical strain limit is exceeded. The method of monitoring can include visual or electrical inspection. The electrical inspection can include having a strain monitoring device. The strain monitoring device has a timer connected to at least one strain detector and a memory for storing results connected to the timer. The capacitance of at least one of the strain detectors is sampled and any change in capacitance is recorded to the memory. In one embodiment, a time stamp occurs in the memory based on when an electrical property changes across at least one of the strain detectors.
摘要翻译：监测印刷电路板组件上的应变的技术包括使用安装在印刷电路板上的应变检测器。应变检测器由非延性材料形成。应变检测器具有形成弱连接的变窄部分，当超过临界应变极限时具有断裂特性。监控方法可以包括视觉或电气检查。电气检查可以包括具有应变监测装置。应变监测装置具有连接到至少一个应变检测器的定时器和用于存储连接到定时器的结果的存储器。对应变检测器中的至少一个的电容进行采样，并将任何电容变化记录到存储器中。在一个实施例中，基于电特性在应变检测器中的至少一个上变化的时间戳发生在存储器中。

8. 发明申请

US20080130241A1 Method and apparatus for supporting a computer chip on a printed circuit board assembly 有权
标题翻译：用于在印刷电路板组件上支撑计算机芯片的方法和装置
公开(公告)号：US20080130241A1
公开(公告)日：2008-06-05
申请号：US11606750
申请日：2006-11-30
申请人： Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
发明人： Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
IPC分类号： H05K7/20 , H05K3/34
CPC分类号： H05K1/0271 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/181 , H05K3/305 , H05K2201/068 , H05K2201/09036 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , H01L2924/00 , H01L2224/0401
摘要： A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
摘要翻译：一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件的接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。

9. 发明授权

US06728104B1 Methods and apparatus for cooling a circuit board component 有权
标题翻译：冷却电路板部件的方法和装置
公开(公告)号：US06728104B1
公开(公告)日：2004-04-27
申请号：US10278264
申请日：2002-10-23
申请人： Mudasir Ahmad , Susheela Narasimhan
发明人： Mudasir Ahmad , Susheela Narasimhan
IPC分类号： H05K720
CPC分类号： H05K7/20563
摘要： The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for heat transfer from the circuit board component to the support member. The bend portion of the heat sink allows for displacement of the device portion relative to the support portion to limit the amount of stress generated by the heat sink on the circuit board component. The geometry of the heat sink further allows placement of the heat sink within the relatively narrow space conventionally formed between the circuit board and the support member.
摘要翻译：本发明的散热器包括将电路板部件热耦合到支撑部件的装置部分，弯曲部分和支撑部分，从而允许从电路板部件到支撑部件的热传递。散热器的弯曲部分允许器件部分相对于支撑部分的位移，以限制由电路板部件上的散热器产生的应力的量。散热器的几何形状还允许将散热器放置在通常形成在电路板和支撑构件之间的相对窄的空间内。

10. 发明授权

US08962388B2 Method and apparatus for supporting a computer chip on a printed circuit board assembly 有权
标题翻译：用于在印刷电路板组件上支撑计算机芯片的方法和装置
公开(公告)号：US08962388B2
公开(公告)日：2015-02-24
申请号：US13292630
申请日：2011-11-09
申请人： Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
发明人： Mohan R. Nagar , Kuo-Chuan Liu , Mudasir Ahmad , Bangalore J. Shanker , Jie Xue
IPC分类号： H05K7/06 , H05K3/30 , H01L21/56
CPC分类号： H05K1/0271 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H05K1/181 , H05K3/305 , H05K2201/068 , H05K2201/09036 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T29/49144 , H01L2924/00 , H01L2224/0401
摘要： A printed circuit board assembly and method of assembly in which underfill is placed between a chip and substrate to support the chip. A trench is formed in the upper layer of the printed circuit board to limit the flow of the underfill and in particular to limit the underfill from contact with adjacent components so that the underfill does not interfere with adjacent components on the printed circuit board assembly.
摘要翻译：一种印刷电路板组件和组装方法，其中将底部填充物放置在芯片和基板之间以支撑芯片。沟槽形成在印刷电路板的上层中以限制底部填充物的流动，特别是限制底部填充物与相邻部件接触，使得底部填充物不会干扰印刷电路板组件上的相邻部件。

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