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1. 发明申请

US20110311831A1 METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE 审中-公开
标题翻译：用于制造发光元件封装的基板和发光元件封装的方法
公开(公告)号：US20110311831A1
公开(公告)日：2011-12-22
申请号：US13131243
申请日：2008-11-25
申请人： Motohiro Suzuki , Naomi Yonemura , Yoshihiko Okajima , Tetsuro Maeda , Eiji Yoshimura
发明人： Motohiro Suzuki , Naomi Yonemura , Yoshihiko Okajima , Tetsuro Maeda , Eiji Yoshimura
IPC分类号： B32B15/08 , B32B37/12
CPC分类号： H05K1/0204 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/32188 , H01L2224/48091 , H01L2924/01004 , H01L2924/01012 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H05K1/0206 , H05K1/056 , H05K3/022 , H05K2201/0209 , H05K2201/09054 , H05K2201/09736 , H05K2201/10106 , H05K2203/1545 , Y10T428/31678 , H01L2924/00014
摘要： A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W/mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member.
摘要翻译：一种制造用于发光元件封装的基板的方法，所述发光元件封装设置有形成在发光元件的安装位置的厚金属部分，具有将由树脂构成的绝缘粘合剂层压并一体化的层压步骤并且具有1.0W / m·K以上的导热性和金属层部件，同时在拉出各部件的同时具有厚的金属部分的金属层部件。

2. 发明申请

US20110284914A1 METHOD FOR MANUFACTURING SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE 审中-公开
标题翻译：用于制造发光元件封装的基板和发光元件封装的方法
公开(公告)号：US20110284914A1
公开(公告)日：2011-11-24
申请号：US13131257
申请日：2008-11-25
申请人： Motohiro Suzuki , Naomi Yonemura , Yoshihiko Okajima , Tetsuro Maeda , Eiji Yoshimura
发明人： Motohiro Suzuki , Naomi Yonemura , Yoshihiko Okajima , Tetsuro Maeda , Eiji Yoshimura
IPC分类号： H01L33/64 , B32B37/02 , H05K1/11
CPC分类号： H05K1/0204 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H05K1/0206 , H05K1/0373 , H05K1/056 , H05K3/022 , H05K2201/0209 , H05K2201/0266 , H05K2201/09054 , H05K2201/09736 , H05K2201/10106 , H05K2203/1545 , H01L2924/00014
摘要： A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.
摘要翻译：一种用于发光元件封装的衬底，其具有形成在发光元件的安装位置的厚金属部分，包括：绝缘层，其由在所述发光元件的安装位置处的包含导热填料的树脂构成;以及热导率为1.0W / mK以上; 以及金属层，其设置在所述绝缘层的内部并且具有厚的金属部分，其中导热掩模部分设置在所述厚金属部分的顶部。

3. 发明申请

US20110272731A1 SUBSTRATE FOR LIGHT EMITTING ELEMENT PACKAGE, AND LIGHT EMITTING ELEMENT PACKAGE 审中-公开
标题翻译：用于发光元件包的基板和发光元件包
公开(公告)号：US20110272731A1
公开(公告)日：2011-11-10
申请号：US13127010
申请日：2008-10-31
申请人： Motohiro Suzuki , Naomi Yonemura , Tetsuro Maeda , Eiji Yoshimura
发明人： Motohiro Suzuki , Naomi Yonemura , Tetsuro Maeda , Eiji Yoshimura
IPC分类号： H01L33/62
CPC分类号： H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2924/01004 , H01L2924/01012 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014
摘要： This invention provides a substrate for a light emitting element package that can obtain a sufficient heat dissipation effect from a light emitting element and can also lower the costs and reduce the size as a substrate for packaging the light emitting element, as well as a light emitting element package using the same. The substrate for a light emitting element package includes an insulating layer 1 composed of a resin 1a containing heat conductive fillers 1b, 1c, a thick metal section 2 formed under a mounting position of a light emitting element 4, and a surface electrode section 3 formed on a mounting side of said insulating layer 1 separately from said thick metal section 2.
摘要翻译：本发明提供了一种用于发光元件封装的衬底，其可以从发光元件获得足够的散热效果，并且还可以降低成本并减小作为用于封装发光元件的衬底的尺寸，以及发光元素包使用相同。用于发光元件封装的衬底包括由包含导热填料1b，1c的树脂1a和在发光元件4的安装位置形成的厚金属部分2和形成的表面电极部分3的绝缘层1 在与所述厚金属部分2分开的绝缘层1的安装侧上。

4. 发明授权

US4876145A Plated resin article 失效
标题翻译：电镀树脂制品
公开(公告)号：US4876145A
公开(公告)日：1989-10-24
申请号：US71954
申请日：1987-07-10
申请人： Tetsuro Maeda , Fukuaki Wada , Susumu Ohoka , Akihiro Okamoto
发明人： Tetsuro Maeda , Fukuaki Wada , Susumu Ohoka , Akihiro Okamoto
IPC分类号： C08F279/04 , C23C18/20
CPC分类号： C08F279/04 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , H01H2219/03 , H01H2229/014 , Y10T428/254
摘要： A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.
摘要翻译：将连续树脂相中含有10〜24重量％的重量平均粒径为150μm以下且不含甲基丙烯酸甲酯的二烯系橡胶的成型品进行湿式电镀。所得到的电镀树脂制品具有优异的镀层附着力和良好的透明度。

5. 发明授权

US4476266A Thermoplastic resin compositions 失效
标题翻译：热塑性树脂组合物
公开(公告)号：US4476266A
公开(公告)日：1984-10-09
申请号：US440491
申请日：1982-11-10
申请人： Tetsuro Maeda , Susumu Ohoka , Masafumi Shingai , Haruo Igawa
发明人： Tetsuro Maeda , Susumu Ohoka , Masafumi Shingai , Haruo Igawa
IPC分类号： C08L31/00 , C08L7/00 , C08L21/00 , C08L23/00 , C08L23/02 , C08L31/02 , C08L31/04 , C08L33/00 , C08L33/04 , C08L51/00 , C08L51/02 , C08L51/04 , C08L55/00 , C08L101/00 , C08L55/02
CPC分类号： C08L23/025 , C08L31/02 , C08L51/04 , C08L2201/52
摘要： (1) A graft copolymer latex obtained by the copolymerization of a rubbery diene polymer latex with an aromatic vinyl monomer and an acrylic monomer is mixed with (2) a copolymer latex having a glass transition point of -40.degree. to 10.degree. C. and a volume-average particle size of at least 0.5.mu. obtained by the copolymerization of an olefin with a vinyl ester of a fatty acid while they are maintained in the form of latex to precipitate a solid resin, whereby a thermoplastic resin composition is obtained. The total solid resin contains at least 11 wt. % of the rubbery diene polymer and at least 1 wt. % of the copolymer of olefin/vinyl ester of fatty acid.
摘要翻译：（1）通过将橡胶二烯聚合物胶乳与芳族乙烯基单体和丙烯酸类单体共聚得到的接枝共聚物胶乳与（2）玻璃化转变点为-40〜10℃的共聚物胶乳混合，通过将烯烃与脂肪酸的乙烯基酯共聚而得到的体积平均粒径为0.5μm以上，同时将其保持为胶乳形式，使固体树脂沉淀，得到热塑性树脂组合物。总固体树脂含有至少11wt。％的橡胶二烯聚合物和至少1wt。％的脂肪酸的烯烃/乙烯基酯的共聚物。

6. 发明授权

US4461865A ABS Resin composition 失效
标题翻译： ABS树脂组合物
公开(公告)号：US4461865A
公开(公告)日：1984-07-24
申请号：US407893
申请日：1982-08-13
申请人： Tetsuro Maeda , Yasuo Yoshii , Akihiro Okamoto , Isamu Nishinakagawa
发明人： Tetsuro Maeda , Yasuo Yoshii , Akihiro Okamoto , Isamu Nishinakagawa
IPC分类号： C08L55/00 , C08K3/00 , C08K3/08 , C08L7/00 , C08L21/00 , C08L25/00 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L55/02
CPC分类号： C08K3/08 , C08L55/02 , Y10S524/919 , Y10T428/2991 , Y10T428/31696
摘要： An ABS resin composition comprises 100 parts by weight of an ABS resin having a melt index of at least 4.0 g/10 min. and a rubber content of from 10 to 28% by weight and from 0.5 to 30 parts by weight of powder of at least one metal selected from aluminum, copper and an copper alloy.
摘要翻译： ABS树脂组合物包含100重量份的熔体指数为至少4.0g / 10min的ABS树脂。橡胶含量为10〜28重量％，0.5〜30重量份的选自铝，铜和铜合金中的至少一种金属的粉末。

7. 发明授权

US06459699B1 ATM switching module which allows system growth with different type of module without cell-loss during cutover 失效
标题翻译： ATM交换模块，允许不同类型模块的系统增长，而在切换期间不会出现信元丢失
公开(公告)号：US06459699B1
公开(公告)日：2002-10-01
申请号：US09316114
申请日：1999-05-20
申请人： Toshiharu Kimura , Tetsuro Maeda
发明人： Toshiharu Kimura , Tetsuro Maeda
IPC分类号： H04L1256
CPC分类号： H04L49/506 , H04L49/1553 , H04L49/255 , H04L49/3009 , H04L49/3081 , H04L49/45 , H04L49/55 , H04L2012/5627 , Y10S370/905
摘要： In an ATM switching module, expansion interfaces are connected in pair to an ATM switch to respectively operate in active and standby states. When another ATM switching module is installed and a connection is established between an expansion interface of standby state and the newly installed ATM switching module, a process sets the standby state expansion interface in hot-standby state, and holds off incoming ATM cells destined for the hot-standby state expansion interface until the connection is ready to accept cell traffic, whereupon the hot-standby state expansion interface is switched to active state, whereby the ATM switch and an ATM switch of the another switching module constitute a multi-stage configuration. The processor is arranged to update the routing table according to internal state of the ATM switch so that, when a call is to be established for an incoming ATM cell, the header of the cell contains a plurality of fields containing routing data respectively associated with different stages of the multi-stage configuration.
摘要翻译：在ATM交换模块中，扩展接口成对连接到ATM交换机，以分别在主动和待机状态下工作。当安装另一个ATM交换模块并且在待机状态的扩展接口和新安装的ATM交换模块之间建立连接时，进程将待机状态扩展接口设置为热备用状态，并且保持目的地为热待机状态扩展接口，直到连接准备好接受小区流量，此时热待机状态扩展接口切换到活动状态，由此ATM交换机和另一交换模块的ATM交换机构成多级配置。处理器被安排为根据ATM交换机的内部状态来更新路由表，使得当要为入局ATM信元建立呼叫时，小区的报头包含多个字段，包含分别与不同的路由数据相关联的路由数据多级配置的阶段。

8. 发明授权

US5909976A Brush-equipped container for cyanoacrylate adhesive 失效
标题翻译：用于氰基丙烯酸酯粘合剂的刷装容器
公开(公告)号：US5909976A
公开(公告)日：1999-06-08
申请号：US14564
申请日：1998-01-28
申请人： Tetsuro Maeda
发明人： Tetsuro Maeda
IPC分类号： B65D81/24 , B32B1/02 , B32B27/32 , B65D23/02 , B65D51/32 , A46B11/00
CPC分类号： B65D51/32 , B65D23/02
摘要： A brush-equipped container for a cyanoacrylate adhesive, the container comprising: a container main body comprising a polyolefin resin; and a cap for capping the container main body, which has a brush member provided on the inner side of the cap so that the brush member is housed in the container main body, the brush member comprising a handle and bristles, wherein at least the container main body is coated with a gas-impermeable coating material which is insoluble in the cyanoacrylate and which has poor adhesion property with respect to the cyanoacrylate.
摘要翻译：一种用于氰基丙烯酸酯粘合剂的刷装容器，所述容器包括：包含聚烯烃树脂的容器主体; 以及用于盖住容器主体的盖，其具有设置在盖的内侧上的刷构件，使得刷构件容纳在容器主体中，刷构件包括手柄和刷毛，其中至少容器主体涂覆有不透气的涂料，其不溶于氰基丙烯酸酯，并且相对于氰基丙烯酸酯具有差的粘合性能。

9. 发明授权

US4774291A Polymer composition 失效
标题翻译：聚合物组成
公开(公告)号：US4774291A
公开(公告)日：1988-09-27
申请号：US943696
申请日：1986-12-19
申请人： Tetsuro Maeda
发明人： Tetsuro Maeda
IPC分类号： C08L25/04 , C08L25/08 , C08L25/12 , C08L33/08 , C08L25/06
CPC分类号： C08L25/08 , C08L25/12 , C08L33/08 , C08L2201/52 , C08L25/04
摘要： A polymer composition obtained by mixing, in an emulsion state,(A) from 20 to 90% by weight (as solid content of polymer) of an emulsion of polymer component (A) which is a polymer of a vinyl monomer and has a glass transition temperature of higher than 20.degree. C., a gel content of not higher than 10% and a solubility parameter of from 8.0 to 11.0 (cal/cc).sup.1/2 and which has a weight average molecular weight, based on polystyrene, of at least 1.5.times.10.sup.5, and(B) from 10 to 80% by weight (as solid content of polymer) of an emulsion of polymer component (B) which is a homopolymer of an acrylate monomer, a copolymer of acrylate monomers or a copolymer of an acrylate monomer with other copolymerizable monomer and has a glass transition temperature of not higher than 20.degree. C., a gel content of not higher than 70% and a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2,and separating the polymer from the emulsion mixture.
摘要翻译：通过以乳液状态混合（A）20重量％至90重量％（作为固体含量的聚合物）聚合物组分（A）的乳液，其是乙烯基单体的聚合物并具有玻璃转化温度高于20℃，凝胶含量不高于10％，溶解度参数为8.0至11.0（cal / cc）1/2，其重均分子量基于聚苯乙烯，为至少1.5×10 5，和（B）10〜80重量％（作为固体含量的聚合物）聚合物组分（B）的乳液，其是丙烯酸酯单体的均聚物，丙烯酸酯单体的共聚物或共聚物具有其它可共聚单体的丙烯酸酯单体，玻璃化转变温度不高于20℃，凝胶含量不高于70％，溶解度参数为8.4至9.8（cal / cc）1/2，以及从乳液混合物中分离聚合物。

10. 发明授权

US4965315A Thermoplastic resin composition 失效
标题翻译：热塑性树脂组合物
公开(公告)号：US4965315A
公开(公告)日：1990-10-23
申请号：US726362
申请日：1985-04-23
申请人： Tetsuro Maeda , Akihiro Okamoto
发明人： Tetsuro Maeda , Akihiro Okamoto
IPC分类号： C08L25/12 , C08C1/00 , C08C1/065 , C08F279/00 , C08F279/02 , C08F279/04 , C08L7/00 , C08L21/00 , C08L25/00 , C08L33/00 , C08L33/02 , C08L51/00 , C08L51/02 , C08L55/00 , C08L55/02
CPC分类号： C08F279/04
摘要： A thermoplastic resin composition composed of a mixture comprising a graft polymer obtained by subjecting a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer to emulsion polymerization in the presence of a diene rubber latex, and a hard polymer obtained by copolymerizing a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer, in which the number average particle size Dn of diene rubber particles contained in the composition is at most 0.1 .mu.m, the ratio (Dw/Dn) of the weight average particle size Dw to the number average particle size Dn of the diene rubber particles is at least 5.0, the graft rate of said graft polymer is at least 60%, and the content of an emulsifier and a reaction product of an emulsifier is not higher than 2% by weight.
摘要翻译：一种热塑性树脂组合物，其由包含通过使芳族乙烯基单体和乙烯基氰单体的单体混合物在二烯橡胶胶乳的存在下进行乳液聚合而获得的接枝聚合物的混合物和通过共聚单体混合物获得的硬聚合物的芳族乙烯基单体和乙烯基氰单体，其中组合物中所含的二烯橡胶颗粒的数均粒径Dn为0.1μm以下，重均粒径Dw与（Dw / Dn）二烯橡胶粒子的数均粒径Dn为5.0以上，接枝聚合物的接枝率为60％以上，乳化剂的含量和乳化剂的反应产物不高于2重量％。

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