会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Wiring pattern detection method and apparatus
    • 接线图案检测方法及装置
    • US5011960A
    • 1991-04-30
    • US349270
    • 1989-05-09
    • Moritoshi AndoHiroshi OkaSatoshi Iwata
    • Moritoshi AndoHiroshi OkaSatoshi Iwata
    • G01R31/308
    • G01R31/308
    • A method of detection of a wiring pattern using triangulation to detect a height thereof, comprising the steps of scanning a light beam from a light source, illuminating the wiring pattern to be detected by the scanned light beam, focusing the light reflected from the wiring pattern or a substrate, applying the focused light beam to a beam-splitter, and converting a wiring pattern configuration to a corresponding electric signal. Further, by blurring the focused light entering the beam-splitter, an expansion of a measurable height domain of the wiring pattern is possible. Furthermore, by applying a correction factor in response to the height of the substrate, the detected output of the wiring pattern height for a curved substrate can be sliced with a more appropriate slice level. Further, the beam-splitter comprises a reflection portion, a half reflection and half transmission portion, and a transmission portion. The width of the half reflection and half transmission portion is such that an upper and lower threshold value of the height of the wiring pattern can be determined, and thus the allowable limits of the wiring pattern height can be more accurately detected.
    • 10. 发明授权
    • Method and apparatus for visually examining an array of objects disposed
in a narrow gap
    • 用于目视检查设置在狭窄间隙中的物体阵列的方法和装置
    • US4686565A
    • 1987-08-11
    • US735744
    • 1985-05-20
    • Moritoshi Ando
    • Moritoshi Ando
    • G01B11/24G01N21/88G01N21/956G02B21/00H04N7/18
    • G01N21/95684G01N21/8803G02B21/0016
    • A method of and apparatus for visual inspection of the condition of soldered connections between connector pads of a wiring pattern provided on a circuit board and tips of conductor pins of an IC package mounted thereby on the circuit board. The back, or bottom surface of the circuit board is illuminated by a flood of light to produce diffused, or scattered, light in the gap between the circuit board and the IC package, which diffused light is emitted from the edge of the gap. The emitted light is deflected by a small prism disposed adjacent the edge of the gap into a focusing means, such as a stereoscopic microscope having a long focal distance and an optical axis oriented substantially perpendicularly to the surface of the circuit board. Images of the soldered connections are observeable through the eyepiece of the microscope, or are detected by a photoelectric transducer such as a video camera for display on a video screen.
    • 一种用于目视检查设置在电路板上的布线图形的连接器焊盘和由此安装在电路板上的IC封装的导体引脚的末端之间的焊接连接状况的方法和装置。 电路板的背面或底面由大量光照射,以在电路板和IC封装之间的间隙产生扩散或散射的光,该扩散光从间隙的边缘发射出来。 发射的光被邻近间隙边缘布置的小棱镜偏转成聚焦装置,例如具有长焦距的立体显微镜和基本上垂直于电路板表面定向的光轴。 焊接连接的图像可以通过显微镜的目镜观察到,或者由诸如摄像机的光电传感器检测以在视频屏幕上显示。