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    • 5. 发明授权
    • MIS transistor having a large driving current and method for producing the same
    • 具有大驱动电流的MIS晶体管及其制造方法
    • US06690047B2
    • 2004-02-10
    • US10132175
    • 2002-04-26
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • H01L2976
    • H01L21/28185H01L21/28194H01L21/28202H01L29/513H01L29/517H01L29/518H01L29/66545H01L29/66621H01L29/78
    • In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode. Thus, it is possible to achieve both of the reduction of the resistance of the S/D diffusion layers and the reduction of the gate parasitic capacitance.
    • 在MIS晶体管中,形成在半导体基板1上的源极/漏极区域(S / D扩散层)的上表面布置成比半导体衬底上的沟道平面更靠近栅电极,源极/漏极区域的顶表面 漏区比布置在沟道平面上侧的栅极绝缘膜与栅电极之间的界面更靠近沟道平面。 在该晶体管中,在半导体衬底的表面中选择性地形成沟槽,并且可以将沉积在沟槽中的多晶硅用作掩模,以形成用作源极/漏极区域的杂质扩散层,以层压并形成栅极绝缘膜 的高介电膜和栅电极。 或者,可以选择性地形成多晶硅以用作掩模以升高和形成杂质扩散层以层压并形成栅极绝缘膜和栅电极。 因此,可以实现S / D扩散层的电阻的降低和栅极寄生电容的降低。
    • 6. 发明授权
    • MIS transistor and method for producing same
    • MIS晶体管及其制造方法
    • US07303965B2
    • 2007-12-04
    • US09879208
    • 2001-06-13
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • H01L21/33H01L21/3205H01L31/00
    • H01L21/28185H01L21/28194H01L21/28202H01L29/513H01L29/517H01L29/518H01L29/66545H01L29/66621H01L29/78
    • In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode. Thus, it is possible to achieve both of the reduction of the resistance of the S/D diffusion layers and the reduction of the gate parasitic capacitance.
    • 在MIS晶体管中,形成在半导体基板1上的源极/漏极区域(S / D扩散层)的上表面布置成比半导体衬底上的沟道平面更靠近栅电极,源极/漏极区域的顶表面 漏区比布置在沟道平面上侧的栅极绝缘膜与栅电极之间的界面更靠近沟道平面。 在该晶体管中,在半导体衬底的表面中选择性地形成沟槽,并且可以将沉积在沟槽中的多晶硅用作掩模,以形成用作源极/漏极区域的杂质扩散层,以层压并形成栅极绝缘膜 的高介电膜和栅电极。 或者,可以选择性地形成多晶硅以用作掩模以升高和形成杂质扩散层以层压并形成栅极绝缘膜和栅电极。 因此,可以实现S / D扩散层的电阻的降低和栅极寄生电容的降低。
    • 8. 发明授权
    • MIS transistor having a large driving current and method for producing the same
    • 具有大驱动电流的MIS晶体管及其制造方法
    • US06278165B1
    • 2001-08-21
    • US09340149
    • 1999-06-28
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • Yukihito OowakiMizuki OnoMitsuhiro NoguchiDaisaburo TakashimaAkira Nishiyama
    • H01L2976
    • H01L21/28185H01L21/28194H01L21/28202H01L29/513H01L29/517H01L29/518H01L29/66545H01L29/66621H01L29/78
    • In a MIS transistor, the top surfaces of source/drain regions (S/D diffusion layers) formed on a semiconductor substrate 1 are arranged nearer to a gate electrode than a channel plane on the semiconductor substrate, and the top surfaces of the source/drain regions are arranged nearer than the channel plane than the interface between a gate insulator film provided on the upper side of the channel plane and the gate electrode. In this transistor, a groove is selectively formed in the surface of the semiconductor substrate, and a polycrystalline silicon deposited in the groove may be used as a mask to form impurity diffusion layers serving as source/drain regions to laminate and form a gate insulator film of a high dielectric film and a gate electrode. Alternatively, the polycrystalline silicon may be selectively formed to be used as a mask to elevate and form the impurity diffusion layer to laminate and form the gate insulator film and the gate electrode. Thus, it is possible to achieve both of the reduction of the resistance of the S/D diffusion layers and the reduction of the gate parasitic capacitance.
    • 在MIS晶体管中,形成在半导体基板1上的源极/漏极区域(S / D扩散层)的上表面布置成比半导体衬底上的沟道平面更靠近栅电极,源极/漏极区域的顶表面 漏区比布置在沟道平面上侧的栅极绝缘膜与栅电极之间的界面更靠近沟道平面。 在该晶体管中,在半导体衬底的表面中选择性地形成沟槽,并且可以将沉积在沟槽中的多晶硅用作掩模,以形成用作源极/漏极区域的杂质扩散层,以层压并形成栅极绝缘膜 的高介电膜和栅电极。 或者,可以选择性地形成多晶硅以用作掩模以升高和形成杂质扩散层以层压并形成栅极绝缘膜和栅电极。 因此,可以实现S / D扩散层的电阻的降低和栅极寄生电容的降低。
    • 10. 发明授权
    • Complementary field effect transistor and its manufacturing method
    • 互补场效应晶体管及其制造方法
    • US07087969B2
    • 2006-08-08
    • US10760501
    • 2004-01-21
    • Akira NishiyamaMizuki OnoMasato KoyamaTakamitsu Ishihara
    • Akira NishiyamaMizuki OnoMasato KoyamaTakamitsu Ishihara
    • H01L29/76H01L31/119
    • H01L21/28185H01L21/28202H01L21/823842H01L29/518
    • A complementary field effect transistor comprises: a semiconductor substrate; an n-type field effect transistor provided on the semiconductor substrate; and a p-type field effect transistor provided on the semiconductor substrate. The n-type field effect transistor has: a first gate insulating film containing an oxide including an element selected from the group consisting of group IV metals and Lanthanoid metals, and further containing a compound of the element and a group III element; a first gate electrode provided on the first gate insulating film; and n-type source and drain regions formed on both sides of the first gate electrode. The p-type field effect transistor has: a second gate insulating film containing an oxide including an element selected from the group consisting of group IV metals and Lanthanoid metals, and including substantially no positive charge; a second gate electrode provided on the second gate insulating film; and p-type source and drain regions provided on both sides of the second gate electrode.
    • 互补场效应晶体管包括:半导体衬底; 设置在半导体衬底上的n型场效应晶体管; 以及设置在半导体基板上的p型场效应晶体管。 n型场效应晶体管具有:包含含有选自IV族金属和镧系金属的元素的氧化物的第一栅极绝缘膜,并且还含有元素和III族元素的化合物; 设置在所述第一栅极绝缘膜上的第一栅电极; 以及形成在第一栅电极的两侧上的n型源区和漏区。 p型场效应晶体管具有:第二栅极绝缘膜,其含有包含选自第Ⅳ族金属和镧系金属的元素的氧化物,并且基本上不含正电荷; 设置在所述第二栅极绝缘膜上的第二栅电极; 以及设置在第二栅电极的两侧的p型源区和漏区。